• The Journal of Society for e-Business Studies
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• v.24 no.3
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• pp.19-33
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• 2019

Recently, manufacturers have been struggling to efficiently use production equipment as their production methods become more sophisticated and complex. Typical factors hindering the efficiency of the manufacturing process include setup cost due to job change. Especially, in the process of using expensive production equipment such as semiconductor / LCD process, efficient use of equipment is very important. Balancing the tradeoff between meeting the deadline and minimizing setup cost incurred by changes of work type is crucial planning task. In this study, we developed a scheduling model to achieve the goal of minimizing the duedate and setup costs by using reinforcement learning in parallel machines with duedate and work preparation costs. The proposed model is a Deep Q-Network (DQN) scheduling model and is a reinforcement learning-based model. To validate the effectiveness of our proposed model, we compared it against the heuristic model and DNN(deep neural network) based model. It was confirmed that our proposed DQN method causes less due date violation and setup costs than the benchmark methods.

• Journal of the Korean Society for Precision Engineering
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• v.27 no.7
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• pp.28-35
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• 2010

In the display industry, COG bonding method is being applied to production of LCD panels that are used for mobile phones and monitors, and is one of the mounting methods optimized to compete with the trend of ultra small, ultra thin and low cost of display. In COG bonding process, electrical characteristics such as contact resistance, insulation property, etc and mechanical characteristics such as bonding strength, etc depend on properties of conductive particles and epoxy resin along with ACF materials used for COG by manufacturers. As the properties of such materials have close relation to optimization of bonding conditions such as temperature, pressure, time, etc in COG bonding process, it is requested to carry out an in-depth study on characteristics of COG bonding, based on which development of bonding process equipment shall be processed. In this study were analyzed the characteristics of COG bonding process, performed the analysis and reliability evaluation on electrical and mechanical characteristics of COG bonding using ACF to find optimum bonding conditions for ACF, and performed the experiment on bonding characteristics regarding fine pitch to understand the affection on finer pitch in COG bonding. It was found that it is difficult to find optimum conditions because it is more difficult to perform alignment as the pitch becomes finer, but only if alignment has been made, it becomes similar to optimum conditions in general COG bonding regardless of pitch intervals.

• Journal of the Semiconductor & Display Technology
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• v.12 no.2
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• pp.79-84
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• 2013

Nanoimprint lithography (NIL) is the next generation photolithography process in which the photoresist is dispensed onto the substrate in its liquid form and then imprinted and cured into a desired pattern instead of using traditional optical system. There have been considerable attentions on NIL due to its potential abilities that enable cost-effective and high-throughput nanofabrication to the display device and semiconductor industry. Although one of the current major research trends of NIL is large-area patterning, the technical difficulties to keep the uniformity of the residual layer become severer as the imprinting area increases more and more. In this paper, with the rolling type imprinting process, a mold, placed upon the $2^{nd}$ generation TFT-LCD glass sized substrate($370{\times}470mm^2$), is rolled by a rubber roller to achieve a uniform residual layer. The prediction of residual layer thickness of the photoresist by rolling of the rubber roller is crucial to design the rolling type imprinting process, determine the rubber roller operation conditions-mpressing force & feeding speed, operate smoothly the following etching process, and so forth. First, using the elasticity theory of contact problem and the empirical equation of rubber hardness, the contact length between rubber roller and mold is calculated with consideration of the shape and hardness of rubber roller and the pressing force to rubber roller. Next, using the squeeze flow theory to photoresist flow, the residual layer thickness of the photoresist is calculated with information of the viscosity and initial layer thickness of photoresist, the shape of mold pattern, feeding speed of rubber roller, and the contact length between rubber roller and mold previously calculated. Last, the effects of rubber roller operation conditions, impressing force & feeding speed, on the residual layer thickness are analyzed with consideration of the shape and hardness of rubber roller.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.39 no.3
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• pp.34-40
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• 2002

In this paper, a new encryption method for a binary image using Phase modulation and Fourier transform is proposed. For decryption we use the characteristics of square law detector. In encryption process, a key image is obtained by phase modulation of 256 level random pattern and its Fourier transformation, and input image is encrypted by Fourier transforming the multiplication of the phase modulated random pattern and phase modulated input image. The encrypted image and key image have only phase information, so they can not be copied or counterfeited and the original image can not be decrypted without the key image. To reconstruct the original image, each phase mask of the key image and the encrypted image must be placed on each path of the Mach-Zehnder interferometry with Fourier transform lens and the output image is obtained in the form of intensity in the CCD(Charge Coupled Device) camera. The real-time decryption is possible in the proposed system by use of a LCD as a phase modulator and a CCD camera as an intensity detector. The proposed method shows a good performance in the computer simulation and optical experiment as an encryption scheme.

