• Proceedings of the Korean Society of Machine Tool Engineers Conference
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• 2005.05a
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• pp.395-400
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• 2005

Nano-scale fabrication of silicon substrate based on the use of atomic force microscopy (AFM) was demonstrated. A specially designed cantilever with diamond tip, allowing the formation of damaged layer on silicon substrate by a simple scratching process, has been applied instead of conventional silicon cantilever for scanning. A thin damaged layer forms in the substrate at the diamond tip-sample junction along scanning path of the tip. The damaged layer withstands against wet chemical etching in aqueous KOH solution. Diamond tip acts as a patterning tool like mask film for lithography process. Hence these sequential processes, called tribo-nanolithography, TNL, can fabricate 2D or 3D micro structures in nanometer range. This study demonstrates the novel fabrication processes of the micro cantilever and diamond tip as a tool for TNL using micro-patterning, wet chemical etching and CVD. The developed TNL tools show outstanding machinability against single crystal silicon wafer. Hence, they are expected to have a possibility for industrial applications as a micro-to-nano machining tool.

• Korean Journal of Optics and Photonics
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• v.12 no.6
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• pp.463-467
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• 2001

In this study, we developed a FFPI (fiber optic Fabry-Perot interferometer) pressure sensor using the Si diaphragm which measures pressure in vivo. The diaphragm and its supporting structure were etched in KOH solution and were fabricated with micromachining technology. For the configuration of the sensor, the length of the cavity of the Fabry-Perot etalon is 15 mm and one end of the etalon was bonded to a Si diaphragm with 507m thickness. When the area of the Si diaphragm was 2$\times$2 mm2 (cavity length 15 mm), it turns out that the pressure sensitivity was about 1.5 degree/kPa. The pressure sensor developed in this study showed that the phase change was linearly proportional to the increasing pressure in the range of 80 kPa.

• Journal of Pharmacopuncture
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• v.3 no.2
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• pp.213-232
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• 2000

Hemiplegic shoulder pain(HSP) is one of the most frequent and difficult problems affecting poststroke hemiplegic patients. Honeybee venom acupuncture therapy(BVAT) is known for its pain relieving effects in arthralgia. To evaluate the effectiveness of BVAT on HSP, 24 patients were sequential1y allocated into BVA T treatment group and control group and monitored for 4 weeks at time interval of initial(T0), 1 week(T1), 2 weeks(T2) and 4 weeks(T4). In treatment group, 1:10000 honeybee venom solution 0.2㎖ was injected into acupoint(s) following Deqi three times a week. Kyonu(LI15) was used in the first week. Thereafter Kyonu(LI15) and Nosu(SI10) were used. Visual analogue scale of pain severity showed significant decrease in treatment group compared to control group at T2 and T4 evaluation. Painless passive range of motion of shoulder external rotation showed significant increase in treatment group compared to control group at T4 evaluation. Fugl-Meyer Motor Assessment of upper limb motor function and Modified Ashworth scale of the spasticity of upper limb showed no difference between two groups. BVAT showed as an effective therapy in HSP and further extensive clinical studies are expected.

• Transactions on Electrical and Electronic Materials
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• v.3 no.1
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• pp.4-8
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• 2002

The typical mold method for FED (field emission display) fabrication is used to form a gate electrode, a gate oxide layer, and emitter tip after fabrication of a mold shape using wet-etching of Si substrate. However, in this study, new mold method using a side wall space structure was developed to make sharp emitter tips with the gate electrode. In new method, gate oxide layer and gate electrode layer were deposited on a Si wafer by LPCVD (low pressure chemical vapor deposition), and then BPSG (Boro phosphor silicate glass) thin film was deposited. After then, the BPSG thin film was flowed into the mold at high temperature in order to form a sharp mold structure. TiN was deposited as an emitter tip on it. The unfinished device was bonded to a glass substrate by anodic bonding techniques. The Si wafer was etched from backside by KOH-deionized water solution. Finally, the sharp field emitter array with gate electrode on the glass substrate was formed.

• Journal of the Korean Electrochemical Society
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• v.8 no.3
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• pp.117-124
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• 2005

Electrochemical oxidation of ethanol at nickel electrodes has been studied in 1 M KOH solution containing 0.20M ethanol using electrochemical impedance spectroscopy. Equivalent circuits have been worked out by simulating the impedance data, and the results were used to model the oxidation of ethanol as well as the passivation of the electrode. The maximum rate of oxidation of $Ni(OH)_2$ to NiOOH was observed at about 0.37V vs. Ag/AgCl reference electrode, while the maximum rate of ethanol oxidation at the Ni electrode was observed at about 0.42V, The charge-transfer resistance for oxidation of the electrode itself became smaller in the presence of ethanol than in its absence. These results suggest that the $\beta-Ni(OH)_2/\beta-NiOOH$ redox couple is acting as an effective electron transfer mediator far ethanol oxidation. The kinetic parameters also were obtained by the experimental and simulated results.

