• 한국생산제조학회지
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• 제18권4호
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• pp.401-409
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• 2009

This paper presents a method of calculating the stress intensity factor (K) and crack propagation direction (${\theta}_0$) at the crack-tip that is associated with delamination in the large scale integration(LSI) package. To establish a reasonable strength evaluation method and life prediction, it is necessary to assess fracture parameters under various fracture conditions. Therefore, we conducted quantitative stress singularity analysis considering thermal stress simulating the changes of crack length (a), (h) and (v) in delamination using the 2-dimensional elastic boundary element method (BEM), and from these results predicted crack propagation direction and path.

• 한국공작기계학회논문집
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• 제16권6호
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• pp.94-102
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• 2007

Applications of bonded dissimilar materials such as large scale integration (LSI) packages, ceramics/metal and resin/metal bonded joints, are very increasing in various industry fields. It is very important to analyze the thermal stress and stress singularity at interface edge in LSI. In order to investigate stress singularities on the bonded interface edges and delamination of die pad and resin in the IC package. In this paper, stress singularity factors(${\Gamma}_i$) and stress intensity factors($K_i$) considering thermal stress in the IC package were analyzed by using the 2-dimensional elastic boundary element method(BEM).

• 정보과학회지
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• 제5권2호
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• pp.90-93
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• 1987

Hardware의 발전 중에서도 memory 기술의 발전은 눈부실 程度이다. 記 憶裝置의 構成素子의 흐름을 보면 1世代에는 眞空管이 使用되었고 2世代에는 트 랜지스터가 使用되었으며 3世代에는 Integrated circuits이 使用되고 있다. 3世代 後期인 오늘날에는 LSI(Large scale integration) 기술이 發展됨에 따라 memory 의 價格은 날로 떨어지고 있다. 또한 microprogramming의 槪念이 登場하여 ROM(Read-Only Memory)의 出現을 보았고, 더 나아가서는 IBMS/360 Modal 85 에 cache memory가 登場하여 memory hierarchy上에 一大 革新을 일으켰다.

• 한국생산제조학회지
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• 제7권1호
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• pp.58-68
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• 1998

Advantages of adhesively bonded joints and techniques of weight reduction have led to increasing use of structural adhesives such as LSI(large scale integration) package, automobile, aircraft in the various industries. In spite of such wide applications of adhesively bonded joints, the evaluation method of bonding strength has not been established. Stress singularity occurs at the interface edges of adhesively bonded joints and it is required to analyze it. In this paper, the stress singularity using 2-dimensional elastic boundary element method (BEM) with the changes of the lap length and adhesive for single lap joint was analyzed, and experiments of strength evaluation were carried out. As the results, the evaluating method of bonding strength considering stress singularity at interface edges of adhesively bonded joints and stress intensity factor of interface crack have been proposed in static and fatigue test.

• 대한전기학회:학술대회논문집
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• 대한전기학회 1996년도 하계학술대회 논문집 B
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• pp.949-952
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• 1996

The ultrasonic motor(USM) has good characteristics such as compact size, silent motion, low speed, high torque and high speed response. The USM is driven by 2-phase AC electricity. The control parameters of USM are voltage, phase difference, frequency of input power, etc. In this paper, we propose voltage difference control. And we designed USM controller to adjust voltage and phase using pLSI(programmable Large Scale Integration). Voltage difference control has many advantages that are lower current, lower power than phase difference control. Especially there is nearly zero ampere at the zero point of speed and torque. we can apply this voltage difference control to the compliance control of DD manipulator.