• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2012년도 추계학술대회 논문집
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• pp.669-670
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• 2012

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2010년도 추계학술대회 논문집
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• pp.867-868
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• 2010

• 한국재료학회지
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• 제22권12호
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• pp.650-657
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• 2012

For the purpose of improving the durability problem, translucent opal glass was fabricated as a substitute for the polycarbonate diffuser of LED lighting. Calcium phosphate was used as an opacifier of opal glass and melted in an electric furnace. The opaque effect was identified according to the change of the cooling procedure. As results, translucent opal glass was obtained by the melting of a batch with a composition of 3.8% calcium phosphate at $1550^{\circ}C$ for 2 hrs and then the cooling of the material in the furnace. For the cooling condition of the glass sample, HTCG (High Temperature Cooled Glass) was found to have better optical properties than LTAG (Low Temperature Annealed Glass). It had excellent optical properties for a diffuser of LED lighting, with no dazzling from direct light due to its high haze value of over 99% and low parallel transmittance value of under 1%. For the thermal properties, it had an expressed thermal expansion coefficient of $5.7{\times}10^{-6}/^{\circ}C$ and a softening point of $876^{\circ}C$; it also had good thermal properties such as good thermal shock resistance and was easy to apply to the general manufacturing process in the forming of glass tubes and bulbs. Therefore, it is concluded that this translucent opal glass can be used as a glass diffuser material for LED lighting with high heat resistance and high durability; this material is suitable as a substitute for polycarbonate diffusers.

• 반도체디스플레이기술학회지
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• 제17권4호
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• pp.51-55
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• 2018

As the OLED industry develops, display equipment is becoming larger. As a result, the stage required for display equipment is getting bigger. This enlargement led to increase in OLED production and industrial development. However, due to the large scale of the stage, other problems due to overheating and overheating caused by heavy load on the linear motor, which is mainly used in the stage, must be solved. In this study, a linear motor equipped with a cooling channel is modeled and the three - dimensional heat conduction flow analysis for this model is simulated using Fluent to analyze the cooling efficiency and cooling efficiency according to the cooling water flow rate. As a result, the cooling channel was effective and the cooling effect and efficiency were the best when the flow rate was about 5 ~ 10 L./min. In addition, the cooling effect is increased when the flow rate is increased, but the efficiency is significantly lowered when the flow rate is more than the predetermined value.

• 한국기계가공학회지
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• 제13권6호
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• pp.23-29
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• 2014

In this study, cooling and heat-transfer tests are performed to compare and evaluate the thermal conductivity in a prepared CNT TIM (thermal interface material). A polymerized CNT heat-transfer resin and commercial thermal grease (Shinetsu G-747) were applied for a comparison test in both cases. Cooling experiments with an aluminum foil specimen were performed in order to measure the temperature distribution using an infrared camera, and in heat radiation experiments, performance testing of the thermal conductivity was conducted using high-power LEDs. Carbon resin with the polymerization of graphite and carbon black, and CNT-polymerized CNT resin with graphite and carbon black were tested and compared with using G-747. It was found that the cooling performance and the heat transfer ability in both the carbon resin and the CNT-polymerized CNT resin were greater than those of G-747 because the temperature by 5. $0^{\circ}C$ in both cases appeared lower than that of the G-747.

• 한국기계가공학회지
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• 제18권8호
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• pp.24-30
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• 2019

This study investigated the heat dissipation characteristics of a heat-sensitive LED. The results of the empirical test showed that the best temperature intensification was found at 90 with 15-fins, and the heatsink installed perpendicular to the direction of the flow of air was directly connected to the air in the largest heat shield area, leading to the best cooling, and the number of fin also resulted increase in the heat discharge area, resulting in the largest cooling action with 15 fins. It was found that the rate of air flow changed in the range of 1.5m/s to 2.5m/s, but only by a deviation of about $2^{\circ}C$ to $3^{\circ}C$ from the current state of 15 fins at 2.5m/s, and the rate of air flow increased, but the performance of the heat release was not significantly increased. As a result wind speed with minimum air flow conditions of 1.5m/s can greatly contribute to the heat dissipation performance.

• 한국결정성장학회지
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• 제23권5호
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• pp.246-254
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• 2013

LED 조명등의 내구성 문제를 개선할 목적으로 광 확산판에 사용되는 폴리카보네이트 소재를 대체하기 위하여 반투명 유백유리를 제조하였다. 유백유리의 유백제로서 인산칼슘을 사용하였고, $1550^{\circ}C$ 전기로에서 2시간 용융하였다. 유백유리는 용융유리가 성형된 후 냉각 열처리 과정에서 상분리 및 유백입자의 성장에 의해 만들어진다. 따라서 성형 및 냉각온도를 상온, $850^{\circ}C$, $1100^{\circ}C$ 및 $1200^{\circ}C$ 로 변화시키면서 유백특성의 영향을 확인하였다. 결과적으로 가장 고온인 $1200^{\circ}C$에서 성형 및 냉각을 한 샘플에서 가장 양호한 특성을 갖는 유백유리가 얻어졌다. 이 유리는 82 % 이상의 높은 Haze 값과 10 % 미만의 낮은 평행광 투과도에 의해 직사광 투과에 의한 눈부심이 없이 LED 조명용 광확산판으로서 우수한 광특성을 나타내었다. 또한 열적특성으로서 $6.309{\times}10^{-6}/^{\circ}C$의 열팽창 계수와 $839^{\circ}C$의 연화점을 나타내었다.

• 조명전기설비학회논문지
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• 제25권12호
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• pp.34-41
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• 2011

In order to understand the thermal performance of each LED chips in multi-chip LED package, a quantitative parametric analysis of the temperature evolution was investigated by thermal transient analysis. TSP (Temperature Sensitive Parameter) value was measured and the junction temperature was predicted. Thermal resistance between the p-n junction and the ambient was obtained from the structure function with the junction temperature evolution during the cooling period of LED. The results showed that, the thermal resistance of the each LED chips in 4 chip-LED package was higher than that of single chip- LED package.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2006년도 춘계학술대회 논문집
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• pp.443-444
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• 2006

The influence of the heat sources on LED junction temperature are Engine room air, Back plate, Electric power device, and so on. LED lamp cooling system is considered to be an important subject fur high light efficiency. Because LED Chip will be problem When LED junction temperature be over $135^{\circ}C$, In this Study, The Looped Heat Pipe System is considered to prevent LED Chip fall. The LHPS is consist of evaporator part, condenser part, heat pipe part. The working fluid of LHPS is HCFC-123. In this study, to prevent LED Chipfall, we study thermal characteristics for Looped Heat Pipe System with LED lamp.

• 전기학회논문지
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• 제56권7호
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• pp.1261-1267
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• 2007

Although LEDs have been used in various applications with improving the brightness and luminous efficacy, the electrical and optical characteristics of high power LED varies at different temperature and starting time. In this paper, optimal heat sink and apparatus design were conducted using IR camera and ICEPAK on the LED bulb consisting with fourteen LED array. The temperatures of heat sink and LED device of the designed LED bulb without cooling pan were $74^{\circ}C\;and\;96.8^{\circ}C$, respectively, showing in good themal characteristics. For high efficiency driving circuit of LED array adopted optimal heat sink design, driving circuits of constant voltage and current circuits were suggested and fabricated. As a result the efficacy of all driving circuits showed more than 20 lm/W. Also, the constant current circuits are suitable for signal lamp, hallway lamp, and flash lamp having short operating time(about 30 min). On the other hand, a reading light and indoor lamp having long operating time can be controlled by constant voltage circuit.