• Applied Chemistry for Engineering
• /
• v.23 no.2
• /
• pp.195-203
• /
• 2012

Recycling method of waste LCD glass is the essential process for developing the total recycling process of LCD pannel. Pulverizing of LCD glass, determination of proper carbonacious foaming agent, the properties of residue from the recovery of valuable materials through an acid leaching process and the feasibility for the foaming of the residue obtained from leaching for indium and tin recovery were investigated for the developing of recycling method of waste LCD glass as industrial feed materials, such as heat insulation materials, sound absorbing materials, carrier of water treatment. Waste LCD glass could be pulverized finely for foaming process. Natural graphite was proper agent for foaming of the residue and the foaming technology of LCD glass would be effective recycling alternatives.

• Applied Chemistry for Engineering
• /
• v.27 no.4
• /
• pp.371-379
• /
• 2016

In this article, the foamed body of glass was manufactured from the waste borosilicate glass produced by wet pulverization process without additional pretreatment which can be used as a recycling method for waste LCD panel glass. Each 100 g of pulverized waste borosilicate glass with the size of less than 270 mesh were mixed with 0.3 weight fraction of carbon and 1.5 weight fraction of $Na_2CO_3$, $Na_2SO_4$ and $CaCO_3$ and let them foamed for 20 minutes at $950^{\circ}C$ to manufacture the foamed body having the density of less than $0.3g/cm^3$. Additionally, adding $SiO_2$ or $H_3BO_3$ to the mixture enabled the foamed body to have efficient formation of open pores which showed the possibility for producing the foamed body with new functionalities such as sound absorption.

• The Journal of Korean Institute of Communications and Information Sciences
• /
• v.25 no.12A
• /
• pp.1897-1903
• /
• 2000

산업용 칼라 액정 패널 비젼 시스템은 공장 자동화 시스템 및 고속도로 등의 모니터링을 위해 필요한 시스템이다. 본 논문에서는 산업용 액정 패널 비젼에서 입력신호인 NTSC, SECAM, PAL 및 컴퓨터의 RGB 신호를 받아 이를 그래픽 처리하여 LCD 패널에 디스플레이 하여 대형 스크린에 투사하기 위한 LCD 드라이버 인터페이스를 카드를 개발하였다. 개발된 인터페이스 카드는 XGA(1024X768)급의 성능을 가진다. 카드의 성능을 테스트하기 위해 적합성 시험을 하였으며, 테스트 결과 만족할 만한 결과를 얻을 수 있었다.

• Proceedings of the Korean Society of Precision Engineering Conference
• /
• 2008.06a
• /
• pp.703-704
• /
• 2008

• Information Display
• /
• v.5 no.3
• /
• pp.21-29
• /
• 2004

• Journal of Industrial Technology
• /
• v.24 no.B
• /
• pp.73-81
• /
• 2004

The development of efficient and precise handling of an liquid crystal display (LCD) panel has been addressed as the sizes of LCD panels become much larger than ever. The majority part of LCD panel handling is conducted by industrial robots for the cost reduction and the quality control. A challenging problem, vibration of the panel, can be found when the robots are utilized for handling LCD panels. The vibration causes the poor product precision and the low productivity. The characteristics of LCD panels, which are the high size-to thickness ratio, the high elasticity, and the high brittleness, are the major sources of the vibration This paper introduces the vibration attenuation techniques to overcome the difficulties encountered in the LCD production using the industrial robots.

• Proceedings of the Korean Institute of Industrial Safety Conference
• /
• 2003.05a
• /
• pp.167-172
• /
• 2003

액정판넬(LCD) 및 반도체 제조공정에 있어서 정전기 발생으로 인하여 미세한 먼지가 LCD 및 반도체 웨이퍼에 부착되거나, 정전기 방전에 의해 반도체소자 및 LCD 유리기판상의 패헌의 파괴를 야기하여 제품의 수율을 저하시키고 제조원가를 상승시키는 주요한 요인이 된다. 현재 이러한 제조공정에서 정전기를 위한 대책으로 코로나방전에 의한 이온바(Ion Bar) 및 이온브로어(Ion Blower)를 제전설비로 사용하고 있으나, 이 장치는 코로나 방전에 의한 이온을 발생시키고 이온화된 공기를 불어 내기 위하여 팬을 사용하여 공기를 대류 시킨다.(중략)

• Proceedings of the Korean Operations and Management Science Society Conference
• /
• 2000.04a
• /
• pp.94-98
• /
• 2000

본 논문은 TFT-LCD 모듈 조립 공정에서의 스케줄링 시스템을 제안한다. TFT-LCD 모듈 조립 공정은 선행 공정인 액정 공정에서 넘어오는 LCD 판넬과 기타 부품들을 조립하여 최종 완제품을 만드는 공정이다. 본 연구에서 다루고 있는 문제는 주문량으로부터 구해지는 일일 생산 계획량이 주어졌을 때 각 라인에서 생산되어질 제품을 배정하는 문제이다. 본 논문의 목적은 주어진 실제 공정 환경에서 일일 생산 계획량을 최대로 만족하기 위한 스케줄링 휴리스틱을 개발하는 것이다. 이를 위해 relaxed LP 모형을 제시하였고 제시된 LP 모형을 이용한 알고리즘을 개발하였다. 제안된 알고리즘은 제품 우선 배정 조건, 현 보유 자재량과 대략적인 라인의 생산 능력을 고려한 LP 프로시져 부분과 제품 간 셋업 시간을 고려한 설비 배정 휴리스틱의 두 부분으로 구분된다. 알고리즘의 성능 검사를 위해 실제 TFT-LCD 모듈 공정에서의 데이터를 이용하여 과거에 실제 이루어진 생산 결과와 비교를 하였으며 제안된 알고리즘의 효율성을 실험 결과를 통해 보였다.

• Journal of the Korean Institute of Illuminating and Electrical Installation Engineers
• /
• v.21 no.1
• /
• pp.19-27
• /
• 2007

In this paper, we develope and implement a TFT-LCD cell defects detection algorithm using morphology. To detect the bright line or dark line defects and the bright pixel or dark pixel defects of the TFT-LCD cells, we determine the shape of the morphology operators considering the shape characteristics of the TFT-LCD sub pixels. Using dilation, erosion, and the subtraction operators, we extract gray level defects information. Then, we apply the optimal threshold method which shows the best results in terms of several criteria. Finally, we determine the defects using labelling method. From various experiments using TFT-LCD panels, the proposed algorithm shows superior results.

• Journal of the Korean Society for Precision Engineering
• /
• v.27 no.12
• /
• pp.84-91
• /
• 2010

The bonding process of LCD panel is attaching an inner lead to an outer lead in the production line of LCD panel module. It is composed of an OLB process and a PCB bonding process. Since bonding tool assembly is one of the core parts of the bonding equipment that determines the durability and performance of the final product, much design efforts to enhance uniformity and efficiency of the process have been made. In this paper, FE analyses have been employed to determine the bonding tool size. Bonding tool of long bar shape has been simplified as a piece with same heater pitch, and appropriate boundary conditions such as convection and radiation are considered. Thermal analysis results by the FEM have been validated by the experiments. With the use of FE analysis varies design parameters and the corresponding effects have been evaluated. It was observed that the approach presented in this paper could be employed for the design of LCD module bonding tool.