• Ceramist
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• v.9 no.6
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• pp.30-36
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• 2006

Joining ceramics to metals has a variety of applications both in the structural and the electronics fields. One of the great benefits of the adoption of joining into the structural applications is to provide reliability to the ceramic components by backing up with metal components. In joining ceramics and metals, two key factors, i.e., establishing chemical bonding at interfaces and dissipation of thermal stress across interfaces, should be paid for attention. Many joining methods have been already established such as adhesive and mechanical joining, brazing and soldering, and solid state bonding. Each has its own benefits with some drawbacks. One can select a suitable process and materials following the requirements of the application. This report focuses on the current status of joining technology for ceramics/metal system.

• Proceedings of the Korean Institute of Information and Commucation Sciences Conference
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• 2002.11a
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• pp.839-843
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• 2002

In this paper, we present a next generation VoIP network architecture. Specifically, we present key components such as SoftSwitch and media gateway, and important protocols for VoIP services. We also present basic components and mechanisms for VoIP QoS. The architecture presented in this paper is able to support open interfaces and multimedia traffic, and therefore various multi-services can be supported efficiently using the architecture.

• Journal of Information Technology Applications and Management
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• v.20 no.3
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• pp.1-18
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• 2013

Software architecture is the blueprint for a software system and should provide consistent guidelines for design, implementation, and maintenance throughout the entire lifecycle of the system. Components, interactions between the components, well-formed structure, reasons, and various perspectives reflecting various stakeholders' concerns changing through the phases of software lifecycle are the key elements of software architecture. The architect identifies and engages the stakeholders, understands and captures stakeholder's concerns including those regarding life cycle, and lets the concerns reflected in the architecture. To do so, architect should take into consideration various contextual elements regarding the system too. We make an extended list of the elements, especially those of business application software architecture, that the architect should take into consideration and construct a model of the relationships between the elements.

• Proceedings of the KSME Conference
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• 2004.04a
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• pp.1280-1285
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• 2004

Microsystem technology has been applied to space technology and became one of the enabling technology by which low cost and high efficiency are achievable. Micro propulsion system is a key technology in the miniature satellite because micro satellite requires very small and precise thrust force for maneuvering and attitude control. In this paper research on micro solid propellant thruster is reported. Micro solid propellant thruster has four basic components; micro combustion chamber, micro nozzle, solid propellant and micro igniter. In this research igniter, solid propellant and combustion chamber are focused. Micro igniter was fabricated through typical micromachining and evaluated. The characteristic of solid propellant was investigated to observe burning characteristic and to obtain burning velocity. Change of thrust force and the amount of energy loss following scale down at micro combustion chamber were estimated by numerical simulation based on empirical data and through the calculation normalized specific impulses were compared to figure out the efficiency of combustion chamber.

• Transactions of the Korean Society of Machine Tool Engineers
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• v.17 no.2
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• pp.51-57
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• 2008

Recently, the manufacturer of microscopic structures along with the development of technology to produce electronics, communication and semiconductors allows various components to be smaller in size, with higher precision. Therefore, preoccupancy of micro/nano-level machining technology in order to product micro/nano-components and parts is key issue in the field of manufacturing. In this study, machinability of micro machining was studied through the machining of aluminum, brass and steel workpiece. Inspection of the cutting force variation patterns of large numbers of micro machining indicated that characteristics of the workpiece. Surface roughness prediction methods were developed by considering the variation of the static part of the feed direction cutting force. The accuracy of the proposed approaches were tested with experimental data and the agreement between the predictions and actual observations are addressed.

• Journal of the Korean Institute of Telematics and Electronics
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• v.26 no.12
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• pp.2039-2045
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• 1989

In this paper, we developed placement algorithm for drafting logic schmeatics. The algorithm of this system is to base placement on signal flow as opposed to connectivity. The key idea of this algorithm is that by dividing the schematic into simpler acyclic, uni-directional graphs, called tree. Then the components of tree and their interconnections have the characteristics that they can be laid out symmetrically without any crossovers. The interconnectivity between the trees are analyzed and a placement scheme is determined for them. Also, the trees are expended into their respective components. This algorithm is divided into four main phases: Initiate, Divide, Merge, Placement.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2003.09a
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• pp.93-100
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• 2003

The continuing scaling trend in microelectronic circuit technology has a significant impact on the different IC interconnection and packaging technologies. These latter technologies have not kept pace with the IC scaling trends, resulting in a so-called“interconnect technology gap”. Multilayer thin film technology is proposed as a“bridge”- technology between the very high density IC technology and the coarse standard PCB technology. It is also a key enabling technology for the realisation of true“System-in-a-Package”(SIP) solutions, combining multiple“System-on-a-Chip”(SOC) IC's with other components and also integrating passive components in its layers. A further step is to use this technology to realise new functionalities on top of active wafers. These additional“above-IC”processed layers may e.g. be used for low loss, high speed on chip interconnects, clock distribution circuits, efficient power/ground distribution and to realize high Q inductors on chip.

• Journal of Microbiology
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• v.43 no.1
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• pp.38-43
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• 2005

Lactic acid production parameter optimization using Lactobacillus amylovorus NRRL B-4542 was performed using the design of experiments (DOE) available in the form of an orthogonal array and a software for automatic design and analysis of the experiments, both based on Taguchi protocol. Optimal levels of physical parameters and key media components namely temperature, pH, inoculum size, moisture, yeast extract, $MgSO_4{\cdot}7H_20$, Tween 80, and corn steep liquor (CSL) were determined. Among the physical parameters, temperature contributed higher influence, and among media components, yeast extract, $MgSO_4{\cdot}7H_20$, and Tween 80 played important roles in the conversion of starch to lactic acid. The expected yield of lactic acid under these optimal conditions was 95.80% and the actual yield at optimum conditions was 93.50%.

• Communications for Statistical Applications and Methods
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• v.23 no.3
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• pp.231-239
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• 2016

A graphical diagnostic method based on multiple case deletions in a regression context is introduced by using the sampling distribution of the difference between two least squares estimators with and without multiple cases. Principal components analysis plays a key role in deriving this diagnostic method. Multiple case deletions of test statistic are also considered when a new observation is fitted to a given regression model. The result is useful for detecting influential observations in econometric data analysis, for example in checking whether the consumption pattern at a later time is the same as the one found before or not, as well as for investigating the influence of cases in the usual regression model. An illustrative example is given.

• Journal of the Korean Society for Precision Engineering
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• v.15 no.11
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• pp.67-75
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• 1998

Geometric and thermal errors are key contributors to the errors of a computer numerically controlled turning center. A planar error synthesis model is obtained by synthesizing 11 geometric and thermal error components of a turning center with homogeneous coordinate transformation method. This paper shows the sensitivity analysis on the temperature change, the confidence evaluation on the uncertainty Of measurement systems, and the error contribution analysis from the planar error synthesis model. Planar error in the z direction was very sensitive to the temperature change. and planar errors in the x and z directions were not affected by the uncertainty of measurement systems. The error contribution analysis ,which is applicable to designing a new turning center, was helpful to find the large error components which affect planar errors of the turning center.