• Korean Chemical Engineering Research
• /
• v.49 no.6
• /
• pp.739-744
• /
• 2011

Activated carbon SCR(CSCR) catalyst that is used to remove $NO_x$ in exhaust gas including boron discharged from the production process of liquid crystal display(LCD) shows deactivation when boron is deposited to block the pores within the catalyst or to cover its active sites. The spent carbon catalyst is regenerated by washing with various surfactants, drying and calcination. For comparison of the physical and chemical properties before and after the regeneration with the variables, type of surfactants and calcination condition, element analysis by ICP, $N_{2}$ adsorption were conducted. $DeNO_{x}$ in SCR with $NH_3$ was carried out in a fixed bed reactor at $120^{\circ}C$. The activated carbon catalyst regenerated through washing with a non-ionic surfactant in $H_{2}O$ at $90^{\circ}C$ and calcination under $N_{2}$ gas at $550^{\circ}C$ shows similar level of surface area and $NO_x$ removal efficiency with those of fresh catalyst.

• Journal of the Institute of Electronics Engineers of Korea SD
• /
• v.44 no.10
• /
• pp.49-54
• /
• 2007

As digital contents based on 3D graphics are increased, the requirement for low power 3D graphic hardware for mobile devices is increased. We design a transformation engine for mobile 3D graphic processor. We propose a simplified transformation engine for mobile 3D graphic processor. The area of the transformation engine is reduced by merging a mapping transformation unit into a projective transformation unit and by replacing a clipping unit with a selection unit. It consists of a viewing transformation unit a projective transformation unit a divide by w nit, and a selection unit. It can process 32 bit floating point format of the IEEE-754 standard or a reduced 24 bit floating point format. It has a pipelined architecture so that a vertex is processed every 4 cycles except for the initial latency. The RTL code is verified using an FPGA.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
• /
• 2005.07a
• /
• pp.441-443
• /
• 2005

According as CCFL(Cold Cathode Fluorescent lamp) of light source in Backlight unit for Note PC (Personal computer) is presently needed to low power consumption and long life time, the development focus of CCFL is going on the discharge gas, phosphor and electrode material. First of all, discharge voltage characteristic of CCFL is closely connected with electrode material For low discharge voltage, the characteristic of electrode material is needed to low work function, low sputtering ratio and superior manufacturing property. We developed new CCFL with Nb/Ni Clad electrode superior to conventional CCFL. Because Nb/Ni Clad electrode with Ni material and Nb material, the electrical characteristic is superior to other electrode materials. The electrode of Nb/Ni Clad is composed that Ni of outside material has superior manufacturing property and Nb of inside material has low work function. Nb/Ni Clad of new electrode material is made by process of Rolling mill at high pressure and heat treatment. We compared electrical characteristic of Nb/Ni clad electrode with conventional Mo electrode by measurement. Mo electrode and Nb/Ni Clad electrode of cup type with diameter 1.1 mm and length 3.0mm are used to this experiment. Material content of Mo electrode is Mo 100%. But, Nb/Ni Clad electrode is composed by content of Nb 40% and Ni 60%. The result of comparison measurement between new CCFL with Nb/Ni Clad electrode and conventional CCFL was appeared that CCFL with Nb/Ni Clad electrode had superior characteristic than conventional CCFL. As a result of experiment, we completed Note PC with low power consumption and long life time by application of new CCFL with Nb/Ni Clad electrode.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
• /
• v.24 no.6
• /
• pp.473-479
• /
• 2011

In this paper, we have compared amorphous InGaZnO (a-IGZO) thin-film transistor (TFT) with the nano-crystalline embedded-IGZO ($N_c$-embedded-IGZO) TFT fabricated by solid-phase crystallization (SPC) technique. The field effect mobility (${\mu}_{FE}$) of $N_c$-embedded-IGZO TFT was 2.37 $cm^2/Vs$ and the subthreshold slope (S-factor) was 0.83 V/decade, which showed lower performance than those of a-IGZO TFT (${\mu}_{FE}$ of a-IGZO was 9.67 $cm^2/Vs$ and S-factor was 0.19 V/decade). This results originated from generation of oxygen vacancies in oxide semiconductor and interface between gate insulator and semiconductor due to high temperature annealing process. However, the threshold voltage shift (${\Delta}V_{TH}$) of $N_c$-embedded-IGZO TFT was 0.5 V, which showed 1 V less shift than that of a-IGZO TFT under constant current stress during $10^5$ s. This was because there were additionally less increase of interface trap charges in Nc-embedded-IGZO TFT than a-IGZO TFT.

