• 한국정밀공학회지
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• 제23권9호
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• pp.174-178
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• 2006

Pyramid shape of micro pattern is applied to the light guide panel (LGP) to enhance the uniformity of the brightness of the LCD. The micro pyramids are molded in intaglio on the surface of the LGP. The size of each pyramid is 5$\mu$m $\times$ 5$\mu$m on bottom and the height is about 3.5$\mu$m. The pyramids are distributed on the LGP surface randomly to be sparser where the light comes in and denser at the opposite side as a result of a simulation using lightools$^{TM}$ Based on this design, a silicon pattern master and a nickel stamper are fabricated by MEMS process and electro plating process. Intaglio micro pyramids are fabricated on the 6' of silicon wafer from the anisotropic etching using KOH and the process time, temperature of the KOH solution, etc are optimized to obtain precise shape of the pattern. A Wi stamper is fabricated from this pattern master by electro plating process and the embossed pyramid patterns turns out to be well defined on the stamper. Adopting this stamper to the mold base with two cavities, 1.8' and 3.6' LGPs are injection molded.

• 한국재료학회지
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• 제5권8호
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• pp.929-935
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• 1995

구동 IC를 유리기판 위의 Al패드 전극에 연결하는 LCD(Liquid Crystal Display) 모듈을 실장하는 Chip On Glass (COG) 기술을 개발하기 위하여 기존에 잘 알려진 기술 가운데 실제로 적용 가능성이 가장 유망한 이방성 도전 접착제 (ACA, Anisotropic Conductive Adhesives)를 사용한 공정에 대하여 조사하였다. ACA 공정은 본딩 부분에 ACA 수지를 균일하게 분포시키는 공정과 자외선을 조사하여 수지를 경화하여 칩을 실장하는 공정의 2단계로 진행하였다. 칩에 가해준 하중은 2-15kg이었고 칩의 예열 온도는 12$0^{\circ}C$이었다. 이방성 도전체는 Au 또는 Ni이 표면 피막 재료로 사용된 것을 사웅하였으며 전도성 입자의 갯수가 500, 1000, 2000, 4000개/$\textrm{mm}^2$이며 크기가 5, 7, 12$\mu\textrm{m}$이었다. ACA 처리의 결과 입자 크기가 5$\mu\textrm{m}$이고 입자 밀도는 4000개/$\textrm{mm}^2$일 경우가 대단히 낮은 접촉 저항 및 가장 안정된 본딩 특성을 나타냈었다.

• 공업화학
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• 제27권6호
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• pp.612-619
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• 2016

폐 LCD 판넬로부터 회수된 폐 붕규산유리를 이용하여 흡음특성을 갖는 알루미늄 함유 붕규산유리발포체의 제조 가능성을 조사하였다. 입도 325 mesh 이하의 크기로 분쇄 조절된 폐 붕규산유리분말 100 g에 대해 발포제로서 탄소분을 0.3중량 분율, $Na_2CO_3$, $Na_2SO_4$, $CaCO_3$를 각각 1.5중량 분율, 기공조절제로서 $H_3BO_3$ 및 $Al_2O_3$를 각각 6.0 및 3.0 중량분율이 되도록 첨가한 원료 유리분말을 발포소성온도 $950^{\circ}C$에서 20 min간 발포를 진행함으로서 개기공률 45%를 갖는 발포체를 제조하였으며 이 경우 흡음률 0.5~0.7의 흡음 특성을 갖고 있음을 보여 주었다. 아울러 이 흡음성능을 지닌 알루미늄 함유 붕규산유리발포체는 밀도 $0.21g/cm^3$, 굽힘강도 $55N/cm^2$ 이상, 압축강도 $298N/cm^2$ 이상의 우수한 물성을 가지고 있어 다양한 용도에 내화학성 및 내열성의 흡음체로 사용될 수 있다.

• 한국레이저가공학회지
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• 제12권4호
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• pp.1-5
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• 2009

Conventional patterning based on wet-process for multi-layered film is a relatively complex and costly process though it is a necessary step for fabrication of TFT-LCD module. Recently, a direct pattering by laser has been studied because it is low cost and simple process compared to the wet process. In this work, the selective removal process of multi-layered film (polyimide/indium tin oxide/glass) is studied by modeling the thermal and mechanical behavior for multi-layered structure. Especially, the effects of thickness of polyimide layer are examined.

• 한국기계가공학회지
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• 제3권3호
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• pp.52-57
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• 2004

Many kinds of gases, such as erosion gas, dilution gas, and toxic gas have been used in manufacturing process of LCD at semiconductor. In order to increase accumulation rate of manufacturing process, high degree of purity in these gases and minimized metalllic dust are required. All wetted stainless steel surface must be 316L electro-polished with $0254{\mu}m$ in average. Based on the AES analysis, Cr/Fe 11 and $Cr_2O_3$ thickness $25{\AA}$ are measured Molybdenum and silicon contaminants which is characteristic of stainless steel and oxygen were found on the surface.

