• Journal of the Korean Society of Manufacturing Technology Engineers
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• v.18 no.4
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• pp.401-409
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• 2009

This paper presents a method of calculating the stress intensity factor (K) and crack propagation direction (${\theta}_0$) at the crack-tip that is associated with delamination in the large scale integration(LSI) package. To establish a reasonable strength evaluation method and life prediction, it is necessary to assess fracture parameters under various fracture conditions. Therefore, we conducted quantitative stress singularity analysis considering thermal stress simulating the changes of crack length (a), (h) and (v) in delamination using the 2-dimensional elastic boundary element method (BEM), and from these results predicted crack propagation direction and path.

• Transactions of the Korean Society of Machine Tool Engineers
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• v.16 no.6
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• pp.94-102
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• 2007

Applications of bonded dissimilar materials such as large scale integration (LSI) packages, ceramics/metal and resin/metal bonded joints, are very increasing in various industry fields. It is very important to analyze the thermal stress and stress singularity at interface edge in LSI. In order to investigate stress singularities on the bonded interface edges and delamination of die pad and resin in the IC package. In this paper, stress singularity factors(${\Gamma}_i$) and stress intensity factors($K_i$) considering thermal stress in the IC package were analyzed by using the 2-dimensional elastic boundary element method(BEM).

• Communications of the Korean Institute of Information Scientists and Engineers
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• v.5 no.2
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• pp.90-93
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• 1987

Relatively few papers are known to study the clustering the same kind of data records in a cylinder. In this article, I reviewed the clustering algorithms especially for the cellular list file which have been studied.

• Journal of the Korean Society of Manufacturing Technology Engineers
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• v.7 no.1
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• pp.58-68
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• 1998

Advantages of adhesively bonded joints and techniques of weight reduction have led to increasing use of structural adhesives such as LSI(large scale integration) package, automobile, aircraft in the various industries. In spite of such wide applications of adhesively bonded joints, the evaluation method of bonding strength has not been established. Stress singularity occurs at the interface edges of adhesively bonded joints and it is required to analyze it. In this paper, the stress singularity using 2-dimensional elastic boundary element method (BEM) with the changes of the lap length and adhesive for single lap joint was analyzed, and experiments of strength evaluation were carried out. As the results, the evaluating method of bonding strength considering stress singularity at interface edges of adhesively bonded joints and stress intensity factor of interface crack have been proposed in static and fatigue test.

• Proceedings of the KIEE Conference
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• 1996.07b
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• pp.949-952
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• 1996

The ultrasonic motor(USM) has good characteristics such as compact size, silent motion, low speed, high torque and high speed response. The USM is driven by 2-phase AC electricity. The control parameters of USM are voltage, phase difference, frequency of input power, etc. In this paper, we propose voltage difference control. And we designed USM controller to adjust voltage and phase using pLSI(programmable Large Scale Integration). Voltage difference control has many advantages that are lower current, lower power than phase difference control. Especially there is nearly zero ampere at the zero point of speed and torque. we can apply this voltage difference control to the compliance control of DD manipulator.