• 제목/요약/키워드: LCD manufacturing

검색결과 287건 처리시간 0.027초

단결정 다이아몬드 공구를 이용한 미세 패턴 가공성에 대한 실험적 분석 (Experimental Investigation on Machining Feasibility of Micro Patterns using a Single Crystal Diamond Tool)

  • 김현철
    • 한국기계가공학회지
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    • 제11권5호
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    • pp.76-81
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    • 2012
  • The continuing demand for increasingly slimmer and brighter liquid crystal display(LCD) panels has led to an increased focus on the role of the light guide panels(LGPs) or optical films that are used to obtain diffuse, uniform light from the backlight unit(BLU). And the most basic process in the production of such BLU components is the micromachining. LCD BLUs comprise various optical elements such as a LGP, diffuser sheet, prism sheet, and protector sheet with micro patterns. High aspect ratio patterns are required to reduce the number of sheets and enhance light efficiency, but there is a limit to the aspect ratio achievable for a given material and cutting tool. Therefore, this study comprised a series of experimental evaluations conducted to determine the machining feasibility in microcutting various aspect ratio patterns on electroless nickel plated die materials when using single-crystal diamond tools. Cutting performance was evaluated at various cutting speeds and depths of cut using different machining methods and machine tools.

LCD TV BOTTOM CHASSIS 스프링백 해석 (A springback analysis of LCD TV bottom chassis)

  • 이성근;정진오;김승규;정완진
    • Design & Manufacturing
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    • 제6권1호
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    • pp.63-66
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    • 2012
  • In the manufacturing of a LCD TV bottom chassis, the distortion after forming should be suppressed below pre-defined amount to avoid contact with electric components. Finite element analysis procedure of forming and springback of a LCD TV bottom chassis is developed to investigate the distortion behaviour. It is shown that after the first forming large distortion occur due to uneven metal flow induced by various embossings. In the second forming, distortion is decreased by introducing bead that absorbs the excessive metal flow. It is proved that analysis method could describe these behaviour effectively. The developed analysis method can be used to find the proper location and shape of bead more quickly and effectively.

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시나리오 모델을 활용한 수요 및 가격 불확실성이 존재하는 TFT-LCD 산업에서의 Robust 생산 및 수송계획 (Robust production and transportation planning for TFT-LCD industry under demand and price uncertainties using scenario model)

  • 신현준;유재필
    • 한국산학기술학회논문지
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    • 제11권9호
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    • pp.3304-3310
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    • 2010
  • 연구는 가격 및 수요 불확실성하의 강건한 (robust) 생산 및 수송 전략을 수립함으로써 수요 및 가격 불확실성이 존재하는 TFT-LCD 제조업 공급사슬망의 의사결정 문제를 해결하고자 한다. 품질로 구분되는 제품들의 생산, 재고 및 물류에 관한 의사결정을 조정하기 위해, 본 연구에서는 생산용량 제약, 해상/항공 수송 리드타임 및 용량 제약 등의 현실적인 제약조건들을 반영하는 확정적 모델을 정의하고, 시나리오 모델을 이용하여 수요 및 가격 불확실성을 함께 반영하는 확률적 혼합정수선형계획법모형들을 개발한다. 또한 개발된 확률적 모형들의 robust 솔루션을 도출하기 위한 휴리스틱 알고리즘을 제안한다. 그리고 이들 모형들로부터 산출된 솔루션의 성능을 실험을 통하여 다양한 시나리오 하에서 평가하도록 한다.

식스 시그마 기반 LCD이송장치의 Gripper부 강건설계에 관한 연구 (A Study on Six Sigma Robust Design of Gripper Part for LCD Transfer System)

