• Design & Manufacturing
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• v.10 no.3
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• pp.14-19
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• 2016

Thermally or electrically conductive filler reinforced polymer composites are extensively being developed as the demand for light weight material increases rapidly in industiral applications need good conductivity such as heat sink of the electronics or light. Carbon or ceramic materials like graphite, carbon nanotube or boron nitride are typical conductive fillers with good thermal or electical conductivity. Using these conductive fillers, the polymer composites in the market show wide range of thermal conductivity from approximately 1 W/mK to 20 W/mK, which is quite enhanced considering the thermal conductivity lower than 0.5 W/mK for most polymeric materials. The practical use of these composites, however, is yet limited to specific applications because most composites are still not conductive enough or too difficult to process, too brittle, too expensive for higher conductivity. For practical use of conductive composite, the thermal conductivity required depending on the heat releasing mode are studied first for simplified unit cooling geometry to propose thermal conductivities of the composites for reasonable cooling performance comparing with the metal heat sink as a reference. Also, as a practical design for heat sink based on polymer composite, composite and metal sheet hybrid structures are investigated for LED lamp heat sink and audio amplication module housing to find that this hybrid structure can be a good solution considering all of the cooling performance, manufacturing, mechanical performance, cost and weight.

• The Journal of Korean Institute of Information Technology
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• v.16 no.11
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• pp.115-121
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• 2018

Fluorescent images using near-infrared light have no worry about radioactivity, and images can be checked in real time during surgery. Therefore experiments using fluorescent images for monitoring lymph node biopsy are actively under way. Fluorescent imaging equipment uses high heat-generating components such as LED and camera, thus uses water-cooling system as a stable heating suppression means. However in the fluorescent image equipment, the water cooling system takes a large volume which is a disadvantage in terms of miniaturization of the equipment. Even if the air cooling system is used for miniaturizing the equipment, heat generation is a problem. In this paper, we have experimented with the air cooling method using PWM control for the miniaturization of the equipment, and confirmed the constant quality of the fluorescent image and the suppression of the heat generation without any problems even when the equipment is used for a long time.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.16 no.5
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• pp.150-156
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• 2017

This study tests the characteristics of heat radiation by applying the pin-height variables to 30-W LED floodlights. The angle of the heat sink enables us to identify the characteristics of the heat radiation based on the temperature distribution. The results of the study are as follows. When the heat sinks are set towards the ground, the heat transfer decreases in speed only to expands the temperature distribution, which adversely affects the characteristics of heat radiation and expands the temperature distribution of PCB with the LED chip. We verify that the characteristics of heat radiation are adversely affected when the height of the cooling pin decreases and the heat radiation area decreases, which impedes the heat transfer and increases the temperature distribution on the heat sink.

• Korean Journal of Materials Research
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• v.17 no.10
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• pp.555-559
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• 2007

The mechanical properties and microstructure of Inconel 690 and 600 alloys with various cooling rates were investigated. Optical microscopy and scanning electron microscopy observations indicated that in case of the cooling rate of $0.5^{\circ}C/min$, discontinuous carbides along the grain boundaries were formed and when the cooling rate was $10^{\circ}C/min$, continuous carbides were formed in Inconel 690 and 600 alloys. For the annealed Inconel 690 alloy with high Cr content, a lot of annealing twins, which led the preferential growth of (111) planes, were observed. However, the annealed Inconel 600 alloy with low Cr content showed a few annealing twins and the preferential growth of (200) planes. Inconel 600 alloy had a larger value of ultimate tensile strength (UTS) than Inconel 690 alloy.

• Journal of the Korean Society for Aeronautical & Space Sciences
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• v.39 no.10
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• pp.966-978
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• 2011

Transpiration cooling is the most effective cooling technique for the high-performance liquid rockets and air-breathing engines operating in aggressive environments with higher pressures and temperatures. When applying transpiration cooling, combustor liners and turbine blades/vanes are cooled by the coolant(air or fuel) passing through their porous walls and also the exit coolant acting as an insulating film. Practical implementation of the cooling technique has been hampered by the limitations of available porous materials. But advances in metal-joining techniques have led to the development of multi-laminate porous structures such as Lamilloy$^{(R)}$ fabricated from several diffusion-bonded, etched metal thin sheets. And also with the availability of lightweight, ceramic matrix composites(CMC), transpiration cooling now seems to be a promising technique for high-performance engine cooling. This paper reviews recent research activities of transpiration cooling and its applications to gas turbines, liquid rockets, and the engines for hypersonic vehicles.

• KIEAE Journal
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• v.10 no.6
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• pp.27-32
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• 2010

Approximately 20 percentage of energy consumptions in buildings is consumed as lighting energy. Thus, most of the corporations of lighting fixture have launched low energy products. However, many researchers focused on the only luminous efficacy for energy conservation and used the evaluating tool of study. This can not gauge the precise cooling load related on generated heat of artificial lighting. In order to assess an effect of the temperature variation of lighting resources, the main purpose of this study is to predict the generated heating energy from lighting by measuring the thermal variation in scale model to reduce external noise. Also this paper used MX100 data logger to record at an interval of 1 minute for 60 minutes for the temperature of interior lightings such as incandescent lamp, fluorescent light, halogen lamp and LED lamp. As a result, LED lamp generated the lowest heat. On the other hand, incandescent lamp did the highest.

