• 한국초전도학회:학술대회논문집
• /
• v.9
• /
• pp.147-151
• /
• 1999

YBCO step-edge Josephson junction were fabricated on sapphire substrates. The steps were formed on R-plane sapphire substrates by using Ar ion milling with PR masks. The step angle was controlled in the wide range from 25$^{\circ}$ to 50$^{\circ}$ by adjusting both the Ar ion incident angle and the photoresist mask rotation angle relative to the incident Ar ion beam. CeO$_2$ buffer layer and in-situ YBa$_2Cu_3O_{7-{\delta}}$ (YBCO) thin films was deposited on the stepped R-plane sapphire substrates by pulsed laser deposition method. The YBCO film thickness was varied to obtain the ratio of film thickness to step height in the range from 0.5 to 1. The step edge junction exhibited RSJ-like behaviors with I$_cR_n$ product of 100 ${\sim}$ 300 ${\mu}$V, critical current density of 10$^3$ ${\sim}$ 10$^5$ A/ cm$^2$ at 77 K.

• Journal of the Korean Magnetics Society
• /
• v.21 no.1
• /
• pp.32-36
• /
• 2011

We fabricated a sensor for measuring the water level and water temperature using GMR-SV (giant magnetoresistance-spin valve) device, simultaneously. It could be applied to the medical cooling system of the potassium titanylphosphate KTP) laser system for the therapy of a benign prostatic hyperplasia. The middle point of GMR-SV device was set to the near position of a high magnetic sensitivity with 2.8%/Oe. The sensitivity for the water level and water temperature of the fabricated sensor were $400\;m{\Omega}/mm$ and $100\;m{\Omega}/^{\circ}C$, respectively.

• International Journal of Internet, Broadcasting and Communication
• /
• v.12 no.2
• /
• pp.30-36
• /
• 2020

We demonstrated a successful fabrication of 4" Gallium Nitride (GaN)/Diamond High Electron Mobility Transistors (HEMTs) incorporated with Inner Slot Via Hole process. We made in manufacturing technology of 4" GaN/Diamond HEMT wafers in a compound semiconductor foundry since reported [1]. Wafer thickness uniformity and wafer flatness of starting GaN/Diamond wafers have improved greatly, which contributed to improved processing yield. By optimizing Laser drilling techniques, we successfully demonstrated a through-substrate-via process, which is last hurdle in GaN/Diamond manufacturing technology. To fully exploit Diamond's superior thermal property for GaN HEMT devices, we include Aluminum Nitride (AlN) barrier in epitaxial layer structure, in addition to conventional Aluminum Gallium Nitride (AlGaN) barrier layer. The current collapse revealed very stable up to Vds = 90 V. The trapping behaviors were measured Emission Microscope (EMMI). The traps are located in interface between Silicon Nitride (SiN) passivation layer and GaN cap layer.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
• /
• v.23 no.3
• /
• pp.245-249
• /
• 2010

Two dimensional(2D) pair-photonic crystals (pair-PCs) have been fabricated by a multiple-exposure nanosphere lithography (MENSL) method using the self-assembled nanospheres as lens-mask patterns and the collimated laser beam as a multiple-exposing source. The arrays of the 2D pair-PCs exhibited variable lattice structures and shape the control of rotating angle (${\Theta}$), tilting angle (${\gamma}$) and the exposure conditions. In addition, the base period or filling factor of pair-PCs as well as their shapes could be changed by experimental conditions and nanosphere size. A 1.18-${\mu}m$-thick resist was spincoated on Si substrate and the multiple exposure was carried out at change of ${\gamma}$ and ${\Theta}$. Images of prepared 2D pair-PCs were observed by SEM. We believe that the MENSL method is a suitable useful tool to realize the pair-periodic arrays of large area.