  • 정원지;정동원;김상부;윤영민
    • 한국공작기계학회논문집
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    • 제15권5호
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    • pp.65-71
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    • 2006
  • This paper presents the robust design of gripper part for a high-speed LCD(Liquid Crystal Display) transfer system. In this paper, the $1^{st}$ DOE(Design of Experiment) is conducted to find out main-effect factors for the design of gripper part. Thirty-six analysis are performed using $ANSYS^{(R)}$ and their results are statistically analyzed using $MINITAB^{(R)}$, which shows that the factors, i.e., First-width, Second-width, Rec-width, and thickness of gripper part, are more important than other factors. The main effect plots shows that the maximum deflection and mass of gripper part are minimized by increasing First-width, Second-width, Rec-width and thickness. The $2^{nd}$ DOE is conducted to obtain RSM(Response Surface Method) equation. The CCD(Central Composite Design) technique with four factors is used. Optimum design is conducted using the RSM equation. Genetic algorithm is used for optimal design. Six sigma robust design is conducted to find out a guideline for control range of design parameter. To obtain six sigma level quality, the standard deviations of design parameters are shown to be controlled within 5% of average design value.

TFT-LCD 용 유리기판의 강건 최적 지지 위치의 선정에 관한 연구 (A Study on the Robust Optimal Supporting Positions of TFT-LCD Glass Panel)

  • 허재성;정병창;이태윤;곽병만
    • 대한기계학회논문집A
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    • 제30권8호
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    • pp.1001-1007
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    • 2006
  • In this paper we present robust optimal supporting positions for large glass panels used for TFT-LCD monitors when they are stored in a cassette during manufacturing process. The criterion taken is to minimize their maximum deflection. Since they are supported by some supports and have large deformations, contact analysis with a geometrically nonlinear effect is necessary. In addition, the center of a panel can not be positioned exactly as intended and should be considered as uncertainties. To take into account of these effects, the mean and the standard deviation of system response functions, particularly the deflection of the panels, need be calculated. A function approximation moment method (FAMM) is utilized to estimate them. It is a special type of response surface methodology for structural reliability analysis and can be efficiently used to estimate the two stochastic properties, that is, the system performance and the perturbations caused by uncertainties. For a design purpose, they are to be minimized simultaneously by some optimization algorithm to obtain robust optimal supporting positions.

LCD Module내 COF Bending에 따른 Lead Broken Failure의 개선 (Improvement of COF Bending-induced Lead Broken Failure in LCD Module)

  • 심범주;최열;이준신
    • 한국전기전자재료학회논문지
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    • 제21권3호
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    • pp.265-271
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    • 2008
  • TCP(Tape Carrier Package), COG (Chip On Glass), COF(Chip On Film) are three methods for connecting LDI(LCD Driver IC) with LCD panels. Especially COF is growing its portion of market place because of low cost and fine pitch correspondence. But COF has a problem of the lead broken failure in LCD module process and the usage of customer. During PCB (Printed Circuit Board) bonding process, the mismatch of the coefficient of thermal expansion between PCB and D-IC makes stress-concentration in COF lead, and also D-IC bending process during module assembly process makes the level of stress in COF lead higher. As an affecting factors of lead-broken failure, the effects of SR(Solder Resister) coating on the COF lead, surface roughness and grain size of COF lead, PI(Polyimide) film thickness, lead width and the ACF(Anisotropic Conductive Film) overlap were studied, The optimization of these affecting manufacturing processes and materials were suggested and verified to prevent the lead-broken failure.

0-1 혼합정수계획법을 이용한 LCD 패널 절단 문제 최적화 (Optimization of LCD Panel Cutting Problem Using 0-1 Mixed Integer Programming)

  • 김기동;박현지;심윤섭;전태보
    • 센서학회지
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    • 제26권4호
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    • pp.274-279
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    • 2017
  • LCD(Liquid Crystal Display) panel cutting problem is a sort of two dimensional cutting stock problem. A cutting stock problem is problem that it minimizes the loss of the stock when a stock is cut into various parts. In the most research of the two dimensional cutting stock problem, it is supposed that the relative angle of a stock and parts is not important. Usually the angle is regarded as horizontal or perpendicular. In the manufacturing of polarizing film of LCD, the relative angle should be maintained at some specific angle because of the physical and/or chemical characteristics of raw material. We propose a mathematical model for solving this problem, a two-dimensional non-Guillotine cutting stock problem that is restricted by an arranged angle. Some example problems are solved by the C++ program using ILOG CPLEX classes. We could get the verification and validation of the suggested model based on the solutions.

