• Proceedings of the Korean Society for Noise and Vibration Engineering Conference
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• 2007.05a
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• pp.641-648
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• 2007

Computational rotor dynamic analyses of designed composite roller for large LCD panel manufacturing process have been conducted. The present computational method is based on the general finite element method with rotating gyroscopic effects. General purpose commercial finite element code, with special rotordynamics analysis module is applied. For the purpose of numerical verification, comparison study for a benchmark dual rotor model with support bearings is also presented. Detailed finite element models for composite roller with different length are constructed and analyzed considering gravity effect in order to investigate vibration characteristics in actual operation environment. As results of the present study, rotor stability diagrams and mass unbalance responses are presented for different rotating conditions.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2006.11a
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• pp.300-301
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• 2006

We studied about new module technology to solve warpage problems that produce bending of cell in the LCD (Liquid crystal display). Characteristics of cell gap and glass bending of applying heat Panel's PAD part and cell at various temperature was investigated. When applies heat and compresses PAD party only in case of compressing COG(Chip on Glass), uniformity of cell gap that happen by glass bending by temperature of these compressing COG In the PAD party is decreased. However, in case of compress COG. glass bending of applying heat Panel's PAD part and cell at various temperature produced 20um. But, uniformity of cell gap was not decreased. Therefore, it is considered that applying heat Panel's PAD part and cell could decrease uniformity of cell gap and bending of glass.

• Proceedings of the IEEK Conference
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• 2008.06a
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• pp.515-516
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• 2008

We studied about new module technology to solve warpage problems that produce bending of cell in the LCD (Liquid crystal display). Characteristics of cell gap and glass bending of applying heat Panel's PAD part and cell at various temperature was investigated. When applies heat and compresses PAD party only in case of compressing COG(Chip on Glass), uniformity of cell gap that happen by glass bending by temperature of these compressing COG in the PAD party is decreased.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.10 no.1
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• pp.39-45
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• 2009

The CRT(Cathode Ray Tube) displays have been substituted for FPDs(Flat Panel Displays) such as LCD(Liquid Crystal Display) and PDP(Plasma Display Panel) because they have a convex surface, large volume and heavy weight. The productivity of FPDs is greatly dependent on the area of thin glass panel with $0.6{\sim}0.8mm$ thickness because FPDs are manufactured by cutting a large-scaled thin glass panel with patterns to the required product dimensions. So FPD's industries are trying to increase the area of thin glass Panel. Through FEM(Finite Element Method) analysis and fluid analysis, we developed an non-contact and air-floating conveyor system which consists of transport-module, distributor, horizontal/vertical changer and controller for the 7th generation glass panel (2,200mm in width, 1,870mm in length and 0.7mm in thickness). The design technology developed in this study can be effectively applied to a conveyor system for a larger-scaled thin glass panel.

• 한국정보디스플레이학회:학술대회논문집
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• 2000.01a
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• pp.153-154
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• 2000

Large size poly-Si TFT-LCDs have been fabricated using p-channel thin film transistors for notebook PC application. We have designed and implemented the data sampling circuit and gate drivers that operate with low power consumption and high reliability. The gate driver has a redundant structure. We have realized the uniform and excellent display quality comparable to that of CMOS module. The reliability of panel is investigated and discussed by measuring the bias stability of transistors.

• Journal of Information Display
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• v.5 no.2
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• pp.23-26
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• 2004

For high end, large area displays, all current LC modes require some degree of optical compensation to improve the front of screen viewing experience. Currently most optical films are laminated to the outside of the LCD cell, between the glass and polariser. In this paper we wish to show how it is possible to integrate the compensating optical film within a VA mode LCD cell. The paper will describe the process of making the biaxial film through the process of in-situ photopolymerisation of an aligned film of reactive mesogens in the cholesteric phase using polarised UV light. The film can be made on the colour filter array side of the LCD panel. In addition the process of fabricating a VA mode LCD containing this film will be described and the performance of this module will be presented.

• 한국정보디스플레이학회:학술대회논문집
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• 2004.08a
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• pp.773-775
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• 2004

For high end, large area displays, all current LC modes require some degree of optical compensation to improve the front of screen viewing experience. Currently most optical films are laminated to the outside of the LCD cell, between the glass and polariser. In this paper we wish to show how it is possible to integrate the compensating optical film within a VA mode LCD cell. The paper will describe the process of making the biaxial film through the process of in-situ photopolymerisation of an aligned film of reactive mesogens in the cholesteric phase using polarised UV light. The film can be made on the colour filter array side of the LCD panel. In addition the process of fabricating a VA mode LCD containing this film will be described and the performance of this module will be presented

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.46 no.6
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• pp.31-38
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• 2009

To improve the image quality and lower the power consumption of the mobile applications, it is the one of the best candidate to control the backlight unit of the LCD module with ambient light. Ambient light sensor and readout circuit were integrated in LCD panel for the mobile applications, and we designed them with LTPS TFT. We proposed noble start-up correction in order to correct the variation of the photo sensors in each panel. We used time-to-digital method for converting photo current to digital data. To effectively merge time-to-digital method with start-up correction, we proposed noble dual slope correction method. The entire readout circuit was designed and estimated with LTPS TFT process. The readout circuit has very simple and stable structure and timing, so it is suitable for LTPS TFT process. The readout circuit can correct the variation of the photo sensors without an additional equipment, and it outputs the 4-levels digital data per decade for input luminance that has a dynamic range of 60dB. The readout rate is 100 times/sec, and the linearity error for digital conversion is less than 18%.

• ETRI Journal
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• v.25 no.5
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• pp.288-296
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• 2003

In this study, we present a 260k color TFT LCD driver chip set that consumes only 5 mW in the module, which has exceptionally low power consumption. To reduce power consumption, we used many power-lowering schemes in the logic and analog design. A driver IC for LCDs has a built-in graphic SRAM. Besides write and read operations, the graphic SRAM has a scan operation that is similar to the read operation of one row-line, which is displayed on one line in an LCD panel. Currently, the embedded graphic memory is implemented by an 8-transistor leaf cell and a 6-transistor leaf cell. We propose an efficient scan method for a 6-transistor embedded graphic memory that is greatly improved over previous methods. The proposed method is implemented in a 0.22 ${\mu}m$ process. We demonstrate the efficacy of the proposed method by measuring and comparing the current consumption of chips with and without our proposed scheme.

• Laser Solutions
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• v.8 no.3
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• pp.21-26
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• 2005

A bonding process between tape-carrier package and a glass panel with anisotropic conductive film (ACF) has been investigated by making use of high power diode laser as a heat source for cure. The results from modeling of process and from optical properties of layers showed that heat absorbed from polyimide film surface and ACF layer is dominant source of curing during laser illumination. Laser ACF bonding has better bonding quality than conventional bonding in view of peel strength, flatness, pressure unbalance and processing time. New ACF bonding processes by making use of high power diode laser are proposed.