• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2005.11a
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• pp.220-223
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• 2005

We studied the effect of composition, processing, and sintering temperature on the microwave properties of $Mg_{3-x}Co_x(VO_4)_2$ system which is applicable to LTCC. When $Mg_{3-x}Co_x(VO_4)_2$ was fabricated by solid-state reaction process and sintered at the temperature range of $800\sim910^{\circ}C$, it was found that the optimum composition of x was 2 at which microwave properties of 910$^{\circ}C$-sintered one were as follows: $Q\times f_0\sim55,200GHz$ and $\varepsilon_r\sim10$. When $(MgCo_2)(VO_4)_2$ was fabricated by sol-gel process and sintered at 800$^{\circ}C$, $Q\timesf_0$was 34,400GHz which is much high compared to those fabricated by solid-state reaction process at the same sintering temperature.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2002.11a
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• pp.342-345
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• 2002

As the size of chip components and module decreases, new patteming method for fine line and geometry is needed. So far, in LTCC(Low Temperature Cofired Ceramic) process, screen printing method has been used generally. But screen printing method has some disadvantages as follows. First, the geometry including line, vias, etc. smaller than $100{\mu}m$ can't be evaluated easily. Second, the patterned dimension is different from designed value, which makes distortion in charactersitics of not only chip components but also modules. Thick film lithography has advantages of thick film screen printing process, low cost and thin film process, fine line feasibility. Using this method, the line with $30{\mu}m$ width and the geometry with expected dimension can be evaluated. In this study, the fine line with $35{\mu}m$ line/space is formed and the embedded capacitor with very small tolerance is developed using thick film lithography.

• The Journal of Korean Institute of Communications and Information Sciences
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• v.32 no.5A
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• pp.490-496
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• 2007

This paper describes the design and implementation of an integrated LTCC front-end module for the IEEE802.11a WLAN applications by performing the behavioral-level simulation using measurement-based behavioral model. To meet the IEEE802.11a WLAN standard, a system transmitting 1024 symbols through 64-QAM process at the rate of 54Mbps should be implemented and nonlinear properties are confirmed by simulations of ACPR and EVM in this circumstance. The right offsets of ACPR which are 30MHz, 20MHz, and 11MHz distant from the center frequency of 5.8GHz are 49.36dBc, 36.90dBc, and 24.58dBc, respectively. The left offsets are 50.14dBc, 30.04dBc, and 28.85dBc, respectively and EVM is 2.94%. The size of the module implemented with LTCC five-layer substrates is $13.4mm{\times}14.2mm$. The measured characteristics of the transmitter show P1dB of 16.2dBm and power gain of 16.73dB. Those of the receiver exhibit the small signal gain of 16.24dB and noise figure of 7.83dB.

• Journal of the Microelectronics and Packaging Society
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• v.13 no.3 s.40
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• pp.33-38
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• 2006

Aerosol slurry composed of dielectric materials, distilled water, and deflocculants was sprayed on the substrates, through a high-pressure spray gun as an aerosol. The coated layers were cofired together with $Al_{2}O_{3}$ substrates and green sheets on which the inner connectors were printed. Although the coating rate of coated layers strongly depended on slurry viscosity, spray shape, and the pressure of the spray gun, the coated density was not changed. Buried conductors were maintained as printed by high pressure spray coating method, because the pressing process was not used. At the optimum condition of air controller step 3-4 and slurry viscosity c.p 2000-4000, dense and uniform layers could be achieved. Comparing with conventional lamination process using green sheets, spray coating method enabled thin dielectric layers of $20{\sim}50{\mu}m$.

