• Title/Summary/Keyword: Isothermal Process

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Development of hybrid resin to reduce silica in borated water

  • Ramzan Akhtar ;Shahid Latif ;Syed Aizaz Ali Shah ;Shaukat Saeed ;Abdul Aziz
    • Nuclear Engineering and Technology
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    • v.55 no.7
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    • pp.2547-2555
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    • 2023
  • Amberlite IRN-78 resin was incorporated with iron to make a hybrid resin for the removal of silica from the borated water of nuclear power plants. The hybrid resin contained 0.84 wt % iron compounds upon pyrolysis. In batch experiments carried out at room temperature, 1 g of the hybrid resin removed ~60 ㎍ silica from 1 ppm borated water in ~120 min. The efficiency of the hybrid material increased with the resin quantity, decreased with silica concentration, and remained unchanged at different pH values. Freundlich and Temkin isothermal adsorption dominated the silica removal process and followed the pseudo-first-order and intra-particle diffusion mechanism simultaneously. The concentration of the leached iron remained appreciably under the safe limits of 200 ㎍/l during the experiments. This detailed study suggests the use of hybrid resin for the removal of silica from borated water streams and other similar systems.

A Forging Analysis and Mechanical Properties Evaluation of Superalloy Exhaust Valve Spindle (초내열 합금 배기 밸브 스핀들 단조 해석 및 기계적 특성 평가)

  • Choi, S.G.;Oh, J.S.;Jeong, H.S.;Cho, J.R.
    • Proceedings of the Korean Society for Technology of Plasticity Conference
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    • 2009.10a
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    • pp.84-88
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    • 2009
  • The nickel-based alloy Nimonic 80A possesses strength, and corrosion, creep and oxidation resistance at high temperature. The exhaust valves of low speed diesel engines are usually operated at temperature levels of 400-$600^{\circ}C$ and high pressure to enhance thermal efficiency and exposed to the corrosion atmosphere by the exhaust gas. Also, the exhaust valve is subjected to repeated thermal and mechanical loads. So, the nickel-based alloy Nimonic 80A was used for the large exhaust valve spindle. It is composed a 540mm diameter head and a 125mm diameter stem. It is developed large products by hot closed-die forging. Manufacturing process analysis of the large exhaust valve spindle was simulated by closed die forging with hydraulic press and cooled in air after forging. The preform was heated to $1080^{\circ}C$ Numerical calculation was performed by DEFORM-2D, a commercial finite element code. Heat transfer can be coupled with the deformation analysis in a non-isothermal deformation analysis. Mechanical properties of the large exhaust valve spindle were evaluated by the variety of tests, including microstructure observation, tensile, as well as hardness and fatigue tests, were conducted to evaluate the mechanical properties for head part of exhaust valve spindle.

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The Effects of Packing and Cooling Stages on the Molded Parts in Injection Molding Process (사출 성형시 보압 및 냉각 과정이 성형품에 미치는 영향)

  • 구본흥;신효철;이호상
    • Transactions of the Korean Society of Mechanical Engineers
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    • v.17 no.5
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    • pp.1150-1160
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    • 1993
  • The behavior of polystyrene in the strip cavity during the packing and cooling stages for an injection molding process is examined numerically. The mathematical model is based on the unified post-filling model and finite element/finite difference methods are used to solve simultaneously the continuity, momentum and energy equations coupled to an equation of state. Simulated results show that the density of the molded parts is lower in the core than at the skin, and that the hotter the melt or the higher the packing pressure, the higher the density in the core. The density variation during the packing stage comes up to 50% compared with the total density variation. Also, the density variation after gate sealing and the effect of cooling rate on the equation of state are negligible.

An Analysis of Attenuation Effect of Pressure Head Using an Air Chamber (공기실을 사용한 압력수두의 완화효과에 대한 분석)

  • Lee, Jae-Su;Yun, Yong-Nam;Kim, Jung-Hun
    • Water for future
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    • v.28 no.5
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    • pp.141-150
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    • 1995
  • An air chamber is designed to keep the pressure from exceeding a predetermined value, or to prevent low pressures and column separation. Therefore, it can be used to protect against rapid transients in a pipe system following abrupt pump stoppage. In this research, an air chamber was applied to a hypothetical pipe system to analyze attenuation effect of pressure head for different air volumes, locations, chamber areas, coefficients of orifice loss and polytropic exponents. With an increase of air volume, the maximum pressure head at pump site is decreased and the minimum pressure head is increased. For different locations and areas of the chamber, the attenuation effects do not show much difference. Also, as the orifice loss coefficient increases, the maximum pressure head is decreased. For different polytropic exponents, isothermal process shows lower maximum pressure head than that of the adiabatic process.