• Proceedings of the Korean Institute of Surface Engineering Conference
• /
• 2003.05a
• /
• pp.41-41
• /
• 2003

텅스텐(W)은 높은 thermal stability 와 process compatibility 및 우수한 corrosion r resistance 둥으로 integrated circuit (IC)의 gate 및 interconnection 둥으로의 활용이 대두되고 있으며, 차세대 thin film transistor liquid crystal display (TFT-LCD)의 gate 및 interconnection m materials 둥으로 사용되고 았다. 그러나, 이러한 장점을 가지고 있는 팅스텐 박막이 실제 공정상에 적용되가 위해서는 건식 식각이 주로 사용되는데, 이는 wet chemical 을 이용한 습식 식각을 사용할 경우 낮은 etch rate, line width 의 감소 및 postetch residue 잔류 동의 문제가 발생하기 때문이다. 또한 W interconnection etching 을 하기 위해서는 높은 텅스텐 박막의 etch rate 과 하부 layer ( (amorphous silicon 또는 poly-SD와의 높은 etch selectivity 가 필수적 이 라 할 수 있다. 그러 나, 지금까지 연구되어온 결과에 따르면 텅스탠과 하부 layer 와의 etch selectivity 는 2 이하로 매우 낮게 관찰되고 았으며, 텅스텐의 etch rate 또한 150nm/min 이하로 낮은 값을 나타내고 있다. 따라서 본 연구에서는 halogen-based inductively coupled plasma 를 이용하여 텅스텐 박막 식각시 여러 가지 첨가 가스에 따른 높은 텅스탠 박막의 etch rate 과 하부 layer 와의 높은 etch s selectivity 를 얻고자 하였으며, 그에 따른 식각 메커니즘에 대하여 알아보고자 하였다. $CF_4/Cl_2$ gas chemistry 에 첨 가 가스로 $N_2$와 Ar을 첨 가할 경 우 텅 스텐 박막과 하부 layer 간의 etch selectivity 증가는 관찰되지 않았으며, 반면에 첨가 가스로 $O_2$를 사용할 경우, $O_2$의 첨가량이 증가함에 따라 etch s selectivity 는 계속적으로 증가렴을 관찰할 수 있었다. 이는 $O_2$ 첨가에 따라 형성되는 WOF4 에 의한 텅스텐의 etch rates 의 감소에 비하여, $Si0_2$ 등의 형성에 의한 poly-Si etch rates 이 더욱 크게 감소하였기 때문으로 사료된다. W 과 poly-Si 의 식각 특성을 이해하기 위하여 X -ray photoelectron spectroscopy (XPS)를 사용하였으며, 식각 전후의 etch depth 를 측정하기 위하여 stylus p pmfilometeT 를 이용하였다.

• Transactions of the Korean Society of Mechanical Engineers B
• /
• v.37 no.6
• /
• pp.577-582
• /
• 2013

AZO (aluminum-doped zinc oxide) is one of the best candidate materials to replace ITO (indium tin oxide) for TCOs (transparent conductive oxides) used in flat panel displays, organic light-emitting diodes (OLEDs), and organic solar cells (OSCs). In the present study, to apply an AZO thin film to the transparent electrode of an organic solar cell, a low-temperature selective atomic layer deposition (ALD) process was adopted to deposit an AZO thin film on a flexible poly-ethylene-naphthalate (PEN) substrate. The reactive gases for the ALD process were di-ethyl-zinc (DEZ) and tri-methyl-aluminum (TMA) as precursors and H2O as an oxidant. The structural, electrical, and optical characteristics of the AZO thin film were evaluated. From the measured results of the electrical and optical characteristics of the AZO thin films deposited on the PEN substrates by ALD, it was shown that the AZO thin film appeared to be comparable to a commercially used ITO thin film, which confirmed the feasibility of AZO as a TCO for flexible organic solar cells in the near future.

