• 제목/요약/키워드: LCD Process

검색결과 634건 처리시간 0.036초

액정 디스플레이 공정별 유해요인 및 비접촉식 액정 배향 법 연구동향 (Harmful Factors by Liquid Crystal Display Process and Research Trends on Non-Contact Liquid Crystal Alignment Methods)

  • 김대현
    • 한국재난정보학회:학술대회논문집
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    • 한국재난정보학회 2023년 정기학술대회 논문집
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    • pp.215-216
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    • 2023
  • 본 논문에서는 액정 디스플레이 산업에서 발생하는 공정별 유해요인 및 연구동향에 대해 조사하였다. 액정 디스플레이는 컴퓨터, 텔레비전, 태블릿, 스마트폰 등에서 사용되는 주요 디스플레이 기술로, 빠른 응답속도와 저전력 운영, 높은 해상도 등을 제공한다. 액정 디스플레이 제조에서 중요한 역할을 하는 액정 배향 기술은 러빙 천을 사용하는 물리적 배향법과 같은 기존 방법의 단점을 극복하기 위해 비접촉식 액정 배향법과 같은 연구가 진행 중이다. 액정 디스플레이 제조과정은 TFT, 컬러필터, 액정, 모듈 단계로 이루어져 있으며 이 과정에서 사용되는 다양한 화학물질은 작업자에게 노출 될 수 있다. 그러므로 유해요인의 관리와 분석, 공정의 개선, 그리고 화학 물질 사용 최소화와 같은 기술에 대한 연구가 중요하다. 최근에는 비접촉식 액정 배향법 및 박막 제작 기술에 대한 연구가 활발히 진행 중이며, 소자 오염 및 배향 공정 등에서 발생하는 유해요인을 최소화하기 위한 노력이 계속되고 있다.

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Photo Resistor Reflow 방법을 이용한 오프셋 마스크를 이용하지 않는 새로운 자기 정합 폴리 실리콘 박막 트랜지스터 (Self-aligned Offset Gated Poly-Si TFTs by Employing a Photo Resistor Reflow Process)

  • 박철민;민병혁;한민구
    • 대한전기학회:학술대회논문집
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    • 대한전기학회 1995년도 하계학술대회 논문집 C
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    • pp.1085-1087
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    • 1995
  • A large leakage current may be one of the critical issues for poly-silicon thin film transistors(poly-Si TFTs) for LCD applications. In order to reduce the leakage current of poly-Si TFTs, several offset gated structures have been reported. However, those devices, where the offset length in the source region is not same as that in the drain region, exhibit the asymmetric electrical performances such as the threshold voltage shift and the variation of the subthreshold slope. The different offset length is caused by the additional mask step for the conventional offset structures. Also the self-aligned implantation may not be applicable due to the mis-alignment problem. In this paper, we propose a new fabrication method for poly-Si TFTs with a self-aligned offset gated structure by employing a photo resistor reflow process. Compared with the conventional poly-Si TFTs, the device is consist of two gate electrodes, of which one is the entitled main gate where the gate bias is employed and the other is the entitled subgate which is separate from both sides of the main gate. The poly-Si channel layer below the offset oxide is protected from the injected ion impurities for the source/drain implantation and acts as an offset region of the proposed device. The key feature of our new device is the offset lesion due to the offset oxide. Our experimental results show that the offset region, due to the photo resistor reflow process, has been successfully obtained in order to fabricate the offset gated poly-Si TFTs. The advantages of the proposed device are that the offset length in the source region is the same as that in the drain region because of the self-aligned implantation and the proposed device does not require any additional mask process step.