• Journal of the Korean Ceramic Society
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• v.21 no.2
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• pp.165-173
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• 1984

It is desirable to establish reliable synthetic methods for electro-ceramic materials. To synthesize $SrTiO_3$ in this study direct solid state reactions and wet chemical processes were used. Previous study of $SrTiO_3$ synthesis included oxalated-method($SrTiO(C_2O_4)_2$.$4H_2O$) co-precipitation$(SrCO_3+TiO(OH)_2)$ and direct solid state reaction$(SrCO_3+TiO(OH)_2)$ The methods in question lead to intermediate inclusion during the reactions and less controllable in particle sizes of $SrTiO_3$. To obtain highly pure $SrTiO_3$ so-called "direct wet process method" was added in this investigation. In the study the "direct wet process" was for the first time applied to synthesize chemically pure and fine particle $SrTiO_3$. $SrCl_2$ and $TiCl_4$<\ulcornerTEX> at KOH solution at room temperature to 10$0^{\circ}C$ precipitated $SrTiO_3$ The particle size increased as temperature increased.mperature increased.

• Proceedings of the KIEE Conference
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• 1999.07g
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• pp.3307-3309
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• 1999

Electrochemical discharge machining (ECDM) is a very recent technique in the fabrication of the micro-electro-mechanical system ( MEMS ) devices. This paper presents the experimental results of the machining of micro-holes on pyrex glass substrates by use of ECDM. Electrolyte is used with a KOH aqueous solution, cathode with copper, anode with platinum, and tool feed system is applied with gravity feed system. Already established experimental results were taken under the condition of constant voltage frequency. However in this paper, the effect of variation of the voltage frequency and duty ratio is considered. In this experiment, it is measured the ECDM performances with variation of the voltage frequency and duty ratio under the conditions of constant other machining variables. ECDM performances are described by the hole depth, and the top hole diameter.

• Proceedings of the KIEE Conference
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• 1996.11a
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• pp.425-427
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• 1996

New fabrication technique was developed to make three dimensional silicon microstructure with five fold vertical steps through entire wafer thickness. Each step is pre-defined on multiply stacked thermal oxide and silicon nitride (O/N) layers by photolithographies. Multi-stepped silicon microstructure is formed by anisotropic etch in aqueous KOH solution with the patterned nitride film as masking layer. Fabricated microstructure consists of four $16{\mu}m$ thick flexural spring beams, $290{\mu}m$ thick proof mass, mesas for overrange stop with $10{\mu}m$ height from the surface of the proof mass, and the other mesas and V grooves used for assembling this structure to the packaging frame of pendulous servo accelerometer. Using the numerical finite element method (FEM) simulator: ABAQUS, mechanical characteristics of the fabricated microstructure by the developed technique was compared with those of the same structure processed by one step silicon bulk etch followed by oxidation and patterning the etched region.

• IE interfaces
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• v.24 no.1
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• pp.78-86
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• 2011

To mitigate space restriction and to raise productivity, some shipbuilding companies use floating-docks on the sea instead of dry-docks on the land. In that case, a floating-crane that can lift very heavy objects (up to 3,600 tons) is used to handle the blocks which are the basic units in shipbuilding processes, and so, very large blocks (these are called the mega-blocks) can be used to build a ship. But, because these mega-blocks can be made only in the area near the floating-dock and beside the sea, the space is very important resource for the process. Therefore, our problem is to make an efficient spatial schedule for the mega-block assembly yard. First of all, we formulate this situation into a mathematical model and find optimal solution for a small problem using a commercial optimization software. But, the software could not give optimal solutions for practical sized problems in a reasonable time, and so we propose a GA-based heuristic algorithm. Through a numerical experiment, finally, we show that the spatial scheduling algorithm can provide a very good performance.

• Journal of the Korean institute of surface engineering
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• v.50 no.5
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• pp.315-321
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• 2017

Antireflective pyramid arrays can be readily obtained via anisotropic etching in alkaline solution (KOH, NaOH), which is widely used in crystalline-Si (c-Si) solar cells. The periodic inverted pyramid arrays show even lower light reflectivity because of their superior light-trapping characteristics. Since this inverted pyramidal structures are mostly achieved using very complex techniques such as photolithograpy and laser processes requiring extra costs, here, we demonstrate the Cu-nanoparticle assisted chemical etching processes to make the inverted pyramidal arrays without the need of photolithography. We have mainly controlled the concentration of $Cu(NO_3)_2$, HF, $H_2O_2$ and temperature as well as time factors that affecting the reaction. Optimal inverted pyramid structure was obtained through reaction parameters control. The reflectance of inverted pyramid arrays showed < 10% over 400 to 1100 nm wavelength range while showing 15~20% in random pyramid arrays.