• Proceedings of the Korean Institute of Building Construction Conference
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• 2011.11a
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• pp.247-249
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• 2011

Pre-foaming, one of the manufacturing way of foamed concrete, is influenced by foaming agent. When the foaming agent diluted with water, surface tension and viscosity are varied. Therefore, this study is reviewing the surface tension, viscosity and unit weight of foam by experimental factor such as foaming agent types(AES, AOS, VS FP) and foam agent dilution concentration (1, 3, 5%) and temperature of materials (5, 10, 20℃). As an expeimental result, the surface tension and viscosity slightly increased with increasing concentrations. Meanwhile, when increasing temperature, the viscosity has decreased. FP produce relatively stable foams only in case 3% or more, which produce unstable foams containing large amount of water content by decreasing only insignificant surface tension when diluted at concentration of 1%.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2003.11a
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• pp.216-219
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• 2003

This paper presents the analyzing method for surface temperature distribution of a cast-resin transformer. For the study, the surface temperature of the transformer winding was measured and analyzed by a infrared thermography system. Alternating voltages were applied to simulate deterioration of the specimen transformer, and the hot-spot on the transformer surface was measured to analyze the condition for the winding. The hot line condition measured to the changes in surface temperature using infrared thermography camera and was set up the based of diagnostic method of the electric power apparatus. The results ould show the possibility of remote diagnosis using internet.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.26 no.6
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• pp.493-501
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• 2013

LED lighting is sensitive because it made by semiconductor. So it has been researched about radiation of heat technologies for a long time. In addition, measurement and assessment a radiation of heat also conducted. It is necessary to get a date of accuracy temperature on the board after LED driven for measuring Junction temperature of the LED Lighting. For this research, we use 5 chip which is 4 W power on top of LED lighting board made by aluminum. Thermal camera effects to emissivity depending on material and property of the surface in LED board because it determines thermal energy which emitted from material surface. it is not only thermal camera has not a standard about emissivity. It has an error of temperature when emissivity was measured by thermal camera. we confirmed that emissivity and reflected temperature depending on color and quality of the surface throughout experiment.

• Transactions of the Korean Society of Automotive Engineers
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• v.10 no.4
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• pp.158-165
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• 2002

This Paper deals with the headlamp lens surface temperature distribution of p/c headlamp using the three categories of H4 halogen bulbs. Glass is gradually replaced by P/C for the lens material off vehicle headlamp due to the weight reduction and stream lined body of a vehicle. With this trend, the newly established standards for a headlamp with a P/C lens in Europe requires that the heat generated by a bulb should not distort the lens surface. Also the requirements fur the bulb of a headlamp are being enforced in U.S.A & Europe. However, such requirements are not established yet in Korea. By using three kinds (60/55w, 100/90w, 130/90w) of H4 halogen bulbs in this experiment, the surface temperature distribution and Max. temperature on the lens were measured. The results of this study implies the necessity of requirement fur the bulb off headlamp.

• Journal of the Korean institute of surface engineering
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• v.51 no.6
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• pp.400-404
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• 2018

A metal 3D printer has been developed on its own to electrodeposit the localized area. Nozzles were used to selectively laminate the electrolytic plating method. To analyze the factors affecting the deposition, the stack height, thickness and surface roughness were experimentally analyzed according to the current density and the temperature of the electrolyte. Electrolytic temperature and current are electrodeposited when the deposition conditions are dominant over the etching conditions, but the thickness is kept constant. On the contrary, when the etching conditions are dominant, the electrodeposited shape is rather the etched. As a result, the uniformity of surface quality and electrodeposition rate could be improved by conducting experiments under constant conditions of electrolyte temperature and current density.

• Journal of the Korean Solar Energy Society
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• v.29 no.6
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• pp.88-93
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• 2009

This study was conducted to improve the power of PV module using a surface cooling system One of the unique characteristics of PV module is power drop as a module surface temperature increases due to the characteristics of crystalline silicon used in a solar cell. To overcome the output power reduction by temperature effect, module surface cooling using water circulation was performed. By cooling effect, module surface temperature drops maximally $20.3^{\circ}C$ predicting more than 10% power enhancement. Maximum deviation of voltage and current between a control and cooled module differed by 5.1 V and O.9A respectively. The maximum power enhancement by cooling system was 12.4% compared with a control module. In addition, cooling system can wash the module surface by water circulation so that extra power up of PV module can be achieved by removing particles on the surface which interfere solar radiation on the cells. Cooling system, besides, can reduce the maintenance cost and prevent accidents as a safety precaution while cleaning works. This system can be applied to the existing photovoltaic power generation facilities without any difficulties as well.