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COG용 Solder Bump 제작을 위한 Ni 무전해 도금 공정에 관한 연구 (A Study on Ni Electroless Plating Process for Solder Bump COG Technology)

  • 한정인
    • 한국재료학회지
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    • 제5권7호
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    • pp.794-801
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    • 1995
  • LCD 모듈을 위한 실장 기술인 Chip on Glass 공정 기술을 개발함에 있어 구동 IC와 기판d의 Al 전극을 연결하기 위하여 기존의 기술과의 연관성 및 공정의 연속성, 제조단가등을 고려하여 Pb-Sn 범프를 사용하고자 하였으며 이를 위해 Al 금속 박막위에 니켈 무전해 도금하는 방법을 연구 하였다. Al 전극에 무전해 니켈 도금하기 위해서는 광레지스트 차폐막을 손상하지 않는 전처리 방법이 필요하기 때문에 전처리 방법으로서 알칼리 아연산염 처리법과 불화물을 이용한 아연산염 처리법을 선택하여 실시하였다. 이 가운데 산성불화암모늄(NH$_4$HF)을 1.5 g/$\ell$ 함유하고 황산아연(ZnSO$_4$)을 100 g/$\ell$ 함유한 산성 아연산염 용액에서는 광레지스트 차폐막이 손상되지 않았으며 처리시간을 적절히 조절함으로써 알루미늄 박막상에 선택적으로 니켈 무전해 도금을 할 수 있었다. 아연산염 응액중의 첨가제와 무전해 도금액 중의 억제제인 Thiourea는 도금층의 평활도를 높이는 역할을 하였다. 또한 아연산염 처리를 하기 전에 산세 처리를 함으로써 도금층의 균일성을 향상시킬 수 있었다.

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인공지능을 이용한 이종액체 정상 상태 혼합의 혼합과정 해석 (Analyses of Steady State Mixing Process of Two-Liquids Using Artificial Intelligence)

  • 공대경;염주호;조경래;도덕희
    • 한국수소및신에너지학회논문집
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    • 제29권5호
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    • pp.523-529
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    • 2018
  • Two liquids which are generally used as fuels of rockets are mixed and their mixing process is quantitatively investigated by the use of particle image velocimetry (PIV). As working fluids for the liquid mixing, Dimethylfuran (DMF) and JetA1 oils have been used. Since the specific gravity of DMF is larger than that of JetA1 oil, the DMF oil has been set at the lower part of the JetA1 oil. For better visualization of the mixing process, Rhodamin B powder has been blended into the DMF oil. An agitator having 3 blades has been used for mixing the two liquids. For quantitative visualization, a LCD monitor has been used as a light source. A color camera, camcoder, has been used for recording the mixing process. The images captured by the camcoder have been digitized into three color components, R, G, and B. The color intensities of R, G, and B have been used as the inputs of the neural network of which hidden layer has 20 neurons. Color-to-concentration calibration has been performed before commencing the main experiments. Once this calibration is completed, the temporal changes of the concentration of the DMF has been quantitatively analyzed by using the constructed measurement system.

반도체(半導體) 제조공정(製造工程)에서 발생하는 혼산폐액(混酸廢液)으로부터 고순도(高純度) 인산회수(燐酸回收) (Recovery of high-purity phosphoric acid from the waste acids in semiconductor manufacturing process)

  • 박성국;노유미;이상길;김주엽;신창훈;김준영;안재우
    • 자원리싸이클링
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    • 제15권5호
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    • pp.26-32
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    • 2006
  • LCD와 반도체 제조공정에서 발생하는 인산, 질산, 초산, Al, Mo 등이 혼재하고 있는 인산계 혼산폐액을 액정제조공정에서 사용할 수 있는 고순도 에칭액으로 재활용하기 위해서 용매추출법, 진공증발법, 확산투석법 및 이온교환법의 각각의 기술적 특성을 살린 혼합 처리공정을 이용하여 고순도 인산회수 기술을 확립하고 상용화 시스템을 개발하고자 하였다. 시험 결과 진공증발에 의해 질산과 초산을 100% 제거할 수 있었고, TOP를 이용한 용매추출에서도 추출 4단, 탈거 6단으로 완벽하게 제거할 수 있었다. 이온교환의 전단계로 적용한 확산투석에서 Al 97.5%, Mo 36.7% 제거할 수 있었고 이온교환공정에서 Al 및 Mo를 각각 1ppm이하로 정제할 수 있었다.

