• Journal of the Microelectronics and Packaging Society
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• v.25 no.3
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• pp.13-19
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• 2018

The soldering property of Pb-containing solder(Sn-Pb) and Pb-free solders(Sn-3.0Ag-0.5Cu and Sn-1.0Ag-0.7Cu-1.6Bi-0.2In) for solar combiner box module was compared. The solar combiner box module was composed of voltage and current detecting modules, diode modules, and other modules. In this study, solder paste printability, printing shape inspection, solder joint property, X-ray inspection, and shear force measurements were conducted. For optimization of Pb-free soldering process, step 1 and 2 were divided. In the step 1 process, the printability of Pb-containing and Pb-free solder alloys were estimated by using printing inspector. Then, the relationship between void percentages and shear force has been estimated. Overall, the property of Pb-containing solder was better than two Pb-free solders. In the step 2 process, the property of reflow soldering for the Pb-free solders was evaluated with different reflow peak temperatures. As the peak temperature of the reflow process gradually increased, the void percentage decreased by 2 to 4%, but the shear force did not significantly depend on the reflow peak temperature by a deviation of about 0.5 kgf. Among different surface finishes on PCB, ENIG surface finish was better than OSP and Pb-free solder surface finishes in terms of shear force. In the thermal shock reliability test of the solar combiner box module with a Pb-free solder and OSP surface finish, the change rate of electrical property of the module was almost unchanged within a 0.3% range and the module had a relatively good electrical property after 500 thermal shock cycles.

• Journal of the Society of Disaster Information
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• v.13 no.1
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• pp.73-80
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• 2017

In this study, the panel joint behavior by the vehicle load moving on precast panel is analyzed. The frame was made for loading and the behavior was determined by using each measuring device. The static response of the panel was examined and compared with the theoretical value, and it was found that the characteristics were very reasonable. In addition, acceleration, velocity, and displacement were measured for dynamic impact evaluation, and the characteristics of moving load were analyzed in the test. The vibration frequency of the panel was measured for the dynamic response by the moving load, and the vibration characteristic was considered to be sensitive to the range of the load. As a result, it is considered that the dynamic response of the connection part should be careful in design because the characteristics are different according to the connection method.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2004.10a
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• pp.299-303
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• 2004

In our pervious paper, a new parallel-type spherical 3-degree-of-freedom mechanism consisting of a two-degree-of-freedom parallel module and a serial RRR subchain was proposed[1]. In this paper, its improved version is suggested and implemented. Differently from the previous 3-dof spherical mechanism, gear chains are incorporated into the current version of the mechanism to drive the distal revolute joint of the serial subchain from the base of the mechanism and in fact, the modification significantly improves kinematic characteristics of the mechanism within its workspace. Firstly, after a brief description on its structure, the closed-form solutions of both the forward and the reverse position analysis are derived. Secondly, the first-order kinematic model of the mechanism for the inputs which are assumed to be located at the base is derived. Thirdly, through the simulations of the kinematic analysis via. kinematic isotropic index, it is confirmed that the mechanism has much more improved isotropic properties throughout the workspace of the mechanism than the previous mechanism in [1]. Lastly, the proposed mechanism is implemented to verify the results from this analysis.

• Journal of the Korea Computer Industry Society
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• v.2 no.8
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• pp.1133-1138
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• 2001

In this paper, we implemented that MMT(Multimedia Terminal) demonstrates spot news, weather forecast, sports news and cultural news employed CDMA mobile communication networks. The MMT displays mobile pictures/joint pictures/on screen ad and to make known Bus stop or Mobile stations. The MMT gives driver's and passenger's safety and valuable information for one's use GPS satellites. We verified to make real time mobile picture transfer use of CDMA2000 1×(IS-95C) network and development the scheduler control each module. This system tested on vehicle that train and bus. MMT was implemented high reliability and stability by the embedded system. The mobile terminal shows reliable data transfer rate about 74Kbps on IS-95C.

• Knowledge Management Research
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• v.17 no.2
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• pp.75-101
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• 2016

Since 2009, China has become biggest automobile supplier and consumer all over the world. Chinese government and automobile firms have been executed strategic and aggressive industry policy and business strategy for nurturing automobile industry as a core manufacturing industry. However, can we assure that all of these policy and strategy have positive effect on Chinese automobile industry? For fulfilling this gab, our research examined the government policy and firm's strategy in different development stage of Chinese automobile industry. According to research result, at initial stage(1983-1996), Chinese automobile industry has grown by technological learning and reverse engineering from Soviet Union, Japan and Germany. In rapid growing stage(1996-2009), Chinese automobile firms have succeed to develop and produce own brand product with 100% own technology. And this kind of quantum jump in technology development was conducted by joint venture policy and M&A strategy. However, at the fourth stage(2010-), Chinese government and firms have over invested and focused on Electric Vehicle manufacturing without developing core technology or SW. Overall, the old-fashioned policy and strategy module in manufacturing industry of China could have negative effect on its industry development.

