• Title/Summary/Keyword: LTCC(Low-Temperature Co-fired Ceramic)

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Study on properties of CaO-MgO-$SiO_2$ system glass-ceramic for LTCC (CaO-MgO-$SiO_2$ 계 LTCC glass에 대한 특성 연구)

  • Chang, Myung-Whun;Ma, Won-Chul
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2008.06a
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    • pp.322-322
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    • 2008
  • Low-temperature co-fired ceramics (LTCC) have turned out to be very promising technology in accordance with the rapid developments in semiconductor technology. The demands for compact electrical assemblies, smaller power loss as well as high signal density can be fulfilled by LTCC. And for the multi-layered ceramic devices with embedded passive components such as high dielectric constant decoupling capacitor, LTCC materials require the several conditions to avoid delamination and internal cracks. For the present study, diopside-based glass is chosen as the LTCC substrate material in view of its high coefficient of thermal expansion (CTE). From the experimental resultsn the influence of each element on the CTE change can be revealed.

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Soldering characteristics of Ag-Pd electrodes in relationship to differing particle size of LTCC substrate (LTCC 기판의 Particle Size 에 따른 Ag-Pd 전극의 Soldering 특성 변화)

  • 조현민;유명재;박종철
    • Proceedings of the International Microelectronics And Packaging Society Conference
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    • 2002.05a
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    • pp.130-133
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    • 2002
  • Solder leaching resistance of the metal electrode is an important factor with regard to adhesion properties of ceramic substrate. In the Low Temperature Co-fired Ceramics (LTCC), Ag-Pd or Ag-Pt pastes are used instead of pure Ag paste to prevent leaching. Solder leaching behavior of the Ag-Pd paste in relation to LTCC raw material powder size was investigated. First fabrication of LTCC green tape with different particle size was done. LTCC substrates with Ag-Pd electrode were prepared using conventional multilayer ceramic process. Dipping test was performed to test solder leaching behavior of the electrode. Ag-Pd electrode on LTCC substrate with smaller particle size achieved higher solder leaching resistance.

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Low k Materials for High Frequency High Integration Modules

  • Na, Yoon-Soo;Lim, Tae-Young;Kim, Jin-Ho;Shin, Hyo-Soon;Hwang, Jong-Hee;Cho, Yong-Soo
    • Journal of the Korean Ceramic Society
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    • v.46 no.4
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    • pp.413-418
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    • 2009
  • Glass systems based on Ca, Sr, Ba, and Zn modified alumino-boro silicates were investigated in order to improve the dielectric and mechanical properties of a typical LTCC (low temperature co-fired ceramic) which was developed for high frequency highly-integrated modules. The glass was prepared by a typical melting procedure and then mixed with cordierite fillers to fabricate glass/ceramic composite-type LTCC materials. The amount of cordierite filler was fixed at 50 volumetric%. For an optimal glass composition of 7.5% CaO, 7.5% BaO, 5% ZnO, 10% $Al_2O_3$, 30% $B_2O_3$, and 40% $SiO_2$ in mole ratio, the resultant LTCC composite showed a dielectric constant of 5.8 and a dielectric loss ($tan{\delta}$) of 0.0009 after firing at $900^{\circ}C$. An average bending strength of 160MPa was obtained for the optimal composition.

Design and Fabrication of the Push-push Dielectric Resonator Oscillator using a LTCC (LTCC를 이용한 push-push 유전체 공진 발진기의 설계 및 제작)

  • Ryu, Keun-Kwan;Oh, Eel-Deok;Kim, Sung-Chan
    • Journal of the Korea Institute of Information and Communication Engineering
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    • v.14 no.3
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    • pp.541-546
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    • 2010
  • The push-push DRO(dielectric resonator oscillator) using a multi-layer structure of LTCC(low temperature co-fired ceramic) fabrication is designed. After the single DRO of series feedback type in the center frequency of 8GHz is designed, the push-push DRO in the center frequency of 16GHz including the Wilkinson power combiner is designed. The bias circuit affecting the size of oscillator are embedded in the intermediate layer of the LTCC multi-layer substrate. As a result, the large reduction in the size of VCO is obtained compared to the general oscillator on the single layer substrate. Experimental results show that the fundamental and third harmonics suppression are above 15dBc and 25dBc, respectively, and phase noise characteristics of the push-push DRO presents performance of -102dBc/Hz@100KHz and -128dBc/Hz@1MHz offset frequencies from carrier.

Design of Multi-band Ceramic Chip Antenna for WLAN using LTCC Technology (LTCC 공정기술을 이용한 무선랜용 다중대역 칩 안테나 설계)

  • 박영호;이용기;이윤도;이상원;천창율
    • The Transactions of the Korean Institute of Electrical Engineers C
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    • v.53 no.8
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    • pp.443-446
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    • 2004
  • In this paper, a multi-band ceramic chip antenna for WLAN(Wireless LAN) applications is designed. The design target is to obtain 0 dBi of coverage gain with omni directional radiation pattern. The antenna is fabricated using Low Temperature Co-fired Ceramic(LTCC) technology. The size of the chip antenna is $2.2{\times}9.65{\times}1.02$mm. The measured antenna gain is 1 dBi at 2.44 GHz and 0.5 dBi at 5.5 GHz. The omni directional radiation pattern for the two operating bands is obtained. The measured bandwidth(S11=-10 dB) are 90 MHz at 2.44 GHz and 1280 MHz at 5.5 GHz respectively

A Low-Loss Patch LTCC 60 GHz BPF Using Double Patch Resonators

  • Lee, Young Chul
    • Proceedings of the Korean Institute of Information and Commucation Sciences Conference
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    • 2012.10a
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    • pp.570-572
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    • 2012
  • In this paper, a three-dimensional (3-D) low-loss and wide-band BPF based on low-temperature co-fired ceramic (LTCC) has been presented for mm-wave wireless communication applications. The proposed BPF is designed in a 6-layer LTCC substrate. The double patch resonators are fully integrated into the LTCC dielectrics and vertical via and planar CPW transitions are designed for interconnection between embedded resonators and in/output ports and MMICs, respectively. The designed BPF was fabricated in a 6-layer LTCC dielectric. The fabricated BPF shows a centre frequency (fc) of 53.23 GHz and a 3dB bandwidth of 14.01 % from 49.5 to 56.9 GHz (7.46 GHz). An insertion loss of -1.56 dB at fc and return losses below -10 dB are achieved. Its whole size is $4.7{\times}1.7{\times}0.684mm^3$.