이온빔 에너지에 따른 액정배향막의 전기광학적 특성연구 (Properties of liquid crystal alignment layers exposued to ion-beam irradiation enemies)

  • 오병윤;이강민;박홍규;김병용;강동훈;한진우;김영환;한정민;이상극;서대식
    • 한국전기전자재료학회:학술대회논문집
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    • 한국전기전자재료학회 2007년도 추계학술대회 논문집
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    • pp.430-430
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    • 2007
  • In general, polyimides (PIs) are used in liquid crystal displays (LCDs) as alignment layer of liquid crystals (LCs). Up to date, the rubbing alignment technique has been widely used to align liquid crystals on the PI surface, which is suitable for mass-production of LCDs because of its simple process and high productivity. However, this method has some disadvantages. Rubbed PI surfaces include the debris left by the cloth and the generation of electrostatic charges during rubbing process. Therefore, rubbing-free techniques for LC alignment are strongly required in LCD technology. In this experiment, PI was uniformly coated on indium-tin-oxide electrode substrates to form LC alignment layers using a spin-coating method and the PI layers were subsequently imidized at 433 K for 1 h. The thickness of the PI layer was set at 50 nm. The LC alignment layer surfaces were exposed to an $Ar^+$ ion-beam under various ion-beam energies. The antiparallel cells and twisted-nematic (TN) cells for the measurement of pretile angle and electro-optical characteristics were fabricated with the cell gap of 60 and $5\;{\mu}m$, respectively. The LC cells were filled with nematic LC (NLC, MJ001929, Merck) and were assembled. The NLC alignment capability on ion-beam-treated PI was observed using photomicroscope and the pretilt angle of the NLC was measured by the crystal-rotation method at room temperature. Voltage-transmittance (V-T) and response time characteristics of the ion-beam irradiated TN cell were measured by a LCD evaluation system.

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Gravure Offset 인쇄에 의한 미세 전극용 Ag Paste 개발 (Gravure Offset Printed on Fine Pattern by Developing Electrodes for the Ag Paste)

  • 이상윤;장아람;남수용
    • 한국인쇄학회지
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    • 제30권3호
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    • pp.45-56
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    • 2012
  • Printing technology is accepted by appropriate technology that smart phones, tablet PC, display(LCD, OLED, etc.) precision recently in the electronics industry, the market grows, this process in the ongoing efforts to improve competitiveness through the development of innovative technologies. So printed electronics appeared by new concept. This technology development is applied on electronic components and circuits for the simplification of the production process and reduce processing costs. Low-temperature process making possible for widening, slimmer, lighter, and more flexible, plastic substrates, such as(flexible) easily by forming a thin film on a substrate has been studied. In the past, the formation of the electrode used a screen printing method. But the screen printing method is formation of fine patterns, high-speed printing, mass production is difficult. The roll-to-roll printing method as an alternative to screen printing to produce electronic devices by printing techniques that were used traditionally in the latest technology and processing techniques applied to precision control are very economical to implement fine-line printing equipment has been evaluated as. In order to function as electronic devices, especially the dozens of existing micro-level of non-dot print fine line printing is required, the line should not break at all, because according to the specifications required to fit the ink transfer conditions should be established. In this study of roll-to-roll printing conductive paste suitable for gravure offset printing by developing Ag paste for forming fine patterns to study the basic physical properties with the aim of this study were to.

이광자 광중합 공정을 이용한 3차원 미세구조물 제작기술 동향 (Recent Progress in the Nanoscale Additive Layer Manufacturing Process Using Two-Photon Polymerization for Fabrication of 3D Polymeric, Ceramic, and Metallic Structures)

  • 하철우;임태우;손용;박석희;박상후;양동열
    • 한국정밀공학회지
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    • 제33권4호
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    • pp.265-270
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    • 2016
  • Recently, many studies have been conducted on the nano-scale fabrication technology using twophoton- absorbed polymerization induced by a femtosecond laser. The nano-stereolithography process has many advantages as a technique for direct fabrication of true three-dimensional shapes in the range over several microns with sub-100 nm resolution, which might be difficult to obtain by using general nano/microscale fabrication technologies. Therefore, two-photon induced nano-stereolithography has been recently recognized as a promising candidate technology to fabricate arbitrary 3D structures with sub-100 nm resolution. Many research works for fabricating novel 3D nano/micro devices using the two-photon nano-stereolithography process, which can be utilized in the NT/BT/IT fields, are rapidly advancing.

