• Journal of IKEEE
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• v.25 no.4
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• pp.778-781
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• 2021

In this paper, we propose the 16-layer 3D NAND Flash memory compact modeling using SPICE. In the same structure and simulation conditions, the channel potential about Down Coupling Phenomenon(DCP) and Natural Local Self Boosting (NLSB) were simulated and analyzed with Technology Computer Aided Design(TCAD) tool Atlas(Silvaco^TM) and SPICE, respectively. As a result, it was confirmed that the channel potential of TCAD and SPICE for the two phenomena were almost same. The SPICE can be checked the device structure intuitively by using netlist. Also, its simulation time is shorter than TCAD. Therefore, using SPICE can be expected to efficient research on 3D NAND Flash memory.

• The Transactions of The Korean Institute of Electrical Engineers
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• v.65 no.3
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• pp.439-444
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• 2016

The method for extracting the SPICE model parameter of Schottky diode under DC forward bias is proposed. A method for improving the accuracy of the SPICE model parameter at various temperatures is proposed. Three analysis steps according to the magnitude of the current is used in order to extract the parameters effectively. At each analysis step, initial parameters are calculated by using the current-voltage equations and the Levenberg-Marquardt analysis is proceeded. To verify the validity of the proposed method, the SPICE model parameters for the BAT45 and FSV1045 under DC forward bias is extracted. Schottky diode currents obtained from the proposed method shows the average relative error of 6.1% and 9% compared with the measured data for the BAT45 and FSV1045 sample at various temperatures.

• KIPS Transactions on Software and Data Engineering
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• v.5 no.7
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• pp.339-344
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• 2016

With increasing complexity of automotive software it has become important issue in the automotive safety. So, Automotive SPICE process have been proposed to solve this problem. The integrated management system and tools are needed for perform the Automotive SPICE process. It is difficult to adopt an integrated management system and tools because small business are lack of human resource and tools. Therefore, HIS scope items comply with Automotive SPICE minimum requirement should be targeted for the small business. In this paper, an open-source system based on process management tool required to perform the Automotive HIS scope items is proposed. The proposed system can perform the Automotive SPICE HIS scope items are carried and it showed that satisfy the Automotive SPICE HIS scope items.

• Proceedings of the KIEE Conference
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• 2007.07a
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• pp.1203-1204
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• 2007

In the methods for securing software quality and safety, two approaches - product centered approach and process centered approach - can be suggested. SPICE is a standard for the process improvement and the capability determination, which is planned for securing software quality and safety by the process centered approach. In this paper, general SPICE model, which is presented in ISO/IEC 15504 and Automotive SPICE model for automobile industry are analyzed. For securing railway software quality and safety, appropriate scheme to apply Automotive SPICE to railway software is proposed.

• The Transactions of the Korean Institute of Electrical Engineers
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• v.43 no.2
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• pp.206-215
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• 1994

A method for simulating general characteristics and temperature characteristics of discharging SCR of the capacitor discharge impulse magnetizer-magnetizing fixture system using SPICE is presented. This method has been developed which can aid the design, understanding and inexpensive, time-saving of magnetizing circuit. As the detailed characteristic of magnetizing circuit can be obtained, the efficient design of the magntizing circuit which produce desired magnet will be possible using our SPICE modeling. Especially, computation of the temperature rise of discharging SCR is very important since it gives some indication of thermal characteristic of discharging circuit. It is implemented on a 486 personal computer, and the modeling results are checked against experimental measures. The experimental results have been achived using 305[V] and 607[V] charging voltage, low-energy capacitor discharge impulse magnetizer-magnetizing fixture of air cleaner DC motor.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.37 no.2
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• pp.38-45
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• 2000

In this paper, an approach of modeling the optical interconnection system by SPICE simulation is presented. SPICE simulations with equivalent circuit models for optical devices are performed in a stable manner. From the simulated results, eye diagrams for receiver output and BER are obtained. Timing jitter due to laser diode turn-on delay effects can be found under various bias conditions. Using this approach, various system parameters such as bit rate, BER, dissipated transmitter power, and bias conditions can be optimized. It is expected that this approach will find useful applications such as Gigabit Ethernet and ATM.

• Journal of the Korean earth science society
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• v.32 no.5
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• pp.437-452
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• 2011

The Steptoean Positive Carbon Isotope Excursion (SPICE) is found in the Machari Formation which was interpreted to have been deposited on the middle to outer carbonate ramp environment. The Machari Formation is the Middle to Late Cambrian in age and distributed in the Yeongweol area, Gangweon Province, Korea. The SPICE event in the Machari Formation begins with the first appearance datum of trilobite Glyptagnostus reticulatus and ends with the first appearance of datum of trilobite Irvingella. The SPICE is found in approximately 120 m thick sequence and ${\delta}^{13}C$ values in the SPICE interval range from 0.6 to 4.4‰. The SPICE in the Machari Formation is interpreted to be caused by burial of organic matter in the sea floor and subsequent increase of $^{13}C$ isotope of the Late Cambrian ocean. The SPICE interval in the Machari Formation corresponds to the highstand to transgressive systems tracts.

• The Transactions of The Korean Institute of Electrical Engineers
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• v.58 no.9
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• pp.1769-1774
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• 2009

An algorithm for extracting the BJT DC model parameter values for SPICE model is proposed. The nonlinear optimization method for analyzing the device I-V data using the Levenberg-Marquardt algorithm is proposed and the method for calculating initial conditions of model parameters to improve the convergence characteristics is proposed. The base current and collector current obtained from the proposed method shows the root mean square error of 6.04% compared with the measured data of the PNP BJT named 2SA1980.

• Journal of Power Electronics
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• v.19 no.6
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• pp.1591-1600
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• 2019

In this paper, a practical SPICE model for an IGBT and a PiN diode is proposed based on the Finite Differential Method (FDM). Other than the conventional Fourier model and the Hefner model, the excess carrier distribution can be accurately solved by a fast FDM in the SPICE simulation tool. In order to improve the accuracy of the SPICE model, the Taguchi method is adopted to calibrate the extracted parameters. This paper presents a numerical modelling approach of an IGBT and a PIN diode, which are also verified by SPICE simulations and experiments.

• Journal of information and communication convergence engineering
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• v.14 no.2
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• pp.115-121
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• 2016

Currently there is a lack of literature on SPICE-level models of double-gate (DG) tunnel field-effect transistors (TFETs). A DG TFET compact model is presented in this work that is used to develop a SPICE model for DG TFETs implemented with Verilog-A language. The compact modeling approach presented in this work integrates several issues in previously published compact models including ambiguity about the use of tunneling parameters A_k and B_k, and the use of a universal equation for calculating the surface potential of DG TFETs in all regimes of operation to deliver a general SPICE modeling procedure for DG TFETs. The SPICE model of DG TFET captures the drain current-gate voltage (I_ds-V_gs) characteristics of DG TFET reasonably well and offers a definite computational advantage over TCAD. The general SPICE modeling procedure presented here could be used to develop SPICE models for any combination of structural parameters of DG TFETs.