• 한국정보디스플레이학회:학술대회논문집
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• 2004.08a
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• pp.795-798
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• 2004

After showing 32 inch two-dimensionally integrated fluorescent lamp (TIFL) and its module at SID '04, 40 inch TIFL and its module of prototype have been developed at the first time. It is the biggest size in the world as well as has a backlight unit without BEF optical film. The luminance of TIFL is 14000 nit at 190 watt power consumption and its luminous efficacy is 51 lumen/watt. The use of TIFL simplifies backlight assembly process and removes high price optical sheets. As a result, LCD TV, used by TIFL, is rapidly going to expand its market share in the large size TV area.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2008.04a
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• pp.44-44
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• 2008

To date, rubbing has been widely used to align LC molecules uniformly. Although rubbing can be simple, it has fundamental problems such as the generation of defects by dust and static electricity, and difficulty in achieving a uniform LC alignment on a large substrate. Therefore, non contact alignment has been investigated. Ion beam induced alignment method, which provides controllability, nonstop process, and high resolution display. In this study, we investigated liquid crystal (LC) alignment with ion beam (IB) that non contact alignment technique on polyimide and electro-optical characteristics of twisted nematic (TN)-liquid crystal display (LCD) on the polyimide under various ion beam angles. In this experiment, Polyimide layer was coated on glass by spin-coating and Voltage-transmittance(VT) and response time characteristics of the TN cell were measured by a LCD evaluation system. The good characteristics of the nematic liquid crystal (NLC) alignment with the ion beam exposure polyimide surface was observed. The tilt angle of NLC on the PI surface with ion beam exposure can be measured under $1^{\circ}$ for all of irradiation angles. In addition, it can be achieved the good EO properties, and residual DC property of the ion beam aligned TN cell on polyimide surface.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.44 no.1
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• pp.59-67
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• 2007

This paper presents a low power dual-level low voltage differential signaling (DLVDS) technique using current source switching for LCD driver ICs in portable products. The transmitter makes dual level signal that has two different level signal 400mVpp and 250mVpp while keeping the advantages of LVDS. The decoding circuit recovers the primary signal from DLVDS. The low power DLVDS is implemented using a $0.25{\mu}m$ CMOS process under 2.5V supply. The proposed circuit shows 800Mbps/2-line data rate and 9mW, 11.5mW power consumptions in transmitter and receiver, respectively. The proposed DLVDS scheme reduce power consumption dramatically compare with conventional one.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2008.11a
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• pp.329-329
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• 2008

To date, rubbing has been widely used to align LC molecules uniformly. Although rubbing can be simple, it has fundamental problems such as the generation of defects by dust and static electricity, and difficulty in achieving a uniform LC alignment on a large substrate. Therefore, noncontact alignment has been investigated. Ion beam induced alignment method, which provides controllability, nonstop process, and high resolution display. In this study, we investigated liquid crystal (LC) alignment with ion beam (IB) that non contact alignment technique on polyimide and electro-optical characteristics of twisted nematic (TN)-liquid crystal display (LCD) on the poly imide under various ion beam angles. In this experiment, Polyimide layer was coated on glass by spin-coating and Voltage-transmittance(VT) and response time characteristics of the TN cell were measured by a LCD evaluation system. The good characteristics of the nematic liquid crystal (NLC) alignment with the ion beam exposure poly imide surface was observed. The tilt angle of NLC on the PI surface with ion beam exposure can be measured under $1^{\circ}4 for all of irradiation angles. In addition, it can be achieved the good ED properties, and residual DC property of the ion beam aligned TN cell on polyimide surface.

• Journal of the Korean Society of Manufacturing Technology Engineers
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• v.22 no.2
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• pp.263-267
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• 2013

The continuing demand for increasingly slimmer and brighter liquid crystal display (LCD) panels has led to an increased focus on the role of light guide panels (LGPs) or optical films that are used to obtain diffuse, uniform light from the backlight unit (BLU). The most basic process in the production of such BLU components is the micromachining of V-shaped grooves. Thus, given the current trend, micromachining of V-shaped grooves is expected to play increasingly important roles in today's manufacturing technology. LCD BLUs comprise various optical elements such as a LGP, diffuser sheet, prism sheet, and protector sheet with V-shaped grooves. High-aspect-ratio patterns are required to reduce the number of sheets and enhance light efficiency, but there is a limit to the aspect ratio achievable for a given material and cutting tool. Therefore, this study comprised a series of experimental evaluations conducted to determine the machining limit in microcutting V-shaped grooves on electroless nickel plated die materials when using single-crystal diamond tools with point angles of $20^{\circ}-80^{\circ}$. Cutting performance was evaluated at various cutting speeds and depths of cut using different machining methods and machine tools. The experimental results are that V-shaped patterns with angles of $80^{\circ}$ or up can be realized regardless of the machining conditions and equipment. Moreover, the feed rate has little effect on machinability, and it is thought that the fly-cut method is more efficient for shallow patterns.

• Journal of Korea Spatial Information System Society
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• v.11 no.3
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• pp.31-39
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• 2009

Requirement level regarding processing and managing real-time datastream in an ubiquitous environment is increased. Especially, due to the unbounded, high frequency and real-time characteristics of datastream, development of specialized stroge manager for DSMS is necessary to process such datastream. Existing DSMS, e.g. Coral8, can support datastream processing but it is not scalable and cannot perform well when handling large-volume real-time datastream, e.g. 100 thousand over per second. In the case of Oracle10g, which is generally used in related field, it supports storing and management processing. However, it does not support real-time datastream processing. In this paper, we propose specialized storage manager of DSMS for real-time compressed storing on semiconductor or LCD production facility of Samsung electronics, Hynix and HP. Hynix and HP. This paper describes the proposed system architecture and major components and show better performance of the proposed system compared with similar systems in the experiment section.