• Proceedings of the Korean Institute of Information and Commucation Sciences Conference
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• 2010.10a
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• pp.757-758
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• 2010

At the time of medical treatment and surgical operation, halogen lamp and plasma lamp were mainly used as luminous source for lighting. These two luminous sources have drawbacks that the life of lamps are not long, various problems are brought about due to excessive heat generation and its volume is very big because of cooling device. Accordingly, in this research a ring light was developed so that a partial shadowless shooting for the patient's affected area at the medical treatment room and surgical operation room using high luminance LED for which attention is being paid as new lighting parts for medical purpose. LED which was applied to the development used high luminance three color LED for full color for which various color materialization and the adjustment of radiation intensity are possible and we can get white light in order to emphasize the delicate expression for generic tone of shooting object, strong highlight, simple shadow and three dimensional effect at the time of close-up shadowless shooting of the affected area.

• Journal of Korean Physical Therapy Science
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• v.16 no.4
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• pp.19-27
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• 2009

Background: The purpose of this study was to examine changes of postural sway and weight distribution after cooling the foot. Methods: Ten men with no history of sensory, neurological and orthopedic disorders were participated in this study. They performed four methods: (1) non-treated feet group(control group); (2) both feet treated group; (3) right foot treated group; and (4) left foot treated group. The feet of them were put into ice box, then they stood more than forty seconds on EMED system with bared feet. Data on the moving length, velocity, and maximum velocity of COP and the weight distributions during thirty seconds only were measured in standing position. Results: (1) The moving length and velocity of COP were significant difference between control group and both feet treated group only(p<0.05). (2) The maximum velocity of COP was significant difference among control group and all experimental groups. (3) The changes of weight distribution were significant difference among control group and right/left foot treated groups. Conclusions: Cooling the foot led to increased postural sway and changed weight distribution patterns.

• Asian Journal of Atmospheric Environment
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• v.10 no.4
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• pp.179-189
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• 2016

Here we evaluated the effect of using water retentive pavement or WRP made from fly ash as material for main street in a real city block. We coupled computational fluid dynamics and pavement transport (CFD-PT) model to examine energy balance in the building canopies and ground surface. Two cases of 24 h unsteady analysis were simulated: case 1 where asphalt was used as the pavement material of all ground surfaces and case 2 where WRP was used as main street material. We aim to (1) predict diurnal variation in air temperature, wind speed, ground surface temperature and water content; and (2) compare ground surface energy fluxes. Using the coupled CFD-PT model it was proven that WRP as pavement material for main street can cause a decrease in ground surface temperature. The most significant decrease occurred at 1200 JST when solar radiation was most intense, surface temperature decreased by $13.8^{\circ}C$. This surface temperature decrease also led to cooling of air temperature at 1.5 m above street surface. During this time, air temperature in case 2 decreased by $0.28^{\circ}C$. As the radiation weakens from 1600 JST to 2000 JST, evaporative cooling had also been minimal. Shadow effect, higher albedo and lower thermal conductivity of WRP also contributed to surface temperature decrease. The cooling of ground surface eventually led to air temperature decrease. The degree of air temperature decrease was proportional to the surface temperature decrease. In terms of energy balance, WRP caused a maximum increase in latent heat flux by up to $255W/m^2$ and a decrease in sensible heat flux by up to $465W/m^2$.

• Journal of the Microelectronics and Packaging Society
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• v.12 no.4 s.37
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• pp.331-338
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• 2005

The rapid advances in high power light sources and arrays as encountered in incandescent lamps have induced dramatic increases in die heat flux and power consumption at all levels of high power LED packaging. The lifetime of such devices and device arrays is determined by their temperature and thermal transients controlled by the powering and cooling, because they are usually operated under rough environmental conditions. The reliability of packaged electronics strongly depends on the die attach quality, because any void or a small delamination may cause instant temperature increase in the die, leading sooner or later to failure in the operation. Die attach materials have a key role in the thermal management of high power LED packages by providing the low thermal resistance between the heat generating LED chips and the heat dissipating heat slug. In this paper, thermal transient characteristics of die attach in high power LED package have been studied based on the thermal transient analysis using the evaluation of the structure function of the heat flow path. With high power LED packages fabricated by die attach materials such as Ag paste, solder paste and Au/Sn eutectic bonding, we have demonstrated characteristics such as cross-section analysis, shear test and visual inspection after shear test of die attach and how to detect die attach failures and to measure thermal resistance values of die attach in high power LED package. From the structure function oi the thermal transient characteristics, we could know the result that die attach quality of Au/Sn eutectic bonding presented the thermal resistance of about 3.5K/W. It was much better than those of Ag paste and solder paste presented the thermal resistance of about 11.5${\~}$14.2K/W and 4.4${\~}$4.6K/W, respectively.