Red, Green, Blue CCFL을 이용한 Backlight Unit 개발 (Development of Backlight Unit by using Red, Green, Blue CCFL)

  • 양승수;송영기;김서윤;이정열
    • 한국전기전자재료학회:학술대회논문집
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    • 한국전기전자재료학회 2006년도 하계학술대회 논문집 Vol.7
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    • pp.414-415
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    • 2006
  • At present, Characteristic of high color reproduction for LCD products needed in Display market. Therefore, The improving methods of high color reproduction are alteration of color Filter or Red, Green, Blue phosphor alteration of CCFL. But High color reproduction phosphor is short life time as compared with conventional phosphor. In this experiment, by using split the Red, Green, Blue CCFL with high color reproduction phosphor instead of conventional high color reproduction CCFL. We knew that the high color reproduction RGB split CCFL BLU has same spectrum data and chromaticity, but has long life time as manufacturing RGB split CCFL and reduce chromaticity shift following long time discharge as compared with conventional high color reproduction CCFL.

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트리즈 기법을 활용한 삼성전자의 TFT-LCD 기술혁신 사례연구 (Case study of SAMSUNG TFT-LCD Technology Innovation using TRIZ method)

  • 반병섭
    • 한국산학기술학회논문지
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    • 제15권6호
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    • pp.3429-3434
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    • 2014
  • TFT-LCD 패널 제조 산업에서 삼성전자는 후발기업으로써 선발기업인 일본의 샤프를 추월하여 선도하고 있다. 트리즈 시스템 분석을 활용하여 디스플레이 산업은 노트, 모니터, TV & 모바일 제품 시장으로 변화를 하였으며 시장(고객)의 요구속성도 변화를 함을 제시하였다. 또한 삼성의 TFT-LCD 기술 중 빠른 응답 기술 혁신 사례를 제시하였다. 예를 들면, 응답속도 개선을 위해 기존 사용하고 있는 액정 혼합물에 트리즈의 모순성, 물질-장 방법 등을 활용하여 개발된 고복굴절률 액정물질을 첨가하여 광시야 각, 빠른응답 특성을 갖는 신규 액정 혼합물을 개발하였다. 새로운 액정혼합물의 응답속도는 60%정도로 단축 개선되었다(기존 액정 사용 시 16 ms, 새로운 액정혼합물 사용 시 10ms).

명암도 분포 및 형태 분석을 이용한 효과적인 TFT-LCD 필름 결함 영상 분류 기법 (An effective classification method for TFT-LCD film defect images using intensity distribution and shape analysis)

  • 노충호;이석룡;조문신
    • 한국멀티미디어학회논문지
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    • 제13권8호
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    • pp.1115-1127
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    • 2010
  • TFT-LCD 생산 과정에서 발생하는 결함을 정확하게 분류하여 결함 유형에 따라 폐기, 사용가능 등의 의사결정을 적절하게 내리는 것은 수율 증가 및 생산성 향상에 필수적인 요소이다. 본 논문에서는 TFT-LCD 생산 라인에서 획득한 결함 영상에 대하여 명암도 분포(intensity distribution) 및 결함 영상의 형태 특징(shape feature)을 분석하여 효과적으로 필름 결함 유형을 분류하는 기법을 제시한다. 본 연구에서는 먼저 필름 결함 영상을 결함 영역과 결함이 아닌 배경 영역으로 이진화하고, 결함 영역에서 결함의 선형성(linearity), 명암도 분포를 고려한 형태 특징 등의 여러 가지 특징을 분석하여 기준 영상(referential image) 데이터베이스를 구축하였으며, 분류하고자 하는 결함 영상과 데이터베이스에 저장된 기준 영상과의 매칭 비용 함수(matching cost function)를 정의하여 적절히 매칭시킴으로써 결함의 유형을 결정하였다. 제시한 기법의 성능을 검증하기 위하여 실제 TFT-LCD 생산 라인에서 획득한 결함 영상들을 대상으로 분류 실험을 수행하였으며, 실험 결과 생산 라인에서 이용할 수 있을 정도의 상당한 수준의 분류 정확도를 달성하였음을 보여주었다.