• Journal of the Korean Society for Precision Engineering
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• v.27 no.2
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• pp.7-12
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• 2010

Due to the extremely short interaction time (< $10\times10^{-12}$sec) between laser pulse and material, which enables the minimization of heat affection, ultrafast laser micro-machining has rapidly widened its applications. In this paper, the characteristics of ultrafast laser micro-machining have been reviewed and experimentally demonstrated in laser drilling of silicon wafer and in laser cutting of rigid PCB.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.11 no.1
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• pp.33-38
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• 2012

An experimental study was carried out to observe the characteristics of impingement of assist gas from a rectangular supersonic nozzle on kerf surface in laser machining. A micro-scale supersonic (Mach number 2.0) rectangular nozzle system was designed and fabricated for the purposes, and hot tests of the performance of the nozzle system was proceeded in the ITI corporation laboratory. For various related parameters such as laser powers, nozzle pressures and cutting speeds, the quality of the frontal view of cut edge surfaces was observed by a microscope. In the study, it was shown that the application of the present micro-rectangular supersonic nozzle in an off-axis configuration made it possible to cut a mild steel, by combinations of relatively low laser - powers, large standoff distances, and assist gas with no oxygen, which was not achieved by conventional laser cutting processes.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2006.10a
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• pp.517-518
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• 2006

• Journal of the Semiconductor & Display Technology
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• v.5 no.3 s.16
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• pp.5-10
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• 2006

This paper investigates cutting qualities after laser dicing and predicts the problems that can be generated by laser dicing. And through 3 point bending test, die strength is measured and the die strength after laser dicing is compared with the die strength after mechanical sawing. Laser dicing is chiefly considered as an alternative to overcome the defects of mechanical sawing such as chipping on the surface and crack on the back side. Laser micromachining is based on the thermal ablation and evaporation mechanism. As a result of laser dicing experiments, debris on the surface of wafer is observed. To eliminate the debris and protect the surface, an experiment is done using a water soluble coating material and ultrasonic. The consequence is that most of debris is removed. But there are some residues around the cutting line. Unlike mechanical sawing, chipping on the surface and crack on the back side is not observed. The cross section of cutting line by laser dicing is rough as compared with that by mechanical sawing. But micro crack can not be seen. Micro crack reduces die strength. To measure this, 3 point bending test is done. The die strength after laser dicing decreases to a half of the die strength after mechanical sawing. This means that die cracking during package assembly can occur.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2001.04a
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• pp.934-937
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• 2001

It is well-known that the micro fabrication technology of micro parts are the high energy beam or silicon-based micro machining method such as LIGA Process, Laser machining, photolithography and etching technology. But, for fabricating complex 3-D structure it is better to use mechanical machining. This machining method by the mechanical machine tool with nanometer accuracy is getting attention in some field-especially micro optics machining such as grating, holographic lens, micro lens array, fresnel lens, encoder disk etc.. In this study, we survey the micro fabrication by mechanical cutting method and set up the mechanical micro machining system. And we carried out micro cutting experiments for micro parts with v-shape groove.

• Journal of the Semiconductor & Display Technology
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• v.16 no.3
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• pp.36-40
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• 2017

In this paper, a new method of laser trimming of thick film heater is studied. Various laser waves (IR, Green, UV) are used to ablation the heater and the process parameters are also presented. For given initial printed resisters, the cutting length should be prepared to obtain the target resister value in advance. Therefore, the cutting model is very important. The well-known model was tested and proven that it is valid only within a certain range of cutting length. A new model is proposed for a wide range of resister laser trimming. The cutting lengths and resister variation was obtained and formulated. To verify the presented method, the cutting lengths of each resister are calculated for various target resister value and laser trimming using UV is conducted.

