• 한국진공학회:학술대회논문집
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• 한국진공학회 1998년도 제14회 학술발표회 논문개요집
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• pp.41-41
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• 1998

Rare earth metal films have been used as a buffer layer for growing ferroelectric t thin film or a seed layer for magnetic multilayer. But when it was deposited on s semiconductor substrates for the application of magneto-optic (MO) storage media, it i is difficult to exactly measure magnetic cons떠nts due to shunting current, and so it n needs to grow metal films on insulator substrate to reduce such effect. Recently, it w was reported that ultra-thin Pt layer were epitaxially grown on A12O:J by ion beam s sputtering in 비떠 high vacuum and it can be used as a seed layer for the growth of C Co-contained magnetic multilayer. In this stu$\phi$, Pt thin film were epi떠xially grown on AI2D3 ($\alpha$)OJ) by RF magnetron s sputtering. The crystalline structure was analyzed by transmission electron microscope ( (TEM) and Rutherford Back Scattering (RBS)/Ion Channeling. In TEM study, Pt was b believed to be twinned on AI잉3($\alpha$)01) su$\pi$ace about Pt(ll1) plane.Moreover, RBS c channeling spectra showed that minimum scattering yield of Pt(111)/AI2O:J(1$\alpha$)OJ) was 4 4% and Pt(11J)/AI2D3($\alpha$)OJ) had 3-fold symmetry.

• 한국진공학회지
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• 제6권1호
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• pp.97-102
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• 1997

이온-고체 표면 사이의 상호작용에 관한 연구를 수행하기 위하여 중 에너지 이온산 란 분광장치를 개발하였고 그 특성 평가를 수행하였다. 제작된 MEIS의 에너지 분해능은 $4\times 10^{-3}$으로 측정되었다. MEIS의 표면분석의 응용으로 60keVH+을 $Ta_2O_5$(300$\AA$)/Si에 적용하 여 에너지 손실인자와 깊이분해능을 얻은 결과는 42eV/$\AA$와 9.7$\AA$이었다. 또한, Si(100)표면 에 97.5KeV$H^+$이온을 random방향으로 입사시켜 이차원 스펙트럼을 얻었다.

• 한국결정학회지
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• 제19권1호
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• pp.7-13
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• 2008

고체 표면의 구조해석 방법에는 LEED(저에너지 전자선 회절법)나 RHEED(반사 고에너지 전자선 회절법) 등과 같이 표면의 2차원적 회절상을 해석하는 방법이 있고(역격자 공간의 해석), 또는 ISS(이온산란 분광법), RBS(러더포드 후방산란법) 등과 같이 표면 원자의 실공간에 대한 정보를 직접 얻는 방법이 있다. 실제로는 두 가지 종류의 분석법을 상호 보완적으로 조합하여 효율적인 구조해석을 수행한다. 본고에서는 직충돌 이온산란 분광법(ICISS: Impact Collision Ion Scattering Spectroscopy)에 대한 원리, 장치, 측정방법 등을 소개한 전고에 이어서 이를 이용한 반도체 표면구조 해석에 관하여 기술하고자 한다. 표면의 원자구조를 알아내기 위해서는 산란된 입자의 강도를 입사각도와 출사각도에 대하여 조사하여야 하는데, 이온이 원자와 충돌하여 산란될 때 원자의 후방으로 형성되는 shadow cone에 의하여 생성되는 집속 효과(focusing effect) 및 가리움 효과(blocking effect) 중에서 ICISS는 집속 효과만을 고려하여 해석하면 실공간에서의 원자구조를 해석할 수 있다. 본 고에서는 ICISS를 이용하여 금속 또는 절연체 물질이 반도체 표면 위에서 흡착 또는 성장될 때 초기의 계면 구조 해석, 금속/반도체 계면에서 시간에 따른 동적변화 해석, III-V족 반도체의 표면구조 해석, 반도체 기판 위에서 박막 성장 과정 해석 등에 관한 연구 사례를 소개하고자 한다.

• 한국재료학회지
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• 제7권7호
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• pp.559-563
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• 1997

Ta을 2MeV의 에너지로 가속시켜 1x$10^{17}$atoms/$\textrm{cm}^2$의 농도로 TiC(001)면에 이온 주입시킨 후 비행시간형 직충돌이온산란 분광법(time-of-flight impact-collision ion scattering spectroscopy; TOF-ICISS)을 사용하여 TiC(001)면의 Ta표면 편석을 연구하였다. TOF-ICISS는 표면 수층 깊이까지 원자구조를 측정할 수 있는 수법으로, 이온주입된 시편을 1$600^{\circ}C$에서 300sec동안 진공 가열하여 Ta 원자를 편석시킨 후 스펙트럼의 입사각도 의존성을 구함으로써 Ta원자의 편석 위치 및 농도구배를 조사하였다. [110]및 [100]방위에서 Ta과 Ti의 focusing peak가 서로 같은 입사각도에서 나타나며 편석된 Ta원자는 TiC의 Ti-site에 위치한다. Ta원자는 표면 최외층에만 편석되는 것이 아니라 수층에 걸쳐 Ti-site에 자리하고 있으며, Ta 원자의 농도는 표면 최외층에서 내부 층으로 깊어질수록 작아진다. 이온주입시 생성된 표면층의 탄소 격자 결함은 시편 가열시 벌크에 자리하는 탄소가 확산되어 없어진다.다.