• Journal of the Korean Society of Manufacturing Process Engineers
• /
• v.12 no.5
• /
• pp.16-22
• /
• 2013

A two-dimensional photonic crystal structure was investigated using a roll-to-roll nanoreplication and physical vapor deposition processes for the inexpensive enhanced fluorescence substrate which is not sensitive to the polarization directions of excitation light source. An 8 inch silicon master having nano dot array with a diameter of 200 nm, a height of 100 nm and a pitch of 400 nm was prepared by KrF laser scanning lithography and reactive ion etching processes. A flexible polymer mold was fabricated by flat type UV replication process and a deposition of 10 nm nickel layer as an anti-adhesion layer. A roll mold was prepared by warping the flexible polymer mold on an aluminum roll base and a roll-to-roll UV replication process was carried out using the roll mold. After the deposition of ~ 100 nm $TiO_2$ layer on the replicated nano dot array, a 2 dimensional photonic crystal structure was realized with a resonance wavelength of 635 nm for both p- and s-polarized light sources.

• Proceedings of the Korean Society of Precision Engineering Conference
• /
• 2003.06a
• /
• pp.94-97
• /
• 2003

A precise fabrication technology of glass is increasingly demanded fer the latest Industrial applications of spherical lenses. micro-optical components, laser applications and so on. Most of cases, the surface roughness of glass is required to be minute for improving the optical characteristics. Then. the machining characteristics of SF-5 glass and quarts glass were studied by using the ELID grinding process to get mirror surface and productivity compared with a general lapping process. A rotary type grinder with ELID generator was used to make the mirror surface of glass and a Mitutoyo surface tester and a nano-hardness tester were also used to measure the grinded surface or glass. As the results of experiments. they showed that the surface roughness(Ra) of SF-5 glass was under 7.8 nm and that of quartz glass was under 3.0 nm using the # 8000 grinder. So, the possibility of highly efficient and accurate surface for optical components can be achieved by the ELID grinding process.

• Korean Journal of Optics and Photonics
• /
• v.15 no.4
• /
• pp.349-354
• /
• 2004

As a transmitter sub-assembly in the XFP(10 Gb/s Small Form Factor Pluggable) transceiver module, a transmitter optical sub-assembly(TOSA) is designed, fabricated and characterized in view of electrical and thermal performances. For a low-cost and compact packaging TOSA, the bias-tee and the matching resistor are monolithically integrated on the AlN sub-mount and a newly designed coplanar waveguide is drawn in the TO-stem. All optoelectronic components packaged in the TOSA are modeled by the equivalent circuit, which helps to improve and characterize the TOSA performance. The fabricated TOSA shows the -3㏈ bandwidth as high as 11 GHz at an elevated temperature of 85$^{\circ}C$.

• Progress in Superconductivity and Cryogenics
• /
• v.6 no.2
• /
• pp.7-10
• /
• 2004

A study regarding the epitaxial growth of single $Y_2O_3$ buffer layer on biaxially textured Ni and NiW substrates using pulsed laser deposition is presented. Different deposition conditions were employed and compared in order to obtain good epitaxial $Y_2O_3$ film, furthermore importantly, to obtain good YBCO superconducting films. Following YBCO film deposited by PLD on the top of $Y_2O_3$ films have a good structure and superconducting properties. The J$_{c}$ of YBCO films on $Y_2O_3$ /Ni and $Y_2O_3$ /NiW were $1.0{\times}10^6 A/cm^2 and 1.1\times}10^6 A/cm^2$<.TEX> at 77K and self-field respectively, which indicated that $Y_2O_3$ is a suitable candidate as a single buffer layer for the fabrication of YBCO coated conductor.r.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
• /
• 2003.04a
• /
• pp.198-202
• /
• 2003

Tunable laser diode module with 50GHz-spacing internal wavelength locker was developed. Angle tilting dependency on FSR and peak wavelength shift and the proper initial tilting angle was calculated. By tilting the etalon, the response of the internal wavelength locker module was tuned. As a result, the fabricated internal wavelength locker module showed good performance over 62 channels.

• Journal of the Korean Society of Manufacturing Technology Engineers
• /
• v.24 no.3
• /
• pp.334-341
• /
• 2015

This paper summarizes the results of an investigation into the environmental factors that have an indirect impact on parts quality, as well as those process variables and modeling information that have a direct impact. The effects of strength, surface hardness, roughness, and accuracy of shape, that is, qualities that users generally need to know, were evaluated with laminating direction experimentally. The 3D printing methods used in this experiment were fused deposition modeling (FDM), stereolithography apparatus (SLA), selective laser sintering (SLS), 3D printing (3DP) and laminated object manufacturing (LOM). The goal was to achieve a high standard of quality control and product quality by optimizing the fabrication process.