• 제목/요약/키워드: LED Package

검색결과 170건 처리시간 0.031초

응력특이성을 고려한 접착이음의 강도평가 방법 (Evaluation Method of Bonded Strength Considering Stress Singularity in Adhesively Bonded Joints)

  • 정남용
    • 한국생산제조학회지
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    • 제7권1호
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    • pp.58-68
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    • 1998
  • Advantages of adhesively bonded joints and techniques of weight reduction have led to increasing use of structural adhesives such as LSI(large scale integration) package, automobile, aircraft in the various industries. In spite of such wide applications of adhesively bonded joints, the evaluation method of bonding strength has not been established. Stress singularity occurs at the interface edges of adhesively bonded joints and it is required to analyze it. In this paper, the stress singularity using 2-dimensional elastic boundary element method (BEM) with the changes of the lap length and adhesive for single lap joint was analyzed, and experiments of strength evaluation were carried out. As the results, the evaluating method of bonding strength considering stress singularity at interface edges of adhesively bonded joints and stress intensity factor of interface crack have been proposed in static and fatigue test.

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Assessment of design methods for punching through numerical experiments

  • Kotsovou, Gregoria M.;Kotsovos, Gerasimos M.;Vougioukas, Emmanuel
    • Computers and Concrete
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    • 제17권3호
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    • pp.305-322
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    • 2016
  • The work is intended to demonstrate that the loss of bond between concrete and flexural steel which led in recent years a number of flat-slab structures to punching collapse under service loading conditions is also relevant to ultimate limit-state design. It is based on a comparative study of the results obtained from numerical experiments on flat slab-column sub-assemblages. The slabs were designed for punching either in compliance with the EC2 code requirements, which do not allow for such loss of bond, or in accordance with the compressive force-path method which considers the loss of bond between concrete and the flexural reinforcement in tension as the primary cause of punching. The numerical experiments are carried out through the use of a nonlinear finite element analysis package for which, although ample published evidence of its validity exists, additional proof of its suitability for the purposes of the present work is presented.

COB 패키지 설계를 위한 PCB 배선기판의 열특성 분석 (Analysis of Heat Emission Properties of Printed Circuit Boards For COB Package)

  • 김민성;김진홍;여인선;김영우;박성모;송상빈
    • 대한전기학회:학술대회논문집
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    • 대한전기학회 2009년도 제40회 하계학술대회
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    • pp.1609_1610
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    • 2009
  • LED는 광학특성을 유지하기 위해서 최적의 방열설계가 요구된다. 이 논문에서는 입력FR-4의 Top Layer의 면적을 506.25[$mm^2$]이상으로 확대함으로써, 인가 전력 0.5W 조건하에서 FR-4 PCB로 MCPCB와 유사한 방열 특성을 발휘할 수 있음을 열화상카메라를 통한 측정 및 전산모사를 이용하여 확인하였다.

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New dual cascade loop controller with color LCD bar graphs, equipped with a memory card

  • Kanda, Masae;Uyeno, Mitsugu;Matsuo, Akira;Souda, Yasushi;Terauchi, Yukio
    • 제어로봇시스템학회:학술대회논문집
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    • 제어로봇시스템학회 1990년도 한국자동제어학술회의논문집(국제학술편); KOEX, Seoul; 26-27 Oct. 1990
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    • pp.1327-1331
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    • 1990
  • A new dual loop controller using color LCD bar graphs with LED back lights has been developed. An optional memory card is used to load or save the controller configuration, which may be a preprogrammed standard package or a user-programmed configuration, in addition to the built-in functions ready for user selection. The bar-graph display is selectable for single-loop or dual-loop use. A high grade of self-tuning functions using a modeling technique is built-in as standard. The controller can accommodate optional plug-in modules for thermocouples, communication, etc. All the options are fully field upgradable.

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로봇 $CO_2$ 아크용접 공정변수를 제어하기 위한 수학적 모델 개발 (Development of Mathematical Models for Control of Process Parameters for Robotic $CO_2$ Arc Welding)

  • 임동엽;박창언;김일수;정영재;손준식;이계정
    • 대한용접접합학회:학술대회논문집
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    • 대한용접접합학회 1997년도 특별강연 및 추계학술발표 개요집
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    • pp.229-233
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    • 1997
  • The demand to increase productivity and quality, the shortage of skilled labour and the strict health and safety requirements have led to the development of the automated welding process to deal with many of the present problems of welded fabrication. To make effective use of the automated arc welding process, it is imperative that a mathematical model, which can be programmed easily and fed to the robot, should be developed. The objectives of the paper are to develop the mathematical equations (linear and curvilinear) for study of the relationship between process variables and bead geometry by employing a standard statistical package program, SAS and to choose the best model for automation of the $CO_2$ gas arc welding process. Mathematical models developed from experimental results can be employed to control the process variables in order to achieve the desired bead geometry based on weld quality criteria. Also these equations may prove useful and applicable for automatic control system and expert systems.

