• 한국생산제조학회지
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• 제24권4호
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• pp.448-454
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• 2015

In this paper, the band structural design that is typically in a line was arranged in a ring shape, so as to configure the high power LED lighting in such a way as to form a concentrated light distribution angle of less than 15 degrees. The parabolic aluminized reflector PAR38 that facilitates design using area and the area of the optical system to the same extent, applied a multiple light-source condenser lens optical system for the control of integration. The LED used here implemented a single linear light source using ans LED module with ans LED, flip-chip chip-scale package. The optical system was designed based on the energy star standard.

• 한국진공학회:학술대회논문집
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• 한국진공학회 2012년도 제42회 동계 정기 학술대회 초록집
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• pp.480-481
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• 2012

LED (Light Emitting Diode)는 친환경적이며 고수명 등의 여러 장점을 가지고 있어서 액정디스플레이의 광원으로 널리 사용되고 있다. 그러나 LED 제품을 제조하기 위해서는 칩, 패키지, 모듈, 시스템으로 구성된 4단계의 복잡한 제조공정을 거쳐야 하므로 가격이 높은 단점이 있다. 이를 개선하기 위해서 패키지, 모듈, 시스템의 3단계의 공정을 하나로 통합한 hybrid LED package(HLP) 개념이 제시되었다. HLP는 LED chip을 PCB에 직접 실장한 뒤 초정밀 가공 및 성형 기술을 활용하여 일체형 광학패턴을 인가함으로써 공정을 단순화하면서도 광효율을 향상시킬 수 있다. 이에 본 연구에서는 다구찌 실험계획법을 사용하여 디스플레이에서 중요시되는 휘도를 높일 수 있는 일체형광학패턴 형상 최적화를 실시하였으며, 최적화된 일체형 광학패턴을 제조하기 위한 초정밀 가공 및 성형기술을 개발하였다. 최적화 결과 높이 25um, 꼭지각 90도의 음각형태의 사각피라미드 패턴이 최적형상으로 결정되었으며, 패턴이 없을 때와 비교하여 휘도가 약 32.3% 높아지는 것으로 나타났다. 이러한 일체형 광학패턴을 제품으로 구현하기 위하여 초정밀 절삭기술을 활용하여 마스터 금형을 제작하였다. 최종적으로 사출성형을 통해 일체형 광학패턴을 제작하게 되는데 이때 사출기 내부 공기흐름 및 진공도를 최적화함으로써 패턴 내부에 불필요한 기포가 발생하지 않도록 하는데 성공하였다. 이를 통해 생산성이 높은 사출성형으로 HLP 제품을 양산할 수 있는 가능성을 확인하였고, 추후에는 실제 제품을 제작하는 연구를 수행할 예정이다.

• 한국광학회지
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• 제18권4호
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• pp.264-269
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• 2007

기존 필라멘트 방식의 루미나리에용 조명의 단점을 극복하기 위해 필라멘트를 LED로 바꾸기 위한 연구가 활발하게 진행 중이다. 본 연구는 루미나리에용에 적합한 LED패키지 구조를 만들기 위해 ray tracing simulator를 이용해 다양한 구조를 모델링하고 시뮬레이션을 통해 각 구조에서의 배광분포를 측정하였다. 시뮬레이션 결과, LED 패키지의 내부 반사경의 각을 증가시킬수록 배광분포가 두 개의 피크로 갈라지면서 피크간의 각이 점점 커졌다. 또한 외부 반사경 각이 증가함에 따라 양쪽 피크간의 각이 점점 줄어들다가 $50^{\circ}$를 기준으로 다시 증가하였다. 이러한 결과는 LED에서 발생한 빛이 두 개의 반사경에 의하여 반사되는 각도가 달라짐에 의하여 발생함을 알 수 있었다. Ray tracing simulator를 이용하여 구한 LED 패키지 구조의 조건을 적용하여 루미나리에용 LED패키지를 제작하였고 배광분포 측정기를 이용해 광 특성을 측정하였으며 시뮬레이션의 결과와 유사한 특성을 얻었다.

• Journal of Advanced Marine Engineering and Technology
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• 제39권8호
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• pp.801-806
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• 2015

The experimental analysis of a crevice-type vapor chamber heat pipe (CVCHP) is investigated. The heat source of the CVCHP is a high-power light-emitting diode (LED). The CVCHP, which exhibits a bubble pumping effect, is used for heat dissipation in a high-heat-flux system. The working fluid is R-141b, and its charging ratio was set at 60 vol.% of the vapor chamber in a heat pipe. The total thermal conductivity of the falling-liquid-film-type model, which was a modified model, was 24% larger than that of the conventional model in the LED package. Flow visualization results indicated that bubbles grew larger as they combined. These combined bubbles pushed the working fluid to the top, partially wetting the heat-transfer area. The thermal resistance between the vapor chamber and tube in the modified design decreased by approximately 32%. The overall results demonstrated the better heat dissipation upon cooling of the high-power LED package.

