• Journal of the Semiconductor & Display Technology
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• v.15 no.4
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• pp.79-85
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• 2016

For long life time and high efficiency, not necessary in improvement of LED chip structure, but also improve heat radiation for decrease heat in LED chip. In this study, efficiency decline factor has been investigated in LED lamp as study heat characteristic, luminance flux and heat resistance. When LED lamp temperature was increased, about 7% loss of luminance flux. In consequence of temperature analysis, width of fin was the most important factor of heat radiation. As a result, secure the enough heat path is very important factor of LED lamp design.

• The Journal of the Korea institute of electronic communication sciences
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• v.9 no.5
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• pp.561-566
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• 2014

The high power COB(Chip on Board) LED, densely arranged chips on a board, are increasing to resolve heat problems in LED that has luminous semiconductor chips as main materials. In case of high-power COB LED, protection against heat is necessary due to the power consumption is high. Also if the temperature of device increases, the optical emission becomes less efficient and the life rapidly reduces due to thermal stress. This study packaged 13.5W COB LED and heat sink with difference form and produced 13.5W COB LED down-light heat sink by analyzing the thermal modes with Solidworks Flow Simulation. And finally it analyzed and evaluated the thermal modes using contacting and non-contacting thermometers.

• Proceedings of the Korean Vacuum Society Conference
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• 2011.08a
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• pp.279-279
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• 2011

본 연구는 LED 등기구에서 방열코팅소재에 따른 방열 효과를 연구하여 LED 등기구를 안정적으로 유지 제어 할 수 있는 방법을 찾고자 한다. 그에 따라 동일한 기구물에서 방열코팅만 변화하여 LED chip 온도의 Steady State 온도를 비교 측정하였다. 방열코팅은 동일한 알루미늄 Heat Sink에 일반분체코팅, Anodizing 처리, 알루미나 방열도료, Graphene이 섞인 알루미나도료, Graphene 잉크 등의 방열코팅소재를 아무 처리를 하지 않은 알루미늄 Heat Sink 와 비교 하였다. 온도는 LED chip, LED base plate, 코팅이 된 표면, 코팅 내부 2 mm 부분의 온도를 각각 Steady State가 될 때까지 측정하였다. 또한 LED의 power를 7 watt에서 13 watt 변화하면서 방열 원리를 분석하였다. 본 연구를 통하여 각 코팅소재에 따른 방열효과와 그 방열 원리를 연구 분석하였다.

• Transactions of Materials Processing
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• v.21 no.2
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• pp.131-137
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• 2012

With the advantages of power savings, increased life expectancy and fast response time over traditional incandescent bulb, LEDs are increasingly used for many applications including automotive, aviation, display, and special lighting applications. Since the high heat generation of LED chips can reduce service life, degrade luminous efficiency, and cause variation of color temperature, many studies have been carried out on the optimization of LED packaging and heat sinks. In this study, a fin expansion type cooling device using heat pipe, instead of a solid aluminum heat sink, was designed for LED security lightings based on thermal resistance analysis. Numerical analysis and experimental validation were carried out to evaluate its cooling performance.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.28 no.2
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• pp.137-141
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• 2015

The purpose of this study is examining thermal dissipation materials for the lighting and radiate efficiency improvement of 8W LED and confirming the properness of the thermal dissipation materials for LED heat sink. Solid Works flow simulation on 8W class COB was done based on the material characteristics of thermal conductive polymer materials. According to the result of simulation, Al had better thermal dissipation performance than PET. Highest temperature was $7.6^{\circ}C$ higher while lowest temperature was $7.8^{\circ}C$ lower. The test on the heat sinks made by the materials, highest temperature was $4.1^{\circ}C$ higher and lowest temperature was $3.9^{\circ}C$ lower. It is possible to confirm that Al heat sink has better thermal dissipation efficiency because it has better dispersion of heat generated at junction temperature and less heat cohesion. The weight of PET heat sink was reduced than Al heat sink by 46.9% by the density difference between Al and PET. In conclusion, thermal dissipation performance of thermal conductive polymer is lower than Al material however, it is possible to lighting heat sink because thermal conductive polymer has better formability, has lower specific weight and enables various design options.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.8 no.4
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• pp.733-737
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• 2007

