• Journal of the Semiconductor & Display Technology
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• v.14 no.3
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• pp.13-22
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• 2015

LED (Light Emitting Diode) lighting is gaining more and more market penetration as one of the global warming countermeasures. LED is the next generation of fusion source composed of epi/chip/packaging of semiconductor process technology and optical/information/communication technology. LED has been applied to the existing industry areas, for example, automobiles, TVs, smartphones, laptops, refrigerators and street lamps. Therefore, LED makers have been striving to achieve the leading position in the global competition through development of core source technologies even before the promotion and adoption of LED technology as the next generation growth engine with eco-friendly characteristics. However, there has been a point of view on the cost compared to conventional lighting as a large obstacle to market penetration of LED. Therefore, companies are developing a Chip-Scale Packaging (CSP) LED technology to improve performance and reduce manufacturing costs. In this study, we perform patent analysis associated with Flip-Chip CSP LED and flow chart for promising technology forecasting. Based on our analysis, we select key patents and key patent players to derive the business strategy for the business success of Flip-Chip CSP PKG LED products.

• Smart Media Journal
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• v.11 no.9
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• pp.21-29
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• 2022

Ultra Violet(UV) is gradually being replaced with LED instead of general UV lamps. However, the light efficiency of UV LED is still lower than that of the general lamp, and the light efficiency is also low. Due to the current environment and technical problems of UV lamps, the LED replacements are gradually being made. In this study, a new package design and analysis were performed to increase the lifetime and performance of UV LEDs. A new packaging for UV LED were designed and implemented. The new packaging for UV LED was constructed to improve light efficiency. And the electrical and optical characteristics were analyzed respectively. To improve the optical efficiency in UV LED package, the Al has been used based on high reflectivity and applying the optimal lens focusing. Compared to the existing silver Ag, the light efficiency was improved by about 30% or more, and it was confirmed that the light output degradation characteristic was improved by about 10% in the newly applied optical device chip.

• The monthly packaging world
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• s.252
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• pp.50-55
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• 2014

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2010.05a
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• pp.509-510
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• 2010

• Journal of the Microelectronics and Packaging Society
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• v.23 no.4
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• pp.35-41
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• 2016

Ceramic-metal based high power LED array package was developed via thick film LTCC technology using a glass-ceramic insulation layer and a silver conductor patterns directly printed on the aluminum heat sink substrate. The thermal resistance measurement using thermal transient tester revealed that ceramic-metal base LED package exhibited a superior heat dissipation property to compare with the previously known packaging method such as FR-4 based MCPCB. A prototype LED package sub-module with 50 watts power rating was fabricated using a ceramic-metal base chip-on-a board technology with minimized camber deformation during heat treatment by using partially covered glass-ceramic insulation layer design onto the aluminum heat spread substrate. This modified circuit design resulted in a camber-free packaging substrate and an enhanced heat transfer property compared with conventional MCPCB package. In addition, the partially covered design provided a material cost reduction compared with the fully covered one.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2003.11a
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• pp.51-52
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• 2003

• Microbiology and Biotechnology Letters
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• v.47 no.3
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• pp.332-336
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• 2019

The use of ultraviolet (UV) spectroscopy for foods is known to have a microbial inhibitory effect. UV-A having a longer wavelength than UV-C can be used for continuous or intermittent UV irradiation of food stored in containers or packages. Because UV-LED can be used effectively at a low price, this study reported the effect of UV-A 365 nm-LED on inhibiting Bacillus subtilis in accordance with the packaging conditions employed in daily use. The packaging materials were linear low-density polyethylene (LLD-PE), nylon/low density polyethylene (LDPE), polystyrene, and glass. When all packaging materials were treated with 365 nm UV-LED, B. subtilis was observed to remain inactive for 30-60 min. Further, compared with the control (-log 5), the survival rate of B. subtilis was -log 2.0-2.5 for nylon/LDPE and -log 2.58-3.61 for LLD-PE. These packaging materials showed an excellent inhibitory effect regardless of their thickness. Typically, a decrease in the viable cell count of more than 3 log indicates a 99.9% bactericidal effect. These results suggest that 365 nm UV-LED permeated the packaging material and inhibited bacterial growth.

• Journal of the Korean Society for Precision Engineering
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• v.30 no.3
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• pp.349-355
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• 2013

Recent high oil price results in the development of energy saving technology such as LED lighting system. Street-lighting system using COH LED package can save energy because the heat dissipation through cupper base is better than conventional technology. Studies on manufacturing processes of lighting system are insufficient even though LED package design and its heat analysis have been studied. This study focuses on the problem and solution of manufacturing processes such as LED packaging process, optimized emission angle, and LED bar dimension for mechanical assembly. As a result, we established better manufacturing alternatives of LED packaging and street-lighting system with higher lighting efficiency of 84 lm/W, as well as good illumination intensity of 39.7 lux at 6 m from lighting source.

• Journal of Information Display
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• v.10 no.2
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• pp.49-53
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• 2009

In this study, a very small LED packaging lead frame with a low thermal resistance was developed. The cost of the package process was reduced by the use of many small LED lamps, which increased the light emission efficiency. Compared to the large lead frame lamp, however, the optical property of the small LED packaging lead frame lamp was not sufficiently improved because its reflection structure was changed and its reflection area was reduced. The luminous efficiency of the LED lamp reaches 58 lm/W at the current density of 0.16 A/$cm^2$. Using the LED lamps, 46-inch LCD BLU was manufactured. The BLU-made LED lamps have a low power consumption of 146 W and have a slim (10-mm-thick) BLU, keeping good uniformity in terms of brightness, and maintaining good thermal properties.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2006.10a
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• pp.213-231
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• 2006