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Growth Mechanism of Nickel Nanodispersoids during Consolidation of $Al_2O_3/Ni$ Nanocomposite Powder ($Al_2O_3/Ni$ 나노복합분말의 치밀화중 분산상 Ni의 성장기구)

  • ;;;;T. Sekino;K. Niihara
    • Journal of Powder Materials
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    • v.7 no.4
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    • pp.237-243
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    • 2000
  • The property and performance of the $Al_2O_3/Ni$ nanocomposites have been known to strongly depend on the structural feature of Ni nanodispersoids which affects considerably the structure of matrix. Such nanodispersoids undergo structural evolution in the process of consolidation. Thus, it is very important to understand the microstructural development of Ni nanodispersoids depending on the structure change of the matrix by consolidation. The present investigation has focused on the growth mechanism of Ni nanodispersoids in the initial stage of sintering. $Al_2O_3/Ni$ powder mixtures were prepared by wet ball milling and hydrogen reduction of $Al_2O_3$ and Ni oxide powders. Microstructural development and the growth mechanism of Ni dispersion during isothermal sintering were investigated depending on the porosity and structure of powder compacts. The growth mechanism of Ni was discussed based upon the reported kinetic mechanisms. It is found that the growth mechanism is closely related to the structural change of the compacts that affect material transport for coarsening. The result revealed that with decreasing porosity by consolidation the growth mechanism of Ni nanoparticles is changed from the migration-coalescence process to the interparticle transport mechanism.

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A Study on Heavy Metal Removal Using Alginic Acid (알긴산을 이용한 중금속 제거에 관한 연구)

  • Jeon, Choong;Choi, Suk Soon
    • Journal of the Korea Organic Resources Recycling Association
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    • v.15 no.4
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    • pp.107-114
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    • 2007
  • A study on the removal of heavy metals using alginic acid, a kind of polysaccharides, was performed. Alginic acid adsorbed 480 mg Pb/g dry mass at pH 4, which was about twice as high as uptake capacity of other biosorbents. Isothermal adsorption curve for lead ions was described by the Langmuir model equation and the experimental data well fitted to model equation. The adsorption of lead ions was an endothermic process since binding strength increased with temperature. The effect of alkali metal ions ($Ca^{2+}$ and $Mg^{2+}$) on lead sorption capacity was negligible and most adsorption process was completed in 30min. The uptake capacity of other metals such as, copper, mercury, strontium, and cesium ions using alginic acid was also investigated.

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An Approximate Analytical Solution for the Unsteady Close-Contact Melting on a Flat Surface with Constant Heat Flux (등열유속에 의한 평판위 비정상 접촉융해에 대한 근사적 해석해)

  • Yoo, Hoseon
    • Transactions of the Korean Society of Mechanical Engineers B
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    • v.22 no.12
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    • pp.1726-1734
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    • 1998
  • This paper focuses on the unsteady close-contact melting phenomenon occurring between a phase change material kept at its melting temperature and a flat surface on which constant heat flux is imposed. Based on the same simplifications and framework of analysis as the case of constant surface temperature, an approximate analytical solution which depends only on the liquid-to-solid density ratio is successfully derived. In order to keep consistency with the known solution procedure, both the dimensionless wall heat flux and the Stefan number are properly redefined. The obtained solution proves to agree quite well with the published numerical data and to be capable of resolving the fundamental features of unsteady close-contact melting, especially in the presence of the solid-liquid density difference. The density ratio directly affects the film growth rate and the initial value of solid descending velocity, thereby controlling the duration of unsteady process. The effects of other parameters can be evaluated readily from the steady solution which is implied in the normalized result. Since the dimensionless surface temperature for the present boundary condition increases from zero to unity along the evolution path of the liquid film thickness, the unsteady process lasts longer than that for the case of isothermal heating.

