• 한국정보디스플레이학회:학술대회논문집
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• 한국정보디스플레이학회 2006년도 6th International Meeting on Information Display
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• pp.597-600
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• 2006

The silver gate and source/drain electrodes for an a-Si thin film transistor were fabricated by the selective electroless plating (SELP) process. Relevant physical properties including taper angle, uniformity and resistivity are investigated. The Ag layer was about 150nm to 250nm thick, the resistivity less than $3{\times}10^{-6}$ Ohm-cm and the taper angle 45'-60' and the nonuniformity less than 10% on G2 substrates. The transfer characteristics with the Ag gate, and source/drain electrodes respectively possessed good field effect mobility similar to conventionally fabricated a-Si TFTs. This process provided low resistivity, low cost and ease of processing.

• 대한산업공학회지
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• 제33권3호
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• pp.364-372
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• 2007

The cost modeling of the LCD manufacturing system with the repair and the rework process is hard to achieve because of it's complex manufacturing process. The technical cost modeling divides each process separately and hierarchically, so it is very useful to calculate the total manufacturing cost of the complex manufacturing system. We applied the method to the complex LCD manufacturing system to obtain more accurate cost model. Yields are the most important control parameters in manufacturing. In this paper, we propose a yield based cost model for the LCD manufacturing system and reveal the relationship between manufacturing yield and cost. Through the model, we can estimate the manufacturing cost on the basis of yields that are control indicators of manufacturing. Some simulations are performed to observe the effects of the yield to the cost, and the results are coincide with the real situation. With the proposed model, we expect to develop some optimization problems for enlarging productivity in the LCD industry.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2007년도 추계학술대회 논문집
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• pp.361-362
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• 2007

• Journal of Information Display
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• 제1권1호
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• pp.9-13
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• 2000

In liquid crystal displays, the display mode that represents initial liquid crystal alignment and method of applying voltage, mainly determines the image quality of display. Recently we have developed the fringe-field switching (FFS) mode exhibiting high image quality. In this paper, a pixel concept, manufacturing process, materials, and electro-optic characteristics of the FFS mode comparing with conventional in-plane switching mode, and its possible application to reflective type are discussed.

• 한국정보디스플레이학회:학술대회논문집
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• 한국정보디스플레이학회 2008년도 International Meeting on Information Display
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• pp.1272-1275
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• 2008

We present the development of dry etch process for the liquid crystal display (LCD) fabrication using a dielectric barrier discharge (DBD) system at atmospheric pressure. In this experimental work, the dry etch characteristics and the electrical properties of thin film transistor are evaluated by using the scanning electron microscopy and electric probe, and TFT-LCD panel ($300\;mm\;{\times}\;400\;mm$) is manufactured with the application of the amorphous silicon etch step in the 4 mask and 5 mask processes.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2005년도 춘계학술대회 논문집
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• pp.946-949
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• 2005

This paper deals with the algorithm development that inspects defects such as Bright Defect Dots, Dark Defect Dots, and Line Defect caused by the process of LCD(Liquid Crystal Display). While most of LCD production process is automated, the inspection of LCD panel and its appearance depends on manual process. So, the quality of the inspection is affected by the condition of worker. Especially, the more LCD size increases, the more the worker feels fatigued, which causes the probability of miss judgement. So, the automated inspection is required to manage the consistent quality of the product and reduce the production costs. In this paper, to solve these problems, we developed the imaging processing algorithm to inspect the defects in captured image of LCD. Experimental results reveal that we can recognize various types of defect of LCD with good accuracy and high speed.

• 제어로봇시스템학회:학술대회논문집
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• 제어로봇시스템학회 2001년도 ICCAS
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• pp.97.4-97
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• 2001

Recently, TFT LCD (thin film transistor liquid crystal display) manufacturing industry is more concerned with the ways of cleaning large TFT LCD´s with high pixed density than ever Ultrasonic cleaners with high frequencies like 1MHz (megasonic cleaners) are effective in removing very small particles without causing mechanical damage to the surface. In this study a megasonic cleaner for TFT LCD manufacturing process is developed and the performance is evaluated through experiments. The experimental results show that the developed magasonic cleaners is effective in removing very small particle from the LCD panel.

• 한국산학기술학회논문지
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• 제11권1호
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• pp.13-20
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• 2010

본 연구의 목적은 Display 산업의 중요성에 주목하여 옥외 광고를 위한 LCD 패널용 콘솔(이하 'LCD 콘솔'이라 한다.)을 개발하는데 있다. 본 연구의 핵심 과제는 LCD 콘솔의 내부온도를 제어할 수 있도록 해주는 냉각시스템(Cooling System)을 개발하는 것이다. 냉각시스템은 상용화되어 있는 냉각휀(Cooling Fan), 히트싱크(Heat sinks), 열전소자(Thermo Electronic Module) 등의 제품들을 시스템적으로 통합시키는 응용기술로서 통계적 검정기법을 적용하여 개발되었다. 본 연구는 먼저 냉각시스템을 설계/제작한 후 실험을 통하여 냉각시스템 제어에 필요한 인자들의 설정 값들을 구하는 과정을 보였다. 이어서 개발된 냉각시스템을 이용하여 46인치 LCD Panel이 탑재된 LCD 콘솔을 설계/제작하고 실험을 통하여 완성품 LCD 콘솔의 성능을 확인하는 과정을 보였다.

• 한국정밀공학회지
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• 제27권12호
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• pp.84-91
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• 2010

The bonding process of LCD panel is attaching an inner lead to an outer lead in the production line of LCD panel module. It is composed of an OLB process and a PCB bonding process. Since bonding tool assembly is one of the core parts of the bonding equipment that determines the durability and performance of the final product, much design efforts to enhance uniformity and efficiency of the process have been made. In this paper, FE analyses have been employed to determine the bonding tool size. Bonding tool of long bar shape has been simplified as a piece with same heater pitch, and appropriate boundary conditions such as convection and radiation are considered. Thermal analysis results by the FEM have been validated by the experiments. With the use of FE analysis varies design parameters and the corresponding effects have been evaluated. It was observed that the approach presented in this paper could be employed for the design of LCD module bonding tool.

• 제어로봇시스템학회논문지
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• 제14권6호
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• pp.543-547
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• 2008

In the paper, we develop the ultrasonic bonding technique for LCD driver chips having small size and high pin-density. In general, the mounting technology for LCD driver ICs is a thermo-compression method utilizing the ACF (An-isotropic Conductive Film). The major drawback of the conventional approach is the long process time. It will be shown that the conventional ACF method based on thermo-compression can be remarkably enhanced by employing the ultrasonic bonding technique in terms of bonding time. The proposed approach is to apply the ultrasonic energy together with the thermo-compression methodology for the ACF bonding process. To this end, we design a bonding head that enables pre-heating, pressure and ultrasonic excitation. Through the bonding experiments mainly with LCD driver ICs, we present the procedures to select the best combination of process parameters with analysis. We investigate the effects of bonding pressure, bonding time, pre-heating temperature before bonding, and the power level of ultrasonic energy. The addition of ultrasonic excitation to the thermo-compression method reduces the pre-heating temperature and the bonding process time while keeping the quality bonding between the LCD pad and the driver IC. The proposed concept will be verified and demonstrated with experimental results.