• Journal of the Korean institute of surface engineering
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• v.14 no.4
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• pp.215-220
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• 1981

The surface appearance of chromium electrodeposit was studied by employing a pulse curr-ent plating in self-regulating high speed (SRHS) bath containing 20 g/$\ell$, K2SiF6 7.5 g/$\ell$ SrSO4 and 250 g/$\ell$ CrO3. As the pulse frequency increased, the surface appearance changed suddenly from bright a-ppearance in a direct current plating condition to gray one in the range of pulse frequency less than about 20KHz. However the bright appearance is recovered as the pulse frequen-cy exceeded 20 KHz. This phenomena seemed to be related with the preferred orientation of electrodeposits, considering the relationship between the preferred orientation of elect-rodeposits and surface appearance in a SRHS bath. Direct current plating was also applied to both Sargent and SRHS bath and investigat-ion on surface appearance was extended to the high current density of 400 A/dm2. In a Sa-rgent bath, the increase in bath temperature was necessary for bright appearance as the current density was increased within 150 A/dm2, but bright region was shown in the cons-tant temperature of 70-75$^{\circ}C$ above the current density of 150A/dm2. On the other hand, two regions of surface brightness was found in a SRHS bath. One is region in the low temperature less than 25$^{\circ}C$ and the other in the moderate temperature range from 55$^{\circ}C$ to 65$^{\circ}C$.

• Journal of the Semiconductor & Display Technology
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• v.12 no.4
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• pp.39-44
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• 2013

In the semiconductor heat-treatment process, the temperature uniformity determines the film quality of a wafer. This film quality effects on the overall yield rate. The heat transfer of the wafer surface in the heat-treatment process equipment is occurred by convection and radiation complexly. Because of this, there is the nonlinearity between the wafer temperature and reactor. Therefore, the accurate prediction of temperature on the wafer surface is difficult without the direct measurement. The thermal camera and the T/C wafer are general ways to confirm the temperature uniformity on the heat-treatment process. As above ways have limit to measure the temperature in the precise domain under the micro-scale. In this study, we developed the thin film type temperature sensor using the MEMS technology to establish the system which can measure the temperature under the micro-scale. We combined the experiment and numerical analysis to verify and calibrate the system. Finally, we measured the temperature on the wafer surface on the semiconductor process using the developed system, and confirmed the temperature variation by comparison with the commercial T/C wafer.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.23 no.11
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• pp.859-863
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• 2010

Evolution of surface morphology of ${\alpha}-Al_2O_3$ substrate was investigated as a function of annealing temperature and time. Commercial (0001) ${\alpha}-Al_2O_3$ single crystal substrates were annealed in the range of $600-1000^{\circ}C$ in air. At $600^{\circ}C$, step-terrace structure started to be formed on the substrate. However, the surface roughness on the terrace was still considerable and a number of islands were observed on the step edges as well as the terraces. As the annealing temperature increased, the islands were absorbed into the step edges. Thus the terraces were smoother and the step edges were more straightened. Well-defined surface with a step height of 0.2 nm was formed above $900^{\circ}C$. On the other hand, when the substrate was annealed at a fixed temperature of $1000^{\circ}C$, the change of surface morphology was observed for the substrate annealed for 10 min. After the annealing for 30 min, the surface on which any islands could not survive was observed.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.19 no.2
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• pp.47-54
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• 2020

Themo-mechanical analysis was carried out using the finite element method for the steel shell of a cupola furnace. When the outer surface of the shell was cooled with water to within the temperature range of 35-80 ℃ during operation of the cupola, the inner surface of the shell was expected to exhibit a temperature of 65-248 ℃ based on heat transfer analysis. The shell was also expected to have an equivalent stress range of 100-280 MPa in the outer surface over the temperature range examined. Upon cooling the shell to obtain an outer surface temperature <80 ℃, the maximum equivalent stress of the shell did not exceed the yield strength. Although the temperature of the outer surface varied between 35 and 80 ℃ periodically due to the cooling control problem, the fatigue stress at the outer surface of the shell was calculated to be within the fatigue strength. During a non-operational period to examine the system between furnace operations, the thermal stress presented in the shell was sufficiently low to reach the desired yield strength and fatigue limit.