• Bulletin of the Korean Chemical Society
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• 제22권8호
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• pp.921-924
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• 2001

• 대한전기학회:학술대회논문집
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• 대한전기학회 2002년도 합동 추계학술대회 논문집 정보 및 제어부문
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• pp.75-78
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• 2002

SFFS(Solid Freeform Fabrication System) is commercializing to rapid prototyping concept in world-wide some corporations including the States, have much technological problems yet and need new mode for agile solid freeform fabrication as well as prototyping. In this paper, we design an automatic control algorithm that the cutting path of laser beam, on the SFFS, is controlled with constant speed. The designed algorithm for constant-speed path control is implemented and experimented in the $CAFL^{VM}$ (Computer Aided Fabrication of Lamination for Various Material) system, the new SFFS which is developed in this paper. Its process is an automated fabrication method in which a 3D object is constructed from STL(SToreoLithography) 2D data, derived from CAD 3D image, by sequentially laminating the part cross-sections. The constant-speed path control is started from the STL data. After STL file is modified in data format to be available for control. The fabrication of the 2D part is, with constant speed, conducted from the 23 position data by laser beam. we confirm its high-performance through experiment results from the application into $CAFL^{VM}$ system.

• 한국신재생에너지학회:학술대회논문집
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• 한국신재생에너지학회 2009년도 춘계학술대회 논문집
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• pp.143-146
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• 2009

One of the most important issues of crystalline silicon solar cell is minimizing reflectance at the surface. Laser texturing is an isotropic process that will sculpt the surface of a silicon wafer, regardless of its crystallographic orientation. We investigated surface texturing process using Nd-YAG laser ($\lambda$=1064 nm) on multi-crystalline silicon wafer. Removal of slag formed after the laser process was performed using acid solution (HF : $HNO_3$ : $CH_3COOH$ : DI water). The reflectance and carrier lifetime of the samples were measured and analyzed using UV-Vis spectrophotometer and carrier lifetime tester. It was found that the minimum reflectance of the samples was 16.39% and maximum carrier life time was $21.8\;{\mu}s$.

• 한국정밀공학회지
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• 제27권10호
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• pp.14-22
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• 2010

The most costly and time-consuming process in the fabrication of today's multi-layer circuit board is drilling interconnection holes between adjacent layers and via holes within a layer. Decreasing size of via holes being demanded and growing number of via holes per panel increase drilling costs. Component density and electronic functionality of today's multi-layer circuit boards can be improved with the introduction of cost-effective, variable depth laser drilled blind micro via holes, and interconnection holes. Laser technology is being quickly adopted into the circuit board industry but can be accelerated with the introduction of a true production laser drilling system. In order to get optimized condition for drilling to FPCB (Flexible Printed Circuit Board), we use various drill pattern as drill step. For productivity, we investigate drill path optimization method. And for the precise drilling the thermal drift of scanner and temperature change of scan system are tested.

• 구강회복응용과학지
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• 제32권3호
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• pp.246-254
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• 2016

Direct metal laser sintering (DMLS) 방식은 3D 프린팅 중 한 방식으로, 재료를 쌓아가면서 레이저를 이용하여 선택적으로 sintering하는 방식이다. 이는 주조 방식에서 문제되는 결손과 뒤틀림을 방지할 수 있으며 절삭 가공 방식으로 제작하기 어려운 복잡한 구조물을 제작할 수 있다. 본 증례들은 DMLS 방식을 이용하여 지대치 간 길이가 긴 고정성 보철물, 포스트 등 다양한 고정성 보철물을 제작하여 수복하였고, 주기적인 관찰 결과 심미적, 기능적으로 만족할만한 결과를 얻었기에 이를 보고하는 바이다.

• 한국광학회지
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• 제17권5호
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• pp.437-446
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• 2006

본 연구에서는 레이저유도 에칭기술을 이용한 스테인레스강의 고세장비 미세채널 제조에 대하여 기술한다. 공정 변수 최적화와 반복에칭을 통하여 높은 세장비를 갖는 미세채널을 제조하였으며 제조된 미세채널은 레이저출력과 에칭용액의 농도를 적절하게 조절함으로써 U 형상과 V 형상 사이의 단면 구조를 가지며 열변형이 없는 우수한 표면 형상을 보였다. 채널과 채널 사이의 간격은 $150{\mu}m$ 또는 그 이하이며 $15{\sim}50{\mu}m$ 범위의 폭을 갖는 10 이상의 고세장비 미세채널이 제조되었다. 레이저출력, 레이저초점의 이송속도, 에칭용액의 농도 등의 공정 변수들이 제조된 채널의 폭, 깊이 그리고 단면 형상에 미치는 영향에 대하여 자세히 보고한다.

• 대한전기학회:학술대회논문집
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• 대한전기학회 1995년도 하계학술대회 논문집 C
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• pp.1271-1274
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• 1995

In this paper, design feature and operation characteristics of compact Ruby laser for plasma diagonostics are described. A linear Xe flashlamp and a single elliptical cavity are adopted as optical pumping system. With charging energy of 484J, the maximum output energy of 170mJ, laser pulse width $110{\mu}s$, and slope efficiency 0.09% were obtained. If Q-switch system is added to this laser, we suppose this laser will be quite enough for diagonizing plasma.

• 한국정보디스플레이학회:학술대회논문집
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• 한국정보디스플레이학회 2007년도 7th International Meeting on Information Display 제7권2호
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• pp.1368-1371
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• 2007

Laser-ablated ITO patterns showed the formation of shoulders at the edge of the ITO lines and a ripple-like structure of the etched bottom. When the laser ablation was applied in the fabrication of PDP panel, the laser-ablated ITO patterns showed a higher sustaining voltage than that of chemically wet-etched ITO.

• 한국레이저가공학회지
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• 제6권3호
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• pp.19-28
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• 2003

The manufacturing process for the microfluidic device can include sequential steps such as master fabrication, electroforming, and injection molding. The laser ablation, using masks, has been applied to the fabrication of channels in microfluidic devices. In this research, an excimer laser was used to engrave microscopic channels on the surface of PET (polyethylene terephthalate), which shows a high absorption ratio for an excimer laser beam with a wavelength of 248 m. When 50-${\mu}{\textrm}{m}$-wide rectangular microscopic channels are ablated with a 500 ${\times}$ 500 ${\mu}{\textrm}{m}$ square mask at a magnification ratio of 1/10, ditch-shaped defects were found in both corners. The measurement of laser beam intensity showed that a coherent image in the PET target caused such defects. Analysis based on the Fourier diffraction theory enabled the prediction of the coherent shape at the image surface as well as the diffraction beam shape between the mask and the image surface. It also showed that the diameter of the aperture had a dominant effect. The application of aperture with a diameter of less than 3 mm helped to eliminate such defects in the ablated rectangular microscopic channels on PET without such ditch-shaped defects.

• 대한전자공학회:학술대회논문집
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• 대한전자공학회 2002년도 하계종합학술대회 논문집(5)
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• pp.91-94
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• 2002

SFFS(Solid Freeform Fabrication System) is commercializing to rapid prototyping concept in foreign some corporations including the U.S.A, have much technological problems yet and need new mode for agile prototyping. In this paper, we design algorithm that the cutting path of laser beam, on the SFFS(Solid Freeform Fabrication System), is controlled with constant speed. The designed algorithm for constant-speed path control is implemented and experimented in the CAFL$\^$VM/ (Computer Aided Fabrication of Lamination for Various Material) system, the new SFFS which was developed in this paper.