Cu Line Fabricated with Inkjet Printing Technology for Printed Circuit Board (잉크젯 인쇄 기술을 이용한 인쇄회로기판용 나노구리배선 개발)

  • Seo, Shang-Hoon;Lee, Ro-Woon;Yun, Kwan-Soo;Joung, Jae-Woo;Lee, Hee-Jo;Yook, Jong-Gwan
    • Proceedings of the KSME Conference
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    • 2008.11a
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    • pp.1806-1809
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    • 2008
  • Study that form micro pattern by direct ink jet printing method is getting attention recently. Direct ink jet printing spout fine droplet including nano metal particle by force or air pressure. There is reason which ink jet printing method is profitable especially in a various micro-patterning technology. It can embody patterns directly without complex process such as mask manufacture or screen-printing for existent lithography. In this study, research of a technology that ejects fine droplet form of Pico liter and forms metal micro pattern was carried with inkjet head of piezoelectricity drive system. Droplet established pattern while ejecting consecutively and move on the surface at the fixed speed. Patterns formed in ink are mixed with organic solvent and polymer that act as binder. So added thermal hardening process after evaporate organic solvent at isothermal after printing. I executed high frequency special quality estimation of CPW transmission line to confirm electrical property of manufactured circuit board. We tried a large area printing to confirm application possibility of an ink jet technology.

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Cure Reactions of Epoxy/Anhydride/(Polyamide Copolymer) Blends

  • Youngson Choe;Kim, Wonho
    • Macromolecular Research
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    • v.10 no.5
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    • pp.259-265
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    • 2002
  • The cure kinetics of blends of epoxy (DGEBA, diglycidyl ether of bisphenol A)/anhydride resin with polyamide copolymer, poly(dimmer acid-co-alkyl polyamine), were studied using differential scanning calorimetry (DSC) under isothermal condition. On increasing the amount of polyamide copolymer in the blends, the reaction rate was increased and the final cure conversion was decreased. Lower values of final cure conversions in the epoxy/(polyamide copolymer) blends indicate that polyamide hinders the cure reaction between the epoxy and the curing agent. The value of the reaction order, m, for the initial autocatalytic reaction was not affected by blending polyamide copolymer with epoxy resin, and the value was approximately 1.3, whereas the reaction order, n, for the general n-th order of reaction was increased by increasing the amount of polyamide copolymer in the blends, and the value increased from 1.6 to 4.0. A diffusion-controlled reaction was observed as the cure conversion increased and the rate equation was successfully analyzed by incorporating the diffusion control term for the epoxy/anhydride/(polyamide copolymer) blends. Complete miscibility was observed in the uncured blends of epoxy/(polyamide copolymer) up to 120 $^{\circ}C$, but phase separations occurred in the early stages of the curing process at higher temperatures than 120 "C. During the curing process, the cure reaction involving the functional group in polyamide copolymer was detected on a DSC thermogram.gram.

The fabrication of $MgB_2$/SUS Tapes by PIT Process

  • 송규정;이남진;장현만;하홍수;하동우
    • Progress in Superconductivity
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    • v.3 no.2
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    • pp.213-217
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    • 2002
  • We have fabricated successfully single-filament composite $MgB_2$/SUS tapes, as an ultrarobust conductor type. The fabrication of the $MgB_2$/SUS tapes was performed by power-in-tube (PIT) process such as swaging and cold rolling. The critical transition temperatures $T_{c}$~38.5 K and ~36 K were observed for the sintered and the nonsintered $MgB_2$/SUS tapes, respectively In addition, the isothermal magnetization M(H) of the sintered $MgB_2$/SUS tapes was measured at temperatures T (between 5 and 50 K) in fields up to 6 T, employing a PPMS-9 (Quantum Design). The persistent current density (J$T_{P}$) values were obtained from the M(H) data, using Bean model, fur the sintered $MgB_2$/SUS tapes. The estimated values were higher than ~ 6$\times$ $10^{5}$ $A/\textrm{cm}^2$ at T = 5 K, with H : 0 G. We also investigated the cross section of the sintered tapes, by using SEM and EDX. An evidence of weak reaction on boundary between $MgB_2$ and SUS tube is found in the SEM and EDX.X.X.X.

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