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Effect of $Al_2O_3$ Particle Size on Thermal Properties of Glass-Ceramics for LTCC Material (저온동시소성용 결정화 유리의 필러 사이즈가 열적 특성에 미치는 영향)

  • Kim, Jin-Ho;Hwang, Seong-Jin;Lee, Sang-Wook;Kim, Hyung-Sun
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2007.11a
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    • pp.281-281
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    • 2007
  • Low Temperature Co-fired Ceramic (LTCC) technology has been used in electronic device for various functions. LTCC technology is to fire dielectric ceramic and a conductive electrode such as Ag or Cu thick film below the temperature of $900^{\circ}C$ simultaneously. The glass-ceramic has been widely used for LTCC materials due to its low sintering temperature, high mechanical properties and low dielectric constants. To obtain the high strength, addition of filler, the microstructure should have various crystals and low pores in a composite. In this study, two glass frits were mixed with different alumina size(0.5, 2, 3.7um) and sintered at the range of $850{\sim}950^{\circ}C$. The microstructure, crystal phases, thermal and mechanical properties of the composites were investigated using FE-SEM, XRD, TG-DTA, Dilatomer. When the particle size of $Al_2O_3$ filler increased, the starting temperatures for the densification of the sintered bodies, onset point of crystallization, peak crystallization temperature in the glass-ceramic composites decreased gradually. After sintered at $900^{\circ}C$, the glass frits were crystallized as $CaAl_2Si_2O_8\;and\;CaMgSi_2O_6$. The purpose of our study is to understand the relationship between the $Al_2O_3$ particle size and thermal properties in composites.

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Design of T/R Switch Using LTCC Technology

  • Sim, Sung-Hun;Kang, Chong-Yun;Park, Ji-Won;Yoon, Young-Joong;Kim, hyun-Jai;Park, Hyung-Wook;Yoon, Seok-Jin
    • Journal of the Korean Ceramic Society
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    • v.40 no.4
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    • pp.375-379
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    • 2003
  • In this paper, a novel design of multilayer ceramic-based Transmit/Receive (T/R) switch using Low Temperature Co-fired Ceramic (LTCC) technology have been presented. Compact T/R switch has been designed by transforming quarter-wave transmission line to its lumped equivalent circuit. Especially, high-Q three dimensional inductors with double strip have been proposed and incorporated. The proposed inductor has been modeled by multi-conductor coupled lines. A measured inductor quality factor (Q) of 80 and a Self-Resonance Frequency (SRF) of 6.6 GHz have been demonstrated. The inductor library has been incorporated into the design of WCDMA T/R switch.

Low-Temperature Sintering and Dielectric Properties of BaSn(BO3)2 Ceramics (BaSn(BO3)2세라믹스의 저온소결 및 유전특성)

  • Nam, Myung-Hwa;Kim, Hyo-Tae;Hwang, June-Cheol;Nam, Joong-Hee;Yeo, Dong-Hoon;Kim, Jong-Hee;Nahm, Sahn
    • Journal of the Korean Ceramic Society
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    • v.43 no.2 s.285
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    • pp.92-97
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    • 2006
  • Dolomite type $BaSn(BO_3)_2$ ceramics with rhombohedral crystal structure has been synthesized via solid state reaction route. Dielectric properties were measured for the samples sintered at $1050\~1200^{\circ}C$ for 2 h in air. Dielectric constant, loss tangent, and temperature coefficient were increased with sintering temperature due to the evolution of $BaSnO_3$, secondary, phase. Optimum dielectric properties were obtained at the $BaSn(BO_3)_2$ ceramics sintered at $1100^{\circ}C.\;CuO/Bi_2O_3$ was added to $BaSn(BO_3)_2$ ceramics to lower the sintering temperature for LTCC application, then Co and Fe-based coloring agents were added for colorizing the LTCC tape. Typical dielectric properties of $BaSn(BO_3)_2$ ceramics with $5 wt\%\;CuO/Bi_2O_3\;and\;3wt\%$ Co-coloring agent that sintered at $900^{\circ}C$ were $\varepsilon_r=9.89,\;tan{\delta}=0.92\times10^{-3},\;and\;TCC=112ppm/^{\circ}C$. Thus obtained LTCC tape was co-fired with Ag paste for compatibility test and revealed no sign of Ag reaction with the ceramics.

Physics-based Modeling of Low Temperature Co-fired Ceramic Helical Inductors (LTCC Helical 인덕터의 Physics-based 모델링)

  • Heo, Keun;Lim, Ju-Hwan;Hwang, Sung-Woo
    • Proceedings of the IEEK Conference
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    • 2006.06a
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    • pp.601-602
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    • 2006
  • A physics-based equivalent circuit model for LTCC Helical type Inductors is presented. All of the electromagnetic couplings between conductors are included in the model and the number of optimized parameters is minimized. The model can predict the measured results upto 12 GHz.

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