Application of Inkjet Technology in Flat Panel Display

  • Ryu, Beyong-Hwan;Choi, Young-Min
    • 한국정보디스플레이학회:학술대회논문집
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    • 한국정보디스플레이학회 2005년도 International Meeting on Information Displayvol.II
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    • pp.913-918
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    • 2005
  • It is expected that the inkjet technology offers prospect for reliable and low cost manufacturing of FPD (Flat Panel Display). This inkjet technology also offers a more simplified manufacturing process for various part of the FPD than conventional process. For example, recently the novel manufacturing processes of color filter (C/F) in LCD, or RGB patterning in OLED by inkjet printing method have been developed. This elaborates will be considered as the precious point of manufacturing process for the mass production of enlarged-display panel with a low price. On this point of view, we would like to review the status of inkjet technology in FPD, with some results on forming micro line by inkjet patterning of suspension type silver nano ink as below. We have studied the inkjet patterning of synthesized aqueous silver nano-sol on interface-controlled ITO glass substrate. Furthermore, we designed the conductive ink for direct inkjet patterning on bare ITO glass substrate. The first, the highly concentrated polymeric dispersant-assisted silver nano sol was prepared. The high concentration of batch-synthesized silver nano sol was possible to 40 wt%. At the same time the particle size of silver nanoparticles was below $10{\sim}20nm$. The second, the synthesized silver nano sol was inkjet - patterned on ITO glass substrate. The connectivity and width of fine line depended largely on the wettability of silver nano sol on ITO glass substrate, which was controlled by surfactant. The relationship was understood by wetting angle. The line of silver electrode as fine as $50{\sim}100\;{\mu}m$ was successfully formed on ITO glass substrate. The last, the direct inkjet-patternable silver nano sol on bare ITO glass substrate was designed also.

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Decrease of Global Warming Effect During Dry Etching of Silicon Nitride Layer Using C3F6O/O2 Chemistries

  • Kim, Il-Jin;Moon, Hock-Key;Lee, Jung-Hun;Jung, Jae-Wook;Cho, Sang-Hyun;Lee, Nae-Eung
    • 한국진공학회:학술대회논문집
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    • 한국진공학회 2012년도 제42회 동계 정기 학술대회 초록집
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    • pp.459-459
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    • 2012
  • Recently, the discharge of global warming gases in dry etching process of TFT-LCD display industry is a serious issue because perfluorocarbon compound (PFC) gas causes global warming effects. PFCs including CF4, C2F6, C3F8, CHF3, NF3 and SF6 are widely used as etching and cleaning gases. In particular, the SF6 gas is chemically stable compounds. However, these gases have large global warming potential (GWP100 = 24,900) and lifetime (3,200). In this work, we chose C3F6O gas which has a very low GWP (GWP100 = <100) and lifetime (< 1) as a replacement gas. This study investigated the effects of the gas flow ratio of C3F6O/O2 and process pressure in dual-frequency capacitively coupled plasma (CCP) etcher on global warming effects. Also, we compared global warming effects of C3F6O gas with those of SF6 gas during dry etching of a patterned positive type photo-resist/silicon nitride/glass substrate. The etch rate measurements and emission of by-products were analyzed by scanning electron Microscopy (SEM; HITACI, S-3500H) and Fourier transform infrared spectroscopy (FT-IR; MIDAC, I2000), respectively. Calculation of MMTCE (million metric ton carbon equivalents) based on the emitted by-products were performed during etching by controlling various process parameters. The evaluation procedure and results will be discussed in detail.

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