• Journal of Welding and Joining
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• v.21 no.2
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• pp.97-101
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• 2003

The change of microstructures in the base metal during transient liquid phase bonding process of directionally Ni base superalloy, GID-111 was investigated. Bonds were fabricated using a series of holding times(0~7.2ks) at three different temperatures. The flip chip bonding utilizing self-aligning characteristic of solder becomes mandatory to meet tolerances for the optical device. In this paper, a parametric study of aging condition and pad size of samples was evaluated. A TiW/Cu/electroplated Cu UBM structure was selected and the samples were aging treated to analyze the effect of intermetallic compounds with the time variations. An FIB technique was applied to the preparation of samples for TEM observations. An FIB technique is very useful to prepare TEM thin foil specimens from the solder joint interface. After aging treatment, the tendency to decrease in shear strength was measured and the structure of the solder and the UBM was observed by using SEM, TEM and EDS. As a result, the shear strength was decreased of about 21% in the 100${\mu}{\textrm}{m}$ sample at 17$0^{\circ}C$ aging compared with the maximum shear strength of the sample with the same pad size. In the case of the 12$0^{\circ}C$ aging treatment, 18% of decrease in shear strength was measured at the 100${\mu}{\textrm}{m}$ pad size sample. An intermetallic compound of Cu6Sn5 and Cu3Sn were also observed through the TEM measurement by using.

• Journal of Digital Contents Society
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• v.15 no.4
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• pp.473-480
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• 2014

As the use of computer has been popularized these days, an active research is in progress to make much more convenient and natural interface compared to the existing user interfaces such as keyboard or mouse. For this reason, there is an increasing interest toward Microsoft's motion sensing module called Kinect, which can perform hand motions and speech recognition system in order to realize communication between people. Kinect uses its built-in sensor to recognize the main joint movements and depth of the body. It can also provide a simple speech recognition through the built-in microphone. In this paper, the goal is to use Kinect's depth value data, skeleton tracking and labeling algorithm to recognize information about the extraction and movement of hand, and replace the role of existing peripherals using a virtual mouse, a virtual keyboard, and a speech recognition.

• Journal of Animal Science and Technology
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• v.62 no.2
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• pp.121-140
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• 2020

Anaerobic fungi habitat in the gastrointestinal tract of foregut fermenters or hindgut fermenters and degrade fibrous plant biomass through the hydrolysis reactions with a wide variety of cellulolytic enzymes and physical penetration through fiber matrix with their rhizoids. To date, seventeen genera have been described in family Neocallimasticaceae, class Neocallimastigomycetes, phylum Neocallimastigomycota and one genus has been described in phylum Neocallimastigomycota. In National Center for Biotechnology Information (NCBI) database (DB), 23,830 nucleotide sequences and 59,512 protein sequences have been deposited and most of them were originated from Piromyces, Neocallimastix and Anaeromyces. Most of protein sequences (44,025) were acquired with PacBio next generation sequencing system. The whole genome sequences of Anaeromyces robustus, Neocallimastix californiae, Pecoramyces ruminantium, Piromyces finnis and Piromyces sp. E2 are available in Joint Genome Institute (JGI) database. According to the results of protein prediction, average Isoelectric points (pIs) were ranged from 5.88 (Anaeromyces) to 6.57 (Piromyces) and average molecular weights were ranged from 38.7 kDa (Orpinomyces) to 56.6 kDa (Piromyces). In Carbohydrate-Active enZYmes (CAZY) database, glycoside hydrolases (36), carbohydrate binding module (11), carbohydrate esterases (8), glycosyltransferase (5) and polysaccharide lyases (3) from anaerobic fungi were registered. During four decades, 1,031 research articles about anaerobic fungi were published and 444 and 719 articles were available in PubMed (PM) and PubMed Central (PMC) DB.

• Structural Engineering and Mechanics
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• v.37 no.2
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• pp.197-213
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• 2011

Concrete is a heterogeneous material exhibiting quasi-brittle behaviour. While homogenization of concrete is commonly accepted in general engineering applications, a detailed description of the material heterogeneity using a mesoscale model becomes desirable and even necessary for problems where drastic spatial and time variation of the stress and strain is involved, for example in the analysis of local damages under impact, shock or blast load. A mesoscale model can also assist in an investigation into the underlying mechanisms affecting the bulk material behaviour under various stress conditions. Extending from existing mesoscale model studies, where use is often made of specialized codes with limited capability in the material description and numerical solutions, this paper presents a mesoscale computational model developed under a general-purpose finite element environment. The aim is to facilitate the utilization of sophisticated material descriptions (e.g., pressure and rate dependency) and advanced numerical solvers to suit a broad range of applications, including high impulsive dynamic analysis. The whole procedure encompasses a module for the generation of concrete mesoscale structure; a process for the generation of the FE mesh, considering two alternative schemes for the interface transition zone (ITZ); and the nonlinear analysis of the mesoscale FE model with an explicit time integration approach. The development of the model and various associated computational considerations are discussed in this paper (Part 1). Further numerical studies using the mesoscale model for both quasi-static and dynamic loadings will be presented in the companion paper (Part 2).

• Proceedings of the Korean Institute of Building Construction Conference
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• 2019.05a
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• pp.236-237
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• 2019

Building Information Modeling (BIM) and modular construction are regarded as important technologies that address several issues faced by the construction industry. However, the application guidelines for BIM in current modular construction projects are insufficient. This paper presents the preliminary work on the analysis of BIM utilization in a modular construction project; a five-point likert scale questionnaire was conducted to assess the necessity of BIM applications by the Necessity Index(NI) of nine categories(U1~U9) across two construction phases (onsite and offsite). The survey results indicate that applications for BIM based quantity takeoff for offsite phase(U4) as well as BIM modeling for module joint details(U8) were deemed to be the most necessary in each phase. The results of this study can be used as detailed guidelines for the integration of BIM in modular construction projects.