• Journal of the Korean Society for Precision Engineering
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• v.30 no.4
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• pp.403-408
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• 2013

In this paper, the characteristics of ablation processing of the eagle glass by pico-second laser are investigated. The laser ablation is used to process micro forms on materials. The ablation causes little thermal effect and little burr on the surface of eagle glass. In order to examine the characteristics of panic cracks, experiments are conducted under various cutting conditions such as a frequency of 600 kHz, laser powers, scan speeds and number of scan(NS). To minimize the panic cracks, the specimens are heated at $30^{\circ}C$, $45^{\circ}C$, and $60^{\circ}C$ for ten minutes respectively and then they are broken by hands. Laser powers, NS and scan speeds have an effect on glass cutting results. The ablation depths increase with an increase in the laser power and NS whereas the panic cracks decrease with an increase in scan speed. The high temperature on processed specimens reduces the panic cracks and makes good results of laser cutting. The optimal condition for eagle glass laser cutting is found to be at 30 W of laser power, 3 mm/s of scan speed and 500 of NS, respectively.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2005.10a
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• pp.873-877
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• 2005

The burr of micro drilling and micro cutting on thin metal film is a major obstacle to mass production for micro PCB boards in micro technologies of personal computing and telecom explosion. As the burr affects on the assembling process, it is necessary to study continuously on control or elimination of the burr. In order to get higher valued products, it is also needed to competitive techniques with the high resolution. In this paper, we studied experimentally the burr generation that when it is processed on the copper foil by laser in micro-hole machining. Unlike mechanical machining the burr produced on substrate is a resultants of melt and re-solidification of a melten metal which was heated and treated by laser. And higher laser energy increases the size of burr. Therefor in micro-drilling with laser, it is difficult to reduce the effects of burr for very thin metal sheets. We investigated the stale of the burr and analyzed the laser ablation Cu micro machining with respect to laser intensity and processing time.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.9 no.3
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• pp.56-61
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• 2010

Recently, UV pulse laser is widely used in micro machining of the research, development and industry field of IT, NT and BT products because the laser short wavelength provides not only micro drilling, micro cutting and micro grooving which has a very fine line width, but also high absorption coefficient which allows a lot of type of materials to be machined more easily. To analyze the dynamic deformation during a very short processing time, which is nearly about several tens nanoseconds, the commercial Finite Element Analysis (FEA) code, LS-DYNA 3D, was employed for the computitional simulation of the UV laser micro machining behavior for thin copper material in this paper. A finite element model considering high strain rate effect is especially suggested to investigate the micro phenomena which are only dominated by mechanically pressure impact in disregard of thermally heat transfer. From these computational results, some of dynamic deformation behaviors such as dent deformation shapes, strains and stresses distributions were observed and compared with previous experimental works. These will help us to understand micro interaction between UV laser beam and material.

• International Journal of Precision Engineering and Manufacturing-Green Technology
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• v.5 no.5
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• pp.583-591
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• 2018

Tool-chip adhesion impacts on cutting performance significantly, especially in finish cutting process. To promote cutting tools' anti-adhesion property, the concave micro-grooves texture (MGT) and convex volcano-like texture (VLT) were fabricated separately on lathe tools' rake faces by laser surface texturing (LST). Various orientations of MGT and different area densities (9% and 48%) and regions (partial and full) of VLT were considered in textured patterns designing. The following orthogonal cutting experiments, machining of aluminum alloy 5038, analyzed tools' performances including cutting force, cutting stability, chip shape, rake face adhesion and abrasion. It indicated that under dry finish cutting conditions, MGT contributed to cutting stability and low cutting forces, meanwhile friction and normal force reduced by around 15% and 10%, respectively with a weak correlation to the grooves' orientation. High density VLT tools, on the other hand, presented an obvious anti-adhesion property. A $5{\mu}m$ reduction of crater wear's depth can be observed on textured rake faces after long length cutting and textured rake faces presented half size of BUE regions comparing to the flat tool, however, once the texture morphologies were filled or worn, the anti-adhesion effect could be invalid. The bearing ratio curve was employed to analysis tool-chip contact and durability of textured surfaces contributing to a better understanding of anti-adhesion and enhanced durability of the textured tools.