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An ERP Customizing Methodology Based on Process Model

  • Park, Ji-Hyun;Shon, Joo-Chan;Baik, Jong-Myoung
    • 한국전자거래학회:학술대회논문집
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    • 한국전자거래학회 2001년도 International Conference CALS/EC KOREA
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    • pp.467-475
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    • 2001
  • As a result of the policy for enforcing the information technology led by government and the effort of companies to get over economic crisis through the reformation of business process, the ERP market is being active. However, because imported ERP products that are supplied currently are designed for standard and rationality, they have a limit to support custom processes of domestic companies in South Korea. On the contrary, ERP products by domestic companies in South Korea are unable to support a consistent methodology of constructing ERP system. This is main reason why much time and costs are consumed than that of an original plan. To succeed in ERP construction, the purpose of ERP setup must be defined. To accomplish this end, it is required to analysis business process completely and to make a plan in detail. For ERP providers, they must support a characterized ERP construction methodology and lower the construction cost by improving an ERP package easy to customize[5].

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BGA 및 Flip Chip 패키지의 볼전단 특성에 미치는 시험변수의 영향 (Effect of Test Parameter on Ball Shear Properties for BGA and Flip Chip Packages)

  • 구자명;정승부
    • 대한용접접합학회:학술대회논문집
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    • 대한용접접합학회 2005년도 춘계학술발표대회 개요집
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    • pp.19-21
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    • 2005
  • The ball shea. tests for ball grid array (BGA) and flip chip packages were carried out with different displacement rates to find out the optimum condition of the displacement rate for this test. The BGA packages consisted of two different kinds of solder balls (eutectic Sn-37wt.%Pb and Sn-3.5wt.%Ag) and electroplated Au/Ni/Cu substrate, whereas the flip chip package consisted of electroplated Sn-37Pb solder and Cu UBM. The packages were reflowed up to 10 times, or aged at 443 K up to 21 days. The variation of the displacement rate resulted in the variations of the shear properties such as shear force, displacement rate at break, fracture mode and strain rate sensitivity. The increase in the displacement rate led to the increase of the shear force and brittleness of solder joints.

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다단제어 가동보의 구조성능 평가를 위한 해석적 연구 (An Aanalytical Study of Structural Performance Evaluation for Multi-stage Control Movable Weir)

  • 이해수;박태현
    • 한국기계가공학회지
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    • 제20권5호
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    • pp.61-68
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    • 2021
  • Movable weirs with multi-stage control are necessary in many Korean rivers to actively control the water storage level. A mesh dependency test was performed to determine the appropriate number of meshes for structural analysis of movable weirs. The standing angles of movable weirs were set to 60°, 45°, 30°, and 15° for stress analysis. The standing angle of 0° was excluded from the analysis because it was unloaded. Changes in the standing angle led to changes in the water depth, maximum pressure, maximum strain, and maximum stress. The maximum average stress and the structural safety of the multi-stage control movable weir were computed and tested using the Ansys FEA software package.

국내외 지속 가능한 친환경 화장품 패키지 사례 연구 (A Case Study on Sustainable Eco-Friendly Cosmetic Packages in Domestic and Foreign)

  • 이지민;김승인
    • 디지털융복합연구
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    • 제18권9호
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    • pp.343-349
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    • 2020
  • 본 연구는 지속 가능한 친환경 화장품 패키지에 관한 사례 연구이다. 최근 전 세계적으로 환경 문제가 대두되면서 친환경 패키지의 중요성이 높아지고 있다. 국내 화장품 업계는 이러한 변화에 발맞춰 지속 가능한 패키지 디자인을 출시하고 있지만, 한정적이다. 본 연구에서는 국내외 사례 각 5가지 선행 연구를 바탕으로 지속 가능한 패키지 기준을 나누어 분석하였다. 연구 결과 국내에는 국외와 비교하여 지속 가능 패키지의 소재와 디자인이 다양하지 않다는 것을 확인하였다. 또한, 소비자 주도의 친환경 캠페인이 부족하다는 것을 알 수 있었다. 이 연구를 기점으로 삼아 앞으로 더 나은 지속 가능한 화장품 패키지에 대한 연구가 계속해서 이루어지기를 기대한다.

고연색 백색 광원용 BaSi2O2N2:Eu 형광체의 광학·구조 특성 분석 (Optical and Structural Analysis of BaSi2O2N2:Eu Green Phosphor for High-Color-Rendering Lighting)

  • 이성훈;강태욱;강현우;정용석;김종수;허훈
    • 한국재료학회지
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    • 제29권7호
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    • pp.437-442
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    • 2019
  • Green $BaSi_2O_2N_2:0.02Eu^{2+}$ phosphor is synthesized through a two-step solid state reaction method. The first firing is for crystallization, and the second firing is for reduction of $Eu^{3+}$ into $Eu^{2+}$ and growth of crystal grains. By thermal analysis, the three-time endothermic reaction is confirmed: pyrolysis reaction of $BaCO_3$ at $900^{\circ}C$ and phase transitions at $1,300^{\circ}C$ and $1,400^{\circ}C$. By structural analysis, it is confirmed that single phase [$BaSi_2O_2N_2$] is obtained with Cmcm space group of orthorhombic structure. After the first firing the morphology is rod-like type and, after the second firing, the morphology becomes round. Our phosphor shows a green emission with a peak position of 495 nm and a peak width of 32 nm due to the $4f^65d^1{\rightarrow}4f^7$ transition of $Eu^{2+}$ ion. An LED package (chip size $5.6{\times}3.0mm$) is fabricated with a mixture of our green $BaSi_2O_2N_2$, and yellow $Y_3Al_5O_{12}$ and red $Sr_2Si_5N_8$ phosphors. The color rendering index (90) is higher than that of the mixture without our green phosphor (82), which indicates that this is an excellent green candidate for white LEDs with a deluxe color rendering index.