• Journal of the Korea Society for Simulation
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• v.18 no.4
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• pp.59-66
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• 2009

This has been possible by integration techniques such as very large scale integration (VLSI) and wafer scale integration (WSI). Redundancy has been extensively used for manufacturing memory chips and to provide repair of these devices in the presence of faulty cells. If there are too many defects, the momory has to be rejected. But if there are a few defects, it will be more efficient and cost reducing for the company to use it by repairing. Therefore, laser-repair process is nedded for such a reason and redundancy analysis is needed to establish correct target of laser-repair process. The proposed CRA (Correlation Repair Algorithm) simulation, beyond the idea of the conventional redundancy analysis algorithm, aims at reducing the time spent in the process and strengthening cost competitiveness by performing redundancy analysis after simulating each case of defect.

• Proceedings of the Korea Concrete Institute Conference
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• 2005.11a
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• pp.343-346
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• 2005

This study makes the performance evaluation of water-jet chipping through analysis of ruggedness of chipping surface. The ruggedness is mapped by 3D Laser Scanner and the results are also compared with the chipping surface by mechanical chipping. And the details of in-situ works is investigated for increasing interface adhesion between existing concrete and repairing mortar. Water-jet has good operation efficiency which is up $60m^2$ per hour when the chipping depth is 7cm and also has a large ruggedness about 1.65.

• Proceedings of the Optical Society of Korea Conference
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• 2000.08a
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• pp.220-221
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• 2000

가공용 레이저로는 $CO_2$, 루비, Nd:YAG, 아르곤 이온 레이저 등이 이용되고 있으며, 이중 펄스형 Nd:YAG 레이저는 $CO_2$ 레이저와 함께 레이저 가공에 널리 사용되는 고체 레이저로서 마킹(making), 트리밍(trimming), 리페어링(repairing) 등의 정밀 가공 분야에서 많은 실용화가 이루어져 왔다.$^{(1)}$ $CO_2$ 레이저의 경우 매질가스로 $CO_2$, $N_2$, He 등을 사용해야하므로 취급 및 유지보수가 불편하지만, 열전도율이 높고, 기계적 광학적으로 안정된 Nd:YAG 레이저는 램프에 의한 광 여기 방식이므로 유지보수가 쉽다. 또한 광 출력의 제어가 용이하며, 광파이버에 의한 빔 전송이 가능하여 산업기술 및 의료 분야에서의 적용이 더욱 더 확대되고 있다.$^{(2)}$ (중략)

• Tribology and Lubricants
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• v.38 no.3
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• pp.93-100
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• 2022

Micro-light emitting diode (micro-LED) displays offer numerous advantages such as high brightness, fast response, and low power consumption. Hence, they are spotlighted as the next-generation display. However, defective LEDs may be created due to non-uniform contact loads or LED alignment errors. Therefore, a repair process involving the replacement of defective LEDs with favorable ones is necessitated. The general repair process involves the removal of defective micro-LEDs, interconnection material transfer, as well as new micro-LED transfer and bonding. However, micro-LEDs are difficult to repair since their size decreases to a few tens of micron in width and less than 10 ㎛ in thickness. The conventional nozzle-type dispenser for fluxes and the conventional vacuum chuck for LEDs are not applicable to the micro-LED repair process. In this study, transfer conditions are determined using a micro stamp for repairing micro-LEDs. Results show that the aging time should be set to within 60 min, based on measuring the aging time of the flux. Additionally, the micro-LEDs are subjected to a compression test, and the result shows that they should be transferred under 18.4 MPa. Finally, the I-V curves of micro-LEDs processed by the laser and hot plate reflows are measured to compare the electrical properties of the micro-LEDs based on the reflow methods. It was confirmed that the micro-LEDs processed by the laser reflow show similar electrical performance with that processed by the hot plate reflow. The results can provide guidance for the repair of micro-LEDs using micro stamps.

• Clean Technology
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• v.22 no.4
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• pp.232-240
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• 2016

Recently, various research studies have been conducted and many are in progress for the suitable alternative materials for ITO based touch screen panel (TSP) due to limitations in size and flexibility. Various researches from all over the world have been attempted to fabricate the fine electrode less than $5{\mu}m$ for the rapid developing of display technology. Research is also being carried out in metal mesh methods using the existing technologies and alternative materials at commercial level. However, by using the existing technologies certain discrepancies are observed like low transparency and low yield which also results in the distortion of patterns. For repairing the damaged pattern, the conventional laser CVD technique has also been used but there are some challenges observed in CVD technique like achieving a stable fine electrode of $10{\mu}m$ or less and avoiding the formation of satellite drops. To overcome these issues, a new printing process named Electrohydrodynamic (EHD) printing, has been introduced by which $5{\mu}m$ fine patterns can be printed in one step. This EHDA printing technique has been applied to print very fine electrodes of $5{\mu}m$ or less by using conductive inks of various viscosities. This study also presents the optimized process parameters for printing $5{\mu}m$ fine electrode patterns during experiments by controlling the applied voltage and supply flow rate. The $5{\mu}m$ repair electrodes were fabricated for repairing $50{\mu}m$ shorted electrode samples.