• Journal of the Microelectronics and Packaging Society
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• v.18 no.4
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• pp.63-70
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• 2011

Anorthite forming glass frits in amounts up to 25 vol% of the silver powder were added to improve the adhesion between the conductor pattern formed by thick film photoimageable process and the low temperature co-fired ceramics (LTCC) substrate. The sheet resistance of the conductor pattern was raised from 0.13 ${\Omega}/{\square}$ to 2.25 ${\Omega}/{\square}$ as the volume percentage of glass frit increased up to 25 vol%. The adhesion strength was improved with this glass frit increase, but it decreased when the glass content exceeded 20 vol% which are possibly attributed to the liquid pool effect and the reduced fracture toughness in the interface between conductor and LTCC layer. The shrinkage of the width of the conductor pattern decreased with the addition of glass contents.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2003.07b
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• pp.607-610
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• 2003

The characteristic prediction and analysis of 3-dimensional (3-D) solenoid-type embedded inductors is investigated. The four different structures of 3-D inductor are fabricated by using low-temperature cofired ceramic (LTCC) process. The circuit model parameters of the each building block are optimized and extracted using the partial element equivalent circuit method and HSPICE circuit simulator. Based on the model parameters, predictive modeling is applied for the structures composed of the combination of the modeled building blocks. And the characteristics of test structures, such as self-resonant frequency, inductance and Q-factor, are analyzed. This approach can provide the characteristic conception of 3-D solenoid embedded inductors for structural variations.

• Proceedings of the Korean Powder Metallurgy Institute Conference
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• 2006.09b
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• pp.1232-1233
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• 2006

To co-fire with commercial LTCC (Low Temperature Co-fired Ceramic) materials at $850^{\circ}C{\sim}880^{\circ}C$, different contents of $B_2O_3$ were added to the $Bi_2O_3-ZnO-Nb_2O_5$ (BZN) ceramics. According to the test results, the cubic phase of BZN was transformed into orthorhombic in all the test materials. $BiNbO_4$ phase was formed in test materials with $2{\sim}5wt%$ of $B_2O_3$ addition. The phase transformation of cubic BZN was controlled during the synthesis process with excess ZnO content. The Cubic and orthorhombic phases of BZN could coexist and be sintered densely at $850^{\circ}C/2hr$.

• ETRI Journal
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• v.28 no.3
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• pp.347-354
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• 2006

The characteristic variation of 3-dimensional (3-D) solenoid-type embedded inductors is investigated. Four different structures of a 3-D inductor are fabricated by using a low-temperature co-fired ceramic (LTCC) process, and their s-parameters are measured between 50 MHz and 5 GHz. The circuit model parameters of each building block are optimized and extracted using the partial element equivalent circuit method and an HSPICE circuit simulator. Based on the model parameters, the characteristics of the test structures such as self-resonant frequency, inductance, and quality (Q) factor are analyzed, and predictive modeling is applied to the structures composed of a combination of the modeled building blocks. In addition, characteristic variations of the 3-D inductors with different structures using extracted building blocks are also investigated. This approach can provide a characteristic estimation of 3-D solenoid embedded inductors for structural variations.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2007.06a
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• pp.303-303
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• 2007

Photo-imageable thick-film lithography technology was developed for the fabrication of embedded passives such as inductors and capacitors. In this study, photo-imageable dielectric and conductor pastes have apoted a negative type. Sodalime glass wafer, alumina substrate and zero-shrinkage LTCC green tapes were used as substrates. In result, The lithographic patterns were designed as lines and spaces for conductor material, or via-holes for ceramic, LTCC, materials. The scattering and reflection of UV-beam on the substrate had negative effects on fine patterning. The patterning performance was varied with the exposing and developing process conditions, and also varied with the substrate materials. Fine resolution of less then $50/50{\mu}m$ in line and space was obtained, which is difficult in screen printing method.

• Transactions on Electrical and Electronic Materials
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• v.12 no.1
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• pp.32-34
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• 2011

A zero-shrinkage sintering process in which the shrinkage of the x-y axis is controlled to be zero is in great demand due to the high integration trend in ceramic modules. Among the zero-shrinkage sintering processes available, the glass infiltration method proposed in the preliminary study with an $Al_2O_3/Glass/Al_2O_3$ structure is one promising method. However, problems exist in regard to the glass infiltration method, including partially incomplete joining between $Al_2O_3$ and glass layers due to the precipitate of Ti-Pb rich phase during the sintering process. Therefore, we wish to solve the de-lamination problems and suggest a mechanism for delamination and the solutions in the zero-shrinkage low temperature co-fired ceramic (LTCC) layers. The de-lamination problems diminished using the Pb-BSi-O glass without $TiO_2$ in Pb-B-Ti-Si-O glass and produced a very dense zero-shrinkage LTCC.