• Journal of the Korean Chemical Society
• /
• v.44 no.5
• /
• pp.453-459
• /
• 2000

FED has deserved an intensive attentioD as a new flat panel display. The present investigationaims at undemtanding the photoluminescence and cathodoluminescent properties of hGaO$_3$: $Eu^{3+}$ phosphor bytaking into account the possibility that this phosphor could be applied for FED. In onler to investigate on.sucha detailed behavior; 8everM experimental skil18 Je conducted to the LaGaO$_3$:$Eu^{3+}$ phosphoL The excimtion srectrum artd emission spectmn were rnezsured in the UV range and then decay curve of $^5D_0$+$^7F_j$transitions\vas examined. The decay behavior of $^5D_0$ emission was anMyzed by a newly Iuoposed cross-relaxation mech-ani8In in asswiation with inteFwnter di1ffision (or migration). The cross-mlaxation from $^5D_0$ to CTB (Cha'geTransfer Band) wuld be a quite retsonable by considering the excitation spectrum. It could be also found thatthe quenching type was changed from ditfrsion controlled process to the direct quenching process -s inJeasing $Eu^{3+}$ oncntration.

• Archives of design research
• /
• v.18 no.3 s.61
• /
• pp.85-94
• /
• 2005

Most of product designers use 3D CAD system as a inevitable design tool nowadays and many new products are developed through a concurrent engineering process. However, it is very difficult for novice designers to get the sense of reality from modeling objects shown in the computer screens. Such a intangibility problem comes from the lack of haptic interactions and contextual information about the real space because designers tend to do 3D modeling works only in a virtual space of 3D CAD system. To address this problem, this research investigate the possibility of a interactive quantified structure simulation for product design using AR(augmented reality) which can register a 3D CAD modeling object on the real space. We built a quantified structure simulation system based on AR and conducted a series of experiments to measure how accurately human perceive and adjust the size of virtual objects under varied experimental conditions in the AR environment. The experiment participants adjusted a virtual cube to a reference real cube within 1.3% relative error(5.3% relative StDev). The results gave the strong evidence that the participants can perceive the size of a virtual object very accurately. Furthermore, we found that it is easier to perceive the size of a virtual object in the condition of presenting plenty of real reference objects than few reference objects, and using LCD panel than HMD. We tried to apply the simulation system to identify preference characteristics for the appearance design of a home-service robot as a case study which explores the potential application of the system. There were significant variances in participants' preferred characteristics about robot appearance and that was supposed to come from the lack of typicality of robot image. Then, several characteristic groups were segmented by duster analysis. On the other hand, it was interesting finding that participants have significantly different preference characteristics between robot with arm and armless robot and there was a very strong correlation between the height of robot and arm length as a human body.

• Journal of the Institute of Electronics Engineers of Korea SP
• /
• v.47 no.4
• /
• pp.63-68
• /
• 2010

The Color Management System in recent printers adopts ICC profiles for both monitors and printers. However, the ICC profile doesn't contain the characteristics of reproduced color on each monitor, because the color on each monitor is changed by user adjustment such as color temperature, brightness, and contrast adjustment. It is also depended on the backlight type and lifetime. As a result, unwanted color is reproduced on the printed paper, not like that on the monitor. To overcome the color difference between monitors and printers, it is needed to control the information of ICC profile. That is, first, the ICC profile is generated by the measurement of monitors having user set, then, through the CMS, the color on monitors can be produced on printed paper. However, it is difficult to apply the above system for normal users due to absence of measuring equipment and time consuming process. Therefore, this paper proposes a novel color matching technique based on the estimation of condition for each monitor having user set. The estimation is performed by a simple comparison visual test using a test image on printed paper and monitor. Then, the condition of monitor is applied to the ICC profile. As a result, the new ICC profile contains the color difference between user monitor and printer. The experimental results show the printed images using our proposed method have almost similar color with those on monitors.

• Journal of the Korean Society for Precision Engineering
• /
• v.28 no.7
• /
• pp.777-782
• /
• 2011

Micro features on the surface are well-known to have significant effects on optical or mechanical properties such as the optical interference, reflectance at the surface, contact angle, interfacial friction, etc. These surface micro features are increasingly employed to enhance the functionality of the applications in various application areas such as optical components for LCD or solar panel. Diverse surface features have been proposed and some of them are showing excellent efficiency or functionality, especially in optical applications. Most applications employing the micro features need manufacturing process for mass production and the injection molding and roll-to-roll forming, which are typical processes for mass production adopting polymeric materials, may be also preferred for micro patterned plastic product. Since the functionality or efficiency of the surface structures generally depends on the shape and the size of the structure itself or the array of the structures on the surface, it would be very important to replicate the features very precisely as being designed during the molding the micro pattern applications. In this paper, a series of research activities is introduced for roll-to-roll forming of micro patterned film including filling of patterns with UV curable resin, demolding of surface structures from the roll tool, control of surface energy and cure shrinkage of resin and dispose time and intensity of the UV light for curing of UV curable resin.