The object of this paper is to propose a method to solve resulting heat in using numerous modulized watt-class LEDs in MCPCB as lighting device. To use LED for lighting, the chip needs to have a large capacity, resulting in extra heat in P-N connection area. To solve this problem, a Pottier Module, heat-sink panel and a fan was installed to measure variations in the temperature. Additionally, temperature variation characteristics were observed according to the heat conductor panel connecting cooling module and heat-sink panel, insulator and thermal grease. As a result, the type and amount of heat-sink panel was the most important facto. The fan would effect the temperature by max. $18[^{\circ}C]$ while other materials affected the temperature by $2{\sim}3[^{\circ}C]$, showing significant difference.

• Journal of the Semiconductor & Display Technology
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• v.8 no.4
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• pp.25-29
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• 2009

In this study, a thin plate-type heat pipe, instead of a solid aluminium heat sink, is used to eliminate heat released from LED components for lighting. Effects of the heat pipe size and installation angle are studied both in numerically and experimentally. According to the results, temperature on LED chip, when a heat pipe is used, is $1.2^{\circ}C$ lower than using the conventional metal PCB. The overall temperature drop is $32^{\circ}C$ if the heat pipe is properly used. The highest cooling performance is obtained in the case when the angle of a heat pipe installation is $90^{\circ}$.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.12 no.6
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• pp.152-158
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• 2013

The purpose of this study is to investigate cooling performance of high power LEDs from 100 to 200 W class by using a jet impingement cooling module. The numerical analysis of forced convection cooling inside cooling module is carried out using a multi-purpose CFD software, FLUENT 6.3. In the experiments, the LED cooling system consists of jet impingement module, heat exchanger, water reservoir, and pump. In the present study, the cooling performance of jet impingement cooling module is investigated to determine the effect of the heat sink types on the impinging surface, the space and length of fins. Numerical and experimental studies show the reasonable agreement of LED metal PCB temperature between those results and give the optimized design parameters such as the space of fin and the length of fin. Also, the pin fin type of heat sink is found to be more efficient than the plate type heat sink in jet impingement cooling.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.29 no.2
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• pp.79-83
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• 2016

This research was analyzed thermal characteristics that was appointed disadvantage when smart LED driver ICs was packaged and we applied extracted thermal characteristics for optimal layout design. We confirmed reliability of smart LED driver ICs package without additional heat sink. If the package is not heat sink, we are possible to minimize package. For extracting thermal loss due to overshoot current, we increased driver current by two and three times. As a result of experiment, we obtained 22 mW and 49.5 mW thermal loss. And we obtained optimal data of 350 mA driver current. It is important to distance between power MOSFET and driver ICs. If thhe distance was increased, the temperature of package was decreased. And so we obtained optimal data of 3.7 mm distance between power MOSFET and driver ICs. Finally, we fabricated real package and we analyzed the electrical characteristics. We obtained constant 35 V output voltage and 80% efficiency.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.26 no.12
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• pp.924-927
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• 2013

In this study, we proposed CMP-PLAs to replace the Al heat sinks as heat sink materials, and investigated heat dissipation characteristics of the LED lighting devices using them. The crystallinity of the proposed CMP-PLA heat sinks decreased with increasing carbon nanotube contents in CMP-PLA. However, the thermal conductivity was improved with the increase of the carbon nanotube contents. The heat dissipation characteristics of the LED lighting devices using CMP-PLA heat sinks was improved with increasing carbon nanotube contents in CMP-PLA. For the LED lighting devices using CMP-PLA heat sinks with 40% carbon nanotube contents, the initial temperature measured at the heat sink plate was $27^{\circ}C$, which increased as time, and it was saturated around $56^{\circ}C$ after an hour. The LED lighting devices using CMP-PLA heat sinks are expected to be functional materials that can reduce their weight and improve their electric properties, compared to those using existing Al heat sinks.