• 한국재료학회지
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• 제17권7호
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• pp.352-357
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• 2007

Since a pattern defects "repair" system using a diode pumped solid state laser for Flat Panel Display (FPD) was suggested, a lot of laser systems have been explored and developed for mass-production microfabrication process. A maskless lithography system using 405 nm violet laser and Digital Micromirror Device (DMD) has been developed for PDP and Liquid Crystal Display (LCD) Thin Film Transistor (TFT) photolithography process. In addition, a "Laser Direct Patterning" system for Indium Tin Oxide (ITO) for Plasma Display Panel(PDP) has been evaluated one of the best successful examples for laser application system which is applied for mass-production lines. The "heat" and "solvent" free laser microfabrications process will be widely used because the next-generation flat panel displays, Flexible Display and Organic Light Emitting Diode (OLED) should use plastic substrates and organic materials which are very difficult to process using traditional fabrication methods.

• 반도체디스플레이기술학회지
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• 제10권1호
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• pp.101-105
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• 2011

In case of high-tech process industries such as semiconductor and TFT-LCD manufactures, fault of a virtually finished product that is value-added one, since it has gone throughout the most of processes, may give rise to quality cost nearly amount to its selling price and can be a main cause that decreases the efficiency of manufacturing process. This paper proposes a real-time dispatching algorithm for semiconductor manufacturing process with rework. In order to evaluate the proposed algorithm, this paper examines the performance of the proposed method by comparing it with that of the existing dispatching algorithms, based on various experimental data.

• 한국산업보건학회지
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• 제32권1호
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• pp.10-20
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• 2022

Objectives: The aim of this study is to evaluate exposure levels of the extremely low frequency magnetic fields(ELF-MF) radiated from various electric facilities in Liquid Crystal Display(LCD) manufacturing processes. Methods: This study measured the exposure levels of personal and local ELF-MF for the electronic facilities installed in two LCD manufacturing companies. Samplers were installed around workers' waist during working hours to identify personal exposure levels, and direct reading equipment were located at 3 cm, 10 cm, and 30 cm away from the surface of the electronic facilities to measure local exposure levels. Average and maximum(ceiling) values were calculated for personal and local exposure levels. Results: Average and maximum of personal exposure levels for each worker were 0.56(mean) ± 0.02(SE) µT and 6.31 ± 0.75 µT, respectively. Statistical analyses of the study found that maximum of the personal exposure levels for engineers was significantly higher than that for operators since engineers spend more time near the electronic facilities for repairing. The range of maximum personal exposure levels was 0.50 ~ 43.50 µT and its highest level was equivalent to 4.35 % of ACGIH(American Conference of Governmental Industrial Hygienists) exposure limit value(1 mT). Maximum of local exposure levels was 8.18 ± 0.52 µT and the electronic facilities with higher exposure levels were roof rail and electric panel, which were not related to direct manufacturing. The range of maximum local exposure levels was 0.60 ~ 287.20 µT and its highest level was equivalent to 28.7 % of the ACGIH exposure limit value. Lastly, the local exposure levels significantly decreased as the measurement distance from the electronic facilities increased. Conclusions: Maximum of personal and local exposure levels did not exceed the exposure limit value of ACGIH. However, it is recommended to keep the workers as far as possible from the sources of ELF-MF.

• 한국신재생에너지학회:학술대회논문집
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• 한국신재생에너지학회 2009년도 춘계학술대회 논문집
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• pp.57-60
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• 2009

The conductive coating method was used for a various industrial fields. For example, Sputtering process is using to a coat of ITO layer in LCD or OLED panel manufacture process and fabricate a base layer of substrate of an electric printing device. However, conventional coating process (beam sputtering, spin coating etc.) has a problems in the industrial manufacturing process. These processes have a very high cost and critical manufacturing environment as a vacuum process. Recently, many researchers were proposed a various printing process instead of conventional coating process. In this paper, we propose an ESD printing process in ITO coating layer and apply to fabricate a conductive coating film. Ours transparent electrode had a surface resistance of about $66{\Omega}/{\square}$ and transparent of 74% in the wavelength of 500nm. This transparent electrode manufacturing process will be applied to Roll-to-Roll process. In addition, we developed roll printing process system for the next generation flexible solar cell.

• 제어로봇시스템학회논문지
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• 제14권5호
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• pp.415-419
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• 2008

Detecting and correcting defects on LCD glasses early in the manufacturing process becomes important for panel makers to reduce the manufacturing costs and to improve productivity. Many attempts have been made and were successfully applied to detect and identify simple defects such as scratches, dents, and foreign objects on glasses. However, it is still difficult to robustly detect low-contrast defect region, called Mura or blemish area on glasses. Typically, these defect areas are roughly defined as relatively large, several millimeters of diameter, and relatively dark and/or bright region of low Signal-to-Noise Ratio (SNR) against background of low-frequency signal. The aim of this article is to present a robust algorithm to segment these blemish defects. Early 90's, a highly robust estimator, known as the Model-Fitting (MF) estimator was developed by X. Zhuang et. al. and have been successfully used in many computer vision application. Compared to the conventional Least-Square (LS) estimator the MF estimator can successfully estimate model parameters from a dataset of contaminated Gaussian mixture. Such a noise model is defined as a regular white Gaussian noise model with probability $1-\varepsilon$ plus an outlier process with probability $varepsilon$. In the sense of robust estimation, the blemish defect in images can be considered as being a group of outliers in the process of estimating image background model parameters. The algorithm developed in this paper uses a modified MF estimator to robustly estimate the background model and as a by-product to segment the blemish defects, the outliers.