• 조명전기설비학회논문지
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• 제29권6호
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• pp.27-34
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• 2015

There has been a critical issue in optical simulation of phosphors in LEDs due to their light-reabsorption properties. To improve the accuracy of optical modeling for a white LED package, we utilized the spectrum data of the phosphor-dispersed encapsulant film instead of the phosphor powder. By measuring white LED packages with green and red phosphors, the maximum difference between simulation and experimental results of a color temperature, a color rendition index number and a color coordinate corresponds to ${\Delta}T=95K$, ${\Delta}Ra=1.7$ and ${\Delta}xy=0.007$, respectively. Based on those results, the proposed method can well explain the change of emission spectra of white LEDs with more than two phosphors which introduce the complex optical phenomena such as absorption, reabsorption, light emission, reflection and scattering, etc.

• 대한치과기공학회지
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• 제36권1호
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• pp.17-23
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• 2014

Purpose: The purpose of this study was to analyze and compare the relative accuracy of digitized stone models of lower full arch, using two different scanning system. Methods: Replica stone models(N=20) were produced from lower arch acrylic model. Twenty digital models were made with the white light and blue LED($Medit^{(R)}$, Korea) scanner. Two-dimensional distance between the landmarks were measured on the Delcam $CopyCAD^{(R)}$(Delcam plc, UK). Independent samples t-test was applied for comparison of the groups. All statistical analyses were performed using the SPSS software package(Statistical Package for Social Sciences for Windows, version 12.0). Results: The absolute disagreement between measurements made directly on the two different scanner-based dental digital models was 0.02~0.04mm, and was not statistically significant(P>0.05). Conclusion: The precision of the blue LED optical scanner was comparable with the digitization device, and relative accuracy was similar. However, there still is room for improvement and further standardization of dental CAD technologies.

• 전기학회논문지
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• 제59권11호
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• pp.2038-2042
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• 2010

In this paper, we confirmed the thermal & optical properties for improving the heat transfer coefficient by changing the via hole size and in FR4 PCB with the same area. Osram 1W power LED Package (Golden Dragon) was used and the K-factor which is relative constant between LED junction temperature and forward bias was measured with power source meter(KEITHLEY 2430) to measure the thermal resistance from PCB configuration. As results, thermal resistance in metal PCB came out to the lowest as $26 [^{\circ}C/W]$ and thermal resistance in FR4 PCB without via-holes emerged as the highest as $69 [^{\circ}C/W]$. However thermal resistance of FR4 PCB could have decreased until $32[^{\circ}C/W]$ in 0.6 mm by using the via hole. Also, the luminous flux could have improved, too.

• 대한금속재료학회지
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• 제48권11호
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• pp.1035-1040
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• 2010

The research efforts on GaN-based light-emitting diodes (LEDs) keep increasing due to their significant impact on the illumination industry. Surface mount technology (SMT) is widely used to mount the LED packages for practical application. In surface mount soldering both the device body and leads are intentionally heated by a reflow process. We studied on the effects of multiple reflows on microstructural variation and joint strength of the solder joints between the LED package and the substrate. In this study, Pb-free Sn-3.0Ag-0.5Cu solder and a finished pad with organic solderability preservatives (OSP) were employed. A $Cu_6Sn_5$ intermetallic compound (IMC) layer was formed during the multiple reflows, and the thickness of the IMC layerincreased with an increasing number of reflows. The shear force decreased after three reflows. From the observation of the fracture surface after a shear test, partially brittle fractures were observed after five reflows.

• 한국광학회:학술대회논문집
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• 한국광학회 2002년도 제13회 정기총회 및 2002년도 동계학술발표회
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• pp.184-185
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• 2002

We discussed the main issues of 10GHz Receiver packaging. High frequency structure simulations and circuit simulations for TO-CANs led to a new design for 10GHz optical receiver module packaging. The simulation results were compared to the measured laboratory data. The proposed package has low cost and easy manufacture process far mass production. Using this package, we had a good optical to electrical conversion (OE) characteristic at a data rate of 10Gbps.

• Journal of Welding and Joining
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• 제31권5호
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• pp.77-81
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• 2013

We have investigated thermal stability of the mechanical and thermal conductive properties of Cu/STS/Cu 3 layered clad metal lead frame material for a LED device package at different temperatures ranging from RT to $200^{\circ}C$. The fabricated Cu/STS/Cu clad metal has a good thermal stability for the mechanical tensile strength and thermal conductivity of the over 50 $Kg/mm^2$ to the $150^{\circ}C$ and 270 $W/m{\cdot}K$ to the $200^{\circ}C$, respectively. This clad metal lead frame material at a high temperature of $150^{\circ}C$ shows a reinforced mechanical tensile strength by 1.5 times to conventional pure copper lead frame materials and also a comparable thermal conductivity to typical copper alloy lead frame materials.