• Journal of Auto-vehicle Safety Association
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• v.13 no.2
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• pp.30-34
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• 2021

Electrical failures and reliability problems of electronic components by ionic migration between adjacent device terminals have become an issue in automotive electronics. Especially unlike galvanic corrosion, ionic migration is occurred at high temperature and high humidity under applied electric field condition. Until now, although extensive studies of the ionic migrations dealing with PCBs, electrodes, and solders were reported, there is no study on the effect of insulation polymers and metallic fillers for ionic migration. In this research, therefore, ionic migration induced by the types and contents of polymers and metallic fillers, and variety conditions of temperature, humidity, and applied voltage was studied in detail. Ester and amide types of liquid crystal polymer (LCP) and poly (phthalamide) (PPA) were used as base polymers, respectively and compounded with the metallic fillers of Copper iodide (CuI), Zinc stearate (Zn-st), or Calcium stearate (Ca-st) in various compositions. The compounding polymers were fabricated in IPC-B-24 of SIR test coupon according to ISO 9455-17 with Cu electrodes for ionic migration test. While there is no change in LCP-based samples, ionic migration in PPA compounding sample with a high water absorption property was accelerated in the presence of 0.25 wt% or above of CuI at the environmental conditions of 85℃, 85% RH and 48V. The dendritic short-circuit growth of Cu caused by ionic migration between the electrodes on the surface of compounded polymers was systematically observed and analyzed by using optical microscopy and SEM (EDX).

• Journal of the Korean Ceramic Society
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• v.34 no.7
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• pp.685-692
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• 1997

Effects of sintering temperature and time on the phase formation, the characteristics of sintering and electrical behaviors of NASICON compounds with Na3Zr2Si2PO12 and Na3.2Zr1.3Si2.2P0.8O10.5 compositions synthesized by solid state reaction were investigated. Maximum relative densities of 96% and 91% were obtained for Na3Zr2Si2PO12 and Na3.2Zr1.3Si2.2P0.8O10.5 compounds, respectively. Complex impedance analysis in a frequency range below 4 MHz was performed to measure the ionic conductivity and migration barrier height of the compounds at RT-30$0^{\circ}C$. The maximum ionic conductivity and the minimum migration barrier height were 0.45 ohm-1cm-1 and 0.07 eV, respectively. The migration barrier height of the high temperature form (space group : R3c) is about 30-40% of that of the low temperature form (space group : C2/c) in two NASICON compounds. Ionic conductivity increases with increasing sinterability, and the presence of glass phase in Na3.2Zr1.3Si2.2P0.8O10.5 compounds lowers significantly ionic conductivity at temperatures above 14$0^{\circ}C$.

• Journal of Electrochemical Science and Technology
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• v.13 no.1
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• pp.71-77
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• 2022

Metal halide perovskites are promising photovoltaic materials, but they still have some issues that need to be solved. Hysteresis is a phenomenon that strongly is correlated with ion migration; thus, a fast, easy, and low-temperature method for measuring ion migration is required. Through selective blocking, ion migration can be measured separately, apart from electron migration. In this study, ion migration in metal halide perovskites was measured using a vertical device. At different temperatures, ionic activation energies were obtained for a range of perovskite compositions such as MAPbI₃, FAPbI₃, CsPbI₃, and MAPbBr₃. By comparing the measured ionic activation energies with the theoretical values, we conclude that among other possibilities, I^- is the migrating ion in MAPbI₃, FAPbI₃, CsPbI₃, and Br- is the migrating in MAPbBr₃.

• Journal of the Korean Ceramic Society
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• v.52 no.5
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• pp.331-337
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• 2015

$LaBO_3$ (B = Cr, Mn, Fe, Co, and Ni) perovskites, the most common perovskite-type mixed ionic-electronic conductors (MIECs), are promising candidates for intermediate-temperature solid oxide fuel cell (IT-SOFC) cathodes. The catalytic activity on MIEC-based cathodes is closely related to the bulk ionic conductivity. Doping B-site cations with other metals may be one way to enhance the ionic conductivity, which would also be sensitively influenced by the chemical composition of the dopants. Here, using density functional theory (DFT) calculations, we quantitatively assess the activation energies of bulk oxide ion diffusion in $LaBO_3$ perovskites with a wide range of combinations of B-site cations by calculating the oxygen vacancy formation and migration energies. Our results show that bulk oxide ion diffusion dominantly depends on oxygen vacancy formation energy rather than on the migration energy. As a result, we suggest that the late transition metal-based perovskites have relatively low oxygen vacancy formation energies, and thereby exhibit low activation energy barriers. Our results will provide useful insight into the design of new cathode materials with better performance.

