• 연구논문집
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• s.30
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• pp.137-145
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• 2000

Since the concept of osseointegration was introduced, titanium and titanium-based alloy materials have been increasingly used for bone-anchored metal in oralmaxillofacial and orthopedic reconstruction. Successful osseointegration has been attributed to biocompatibility and surface condition of metal implant among other factors. Although titanium and titanium alloys have an excellent over the metal ion release and biocompatibility, considerable controversy has developed over the metal ion and wear debris in vivo and vitro. In this study, nitrogen ion implantation technique was used to improve the corrosion resistance and wear property of titanium materials, ultimately to enhance the tissue reaction to titanium implants As ion implantation energy was increased, projected range of nitrogen ion the Ti substrate was gradually increased. Under condition of constant ion energy. atomic concentration of nitrogen was also increased with ion doses. The friction in Hank's solution was increased with ion doses. The friction coefficient of ion implanted specimens in HanK's solution was increased from 0.39, 0.47 to 0.52, 0.65 respectively under high energy and ion dose conditions. As increasing ion energies and ion dose, amount of wear was reduced.

• Proceedings of the IEEK Conference
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• 2004.06b
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• pp.485-488
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• 2004

As scaling down the cell channel length, the increment of B concentration in channel region is inevitable to overcome the punch-through, especially in flash memory cell with 90nm technology. This paper shows that the high dose ion implantation in channel cause the Si defect. which has been proved to be the major cause of the tailed Vth in distribution. And also mechanical stress due to SiN-anneal process can induce the Si dislocation. and get worse it. With decreasing the channel implantation dose, skipping the anneal and reducing the mechanical stress, Si defect problem is solved completely. We are verify first that the optimization of B concentration in channel must be certainly considered in order to improve Si defect. It is also certainly necessary to stabilize the distribution of cell Vth in the next generation of flash memory.