• Proceedings of the Korean Society of Precision Engineering Conference
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• 2010.05a
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• pp.421-422
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• 2010

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2009.10a
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• pp.503-504
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• 2009

• Journal of the Korean Society for Precision Engineering
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• v.29 no.7
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• pp.778-784
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• 2012

In comparison with some other light sources, LED has merits such as increased life expectancy, fast response, pollution free, and high energy efficiency. Lately, due to development of LED with high brightness and capacity, LED has widely used in many industrial fields such as automotive, aviation, display, transportation and special lighting applications. Since the high heat generation of LED chips can cause a reduction in lifetime, degradation of luminous efficiency, and variation of color temperature, studies have been carried out on the optimization of LED packaging and heat sinks. In this study, experiments on measuring the heat generation rate of LED and the cooling performance of a heat sink were carried for analyzing the thermal characteristics of LED lighting system in free convection. From the results, dimensionless correlation on the cooling performance of heat sink in natural convection was proposed with Nusselt number and Rayleigh number as a guideline for designing cooling device of LED lightings.

• Journal of Energy Engineering
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• v.26 no.2
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• pp.64-72
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• 2017

The performance analysis of the 70 W class LED lighting system suitable for the Middle East environment was performed using the lumped parameter model. The LED light is composed of a heating substrate, a heat pipe, and a heat sink. We divided the LED lights into four objects and applied energy equilibrium to each of them to establish four lumped nonlinear differential equations. The solution of the simultaneous equations was obtained by the Runge-Kutta method. Convective heat transfer coefficients of the lumped model were obtained by multidimensional CFD analysis. As a result of comparison with experiment, it was found that the heating substrate had an error of $1.5^{\circ}C$ and the upper heat sink had an error of $1.8^{\circ}C$ and the relative error was about 0.6 %. Using this model, temperature distribution analysis was performed for normal operating conditions with an ambient temperature of $55^{\circ}C$, with sunlight only, with abnormal operating conditions with sunlight, and without an upper heat sink.

• The Journal of Korean Institute of Communications and Information Sciences
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• v.38C no.8
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• pp.725-732
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• 2013

Recently, various applications for LED lightings are growing continuously due to their better performances such as low power consumption, longer life time, operation speed, controllability, high quality color rendering, and sustainability. However, in developing the high-powered LEDs illumination system, heat-sink problem is one of the important obstacle. In this paper, a heat-sink design with multi-layered structure for high-powered LEDs is proposed, which is composed of metal core PCB, heat-pipes, heat-sink plates, and fans. And also, in this paper, a design for LED controls using DMX512 protocols through RS-485 communications is proposed, which is considered as de facto international standard in LEDs illumination control and is widely used in landscape lighting and stage lighting. In this paper, LED control and its application techniques are introduced and the method of wireless remote control for main controller is proposed.

• Journal of the Korea Institute of Information and Communication Engineering
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• v.18 no.2
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• pp.401-407
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• 2014

There are increasing interests in COB (Chip On Board) that densely arranged many LED chips on one board in order to solve the heat issue. There are many problems being on the rise: the lifespan decreases as the temperature of LED devices increases; Red Shift phenomenon, in which wave length of spectral line moves from original wave length to long wave length, occurs; and optical power decreases as $T_j$ increases. In order to resolve such problems, this study selected the optimum thickness and length of Fin, planned the second Heat sink that is optimum for COB LED with 15W, and analyzed thermal mode by Solid Works Flow Simulation through 15W COB packaging with the planned Heat sink. 15W COB down-light Heat sink that is produced based on this analysis was utilized to analyze thermal mode through contact thermometer and electrical properties through Kelthley 2430.

• Korean Journal of Optics and Photonics
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• v.25 no.6
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• pp.311-314
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• 2014

In this paper, we design a helical fin structure for the heat sink for a high-power LED lighting module, and analyze its thermal properties. By means of the helical fin structure, we can obtain about 14% larger surface area for the limited volume and it can decrease the LED chip temperature by about 12%. Because this helical fin heat sink has 15% less total volume than a conventional one, we can also expect to reduce the production cost due to these structural properties.

• Journal of Advanced Marine Engineering and Technology
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• v.39 no.6
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• pp.586-591
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• 2015

This study discusses numerically-explored thermal performances of hybrid fin heat sinks (HF HSs) for lightweight thermal management of LED modules under natural convection. A hollow hybrid fin heat sink (HHF HS) and a solid hybrid fin heat sink (SHF HS) are proposed as HF HSs. A 3-D CFD analysis has been carefully conducted to obtain reliable numerical results. The 3-D CFD study investigates the effects of both fin spacing and an internal channel diameter on performances of the HHF HS and the SHF HS. The study results show that the mass-based thermal resistance of the HHF HS is 20~32% smaller compared with the pin fin heat sink (PF HS). The results also show that the mass-based thermal resistance of the HHF HS decreases with the increase of the channel diameter. These results are mainly due to coupled effects of the mass reduction and heat pumping through an internal channel. Considerably superior mass-based thermal performances of the HHF HS to the conventional PF HS suggest the feasible application for the lightweight thermal management of the LED modules under natural convection.

• The Transactions of The Korean Institute of Electrical Engineers
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• v.56 no.7
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• pp.1261-1267
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• 2007

Although LEDs have been used in various applications with improving the brightness and luminous efficacy, the electrical and optical characteristics of high power LED varies at different temperature and starting time. In this paper, optimal heat sink and apparatus design were conducted using IR camera and ICEPAK on the LED bulb consisting with fourteen LED array. The temperatures of heat sink and LED device of the designed LED bulb without cooling pan were $74^{\circ}C\;and\;96.8^{\circ}C$, respectively, showing in good themal characteristics. For high efficiency driving circuit of LED array adopted optimal heat sink design, driving circuits of constant voltage and current circuits were suggested and fabricated. As a result the efficacy of all driving circuits showed more than 20 lm/W. Also, the constant current circuits are suitable for signal lamp, hallway lamp, and flash lamp having short operating time(about 30 min). On the other hand, a reading light and indoor lamp having long operating time can be controlled by constant voltage circuit.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.16 no.5
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• pp.150-156
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• 2017

This study tests the characteristics of heat radiation by applying the pin-height variables to 30-W LED floodlights. The angle of the heat sink enables us to identify the characteristics of the heat radiation based on the temperature distribution. The results of the study are as follows. When the heat sinks are set towards the ground, the heat transfer decreases in speed only to expands the temperature distribution, which adversely affects the characteristics of heat radiation and expands the temperature distribution of PCB with the LED chip. We verify that the characteristics of heat radiation are adversely affected when the height of the cooling pin decreases and the heat radiation area decreases, which impedes the heat transfer and increases the temperature distribution on the heat sink.