• Bulletin of the Korean Chemical Society
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• v.33 no.1
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• pp.248-254
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• 2012

During the monolayer assembly of zeolite microcrystals using sonication with stacking (SS) method, the factors that govern the degree of close packing (DCP) between the microcrystals, the rate of attachment (rA) of microcrystals onto the substrate, the degree of coverage (DOC), and the binding strength (BS) between each crystal and the substrate were investigated for each mode of binding linkage (MBL). The tested MBLs were covalent linkage (CL), ionic linkage (IL), and polyelectrolyte-mediated ionic linkage (p-IL). Unlike the monolayers of zeolite crystals assembled on glass with a covalent linkage, the strong BS, very high DOC, and very high DCP do not decrease during monolayer assembly on glass through ionic linkages. This results indicate that the surface migration of crystals undergo linkage-nondestructively when crystals were attached to the substrates through ionic linkages.

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2017.05a
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• pp.96.1-96.1
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• 2017

This presentation introduces anodizing science of typical valve metals of Al, Mg and Ti, based on the ionic transport through the andic oxide films in various electrolyte compositions. Depending on the electrolyte composition, metal ions and anions can migrate through the andic oxide film without its dielectric breakdown when point defects are present within the anodic oxide films under high applied electric field. On the other hand, if anodic oxide films are broken by local joule heating due to ionic migration, metal ions and anions can migrate through the broken sites and meet together to form new anodic films, known as plasma electrolytic oxidation (PEO) treatment. In this presentation, basics of conventional anodizing and PEO methods are introduced in detail, based on the ionic migration and movement mechanism through anodic oxide films by point defects and by local dielectric breakdown of anodic oxide films.

• Journal of Power System Engineering
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• v.9 no.1
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• pp.64-69
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• 2005

In evaluation of electronic reliability on the PCB(Print Circuit Borad),electrochemical migration is one of main test objects. The phenomenon of electrochemical migration occurs in the environment of the hight humidity and the hight temperature under bias through a continuous aqueous electrolyte. In this paper, the generating mechanism of electrochemical migration is investigated by using water drop acceleration test under various waters. The waters used in the water drop test are city water, distilled water and ionic water. It found that the generated velocity of electrochemical migration depended on electrolyte quantity which included in the various waters.

• Journal of Magnetics
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• v.16 no.4
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• pp.444-448
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• 2011

In the present study, we separated the marker particles from the suspending particle mixture solution using isotacho-electrophoresis technique, a novel quantitative ionic particle separation method, in the microchannel. A multiple stacking zone of the suspending particle was visualized with variations in electric field strength, pH value and concentration of the ionic solution. In particular, the electrophoretic mobility of ionic particle (fluorescein) was estimated based on the electrophoretic velocity value measured by the particle image velocimetry. As a result, isotacho-electrophoresis zones were clearly visualized as going downstream in the electric field. The particle migration velocity increased proportional to the applied voltage increase; it was also affected by the pH value variations in the ionic solution.

• Corrosion Science and Technology
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• v.6 no.2
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• pp.50-55
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• 2007

The smaller size and higher integration of advanced electronic package systems result in severe electrochemical reliability issues in microelectronic packaging due to higher electric field under high temperature and humidity conditions. Under these harsh conditions, electronic components respond to applied voltages by electrochemical ionization of metal and the formation of a filament, which leads to short-circuit failure of an electronic component, which is termed electrochemical migration. This work aims to evaluate electrochemical migration susceptibility of the pure Sn, Sn-3.5Ag, Sn-3.0Ag-0.5Cu solder alloys in $Na_{2}SO_{4}$. The water drop test was performed to understand the failure mechanism in a pad patterned solder alloy. The polarization test and anodic dissolution test were performed, and ionic species and concentration were analyzed. Ag and Cu additions increased the time to failure of Pb-free solder in 0.001 wt% $Na_{2}SO_{4}$ solution at room temperature and the dendrite was mainly composed of Sn regardless of the solders. In the case of SnAg solders, when Ag and Cu added to the solders, Ag and Cu improved the passivation behavior and pitting corrosion resistance and formed inert intermetallic compounds and thus the dissolution of Ag and Cu was suppressed; only Sn was dissolved. If ionic species is mainly Sn ion, dissolution content than cathodic deposition efficiency will affect the composition of the dendrite. Therefore, Ag and Cu additions improve the electrochemical migration resistance of SnAg and SnAgCu solders.

• Bulletin of the Korean Chemical Society
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• v.10 no.6
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• pp.495-500
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• 1989

The ionic conductivity of polycrystalline, glass, and glass-ceramic silicates was measured using two-terminal AC method with blocking electrode over a frequency range of 100 Hz to 100 KHz in the temperature range of $200^{\circ}C$ to $320^{\circ}C$. Analysing the capacitance (C), susceptance (B), impedance (Z), and conductance (G) under the given conditions, an equivalent circuit containing temperature and frequency dependent component is proposed. Higher capacitance could be observed in the low frequency region and on the improved ionic migration conditions i.e., at higher temperature in a better ionic conductor. Also the electrode polarization built up at the electrode-specimen interface could be sorted out above 10 KHz. However, grain boundary contribution couldn't be extracted from the bulk resistance over the frequency range measured here.