• 한국결정학회지
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• 제13권2호
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• pp.57-62
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• 2002

MgO(001)면 위에 Ti 금속을 증착시킨 후 400℃에서 산소에 노출시킴으로써 헤테로 에피탁시 TiO 막을 성장시켰다. 성장된 TiO막의 원자구조를 비행시간형 직충돌 이온산란 분광법을 사용하여 해석하였다. MgO(001)면에 성장된 에피탁시 TiO막은 다음과 같은 구조를 갖고 있음이 밝혀졌다. Ti및 O 원자가 MgO 원자의 위에 위치하여 면내방향의 격자상수는 MgO의 격자상수와 일치하고, TiO막의 표면은 3차원적 섬 형상이 없는 평활한 구조를 가지고 있다.

• 센서학회지
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• 제30권4호
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• pp.267-272
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• 2021

In this study, Ag was deposited to investigate its applicability as a surface-enhanced Raman scattering substrate after forming a grass-type black silicon structure through maskless reactive ion etching. Grass-structured black silicon with heights of 2 - 7 ㎛ was formed at radio-frequency (RF) power of 150 - 170 W. The process pressure was 250 mTorr, the O₂/SF₆ gas ratio was 15/37.5, and the processing time was 10 - 20 min. When the processing time was increased by more than 20 min, the self-masking of Si_xO_yF_z did not occur, and the black silicon structure was therefore not formed. Raman response characteristics were measured based on the Ag thickness deposited on a black silicon substrate. As the Ag thickness increased, the characteristic peak intensity increased. When the Ag thickness deposited on the black silicon substrate increased from 40 to 80 nm, the Raman response intensity at a Raman wavelength of 1507 / cm increased from 8.2 × 10³ to 25 × 10³ cps. When the Ag thickness was 150 nm, the increase declined to 30 × 10³ cps and showed a saturation tendency. When the RF power increased from 150 to 170 W, the response intensity at a 1507/cm Raman wavelength slightly increased from 30 × 10³ to 33 × 10³ cps. However, when the RF power was 200 W, the Raman response intensity decreased significantly to 6.2 × 10³ cps.

• 한국진공학회:학술대회논문집
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• 한국진공학회 1998년도 제14회 학술발표회 논문개요집
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• pp.20-20
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• 1998

I Ion beam technology has recently attracted much interest because it has exciting t technological p아:ential for surface analysis, ion beam mixing, surface cleaning and etching i in thin film growth and semiconductor fabrication processes, etc. Es야~cially, ion beam s sputtering has been widely used for sputter depth profiling with x-photoelectron S spectroscopy (XPS) , Auger electron s$\pi$~troscopy(AES), and secondary-ion mass S야i따oscopy(SIMS). However, The problem of surface compositional ch없1ge due to ion b bombardment remains to be understo여 없ld solved. So far sputtering processes have been s studied by s따face an외ysis tools such as XPS, AES, and SIMS which use the sputtering p process again. It would be improbable to measure the modified surface composition profiles a accurately due to ion beam bombardment with surface analysis techniques based on sputter d depth profiling. However, recently Medium energy ion scattering spectroscopy(MEIS) has b been applied to study the sputtering of solid surface at ion bombardment and has been p proved that it has been extremely valuable in probing the surface composition 뻐d s structure nondestructively and quantita디vely with less than 1.0 nm depth resolution. To u understand the sputtering processes of solid surface at ion bombardment, The Molecular D Dynamics(MD) and Monte Carlo(MC) simulation has been used and give an intimate i insight into the sputtering processes of solid surfaces. In this presentation, the sputtering processes of alloys and compound samples at ion b bombardment will be reviewed and the MEIS results for the Ar+ sputter induced altered l layer of the TazOs thin film 뻐dd없nage profiling of Ar+ ion sputt얹"ed Si(100) surface will b be discussed with the results of MD and MC simulation.tion.

• 한국진공학회:학술대회논문집
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• 한국진공학회 1998년도 제14회 학술발표회 논문개요집
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• pp.129-129
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• 1998

Most of the surface/interface analysis tools have limited depth profiling c capability in terms of the profiling range and the depth resolution. However, M MEIS can profile the surface and subsurface composition and structure q quantitatively and non-destructively with atomic layer depth resolution. I In this presentation, the MEIS system developed at KRISS will be briefly d described with an introduction on the principle of MEIS. Recent MEIS r results on the surface and interface composition and structural change due to i ion bombardment will be presented for preferential sputtering of T:없Os and d damage depth profiles of SHooD, Pt(l11), and Cu(l1D due to Ar+ ion b bombardment. Direct observation of strained Si lattices and its distribution i in the SHool)-SiCh interface and the initial stage of Co growth on Pt(l11) w will be reported. H surfactant effects on epitaxial growth of Ge on Si(ooD w will be discussed with STM results from SND.

• 전자공학회논문지A
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• 제30A권12호
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• pp.43-50
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• 1993

Three-dimensional simulator for the ion implantation process is developed. The simulator based on an analytical model which would be a choice with high computational efficiency and accuracy. This is an important issue for the simulation of a numerous number of processing steps required in the fabrication of ULSI or GSI. The model can explain scattering and bulk channeling mechanism (1D). It can also explain depth dependent lateral diffusion effect(2D) and mask effect(3D). The model is consist of one-dimensional JPD(Joined Pearson Distribution) function and two-dimensional modified Gaussian functions. Final implanted profiles under typical mask structures such as hole, line and island structure are obtained with varying ion species.

• 진공이야기
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• 제2권2호
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• pp.17-23
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• 2015

Medium Energy Ion Scattering (MEIS) has been successfully used for ultrathin film analysis such as gate oxides and multilayers due to its single atomic depth resolution in compostional and structural depth profiling. Recently, we developed a time-of-flight (TOF) MEIS for the first time, which can analyze a $10{\mu}m$ small spot. Small spot analysis would be useful for test pattern analysis in semiconductor industry and various thin film technology. The ion beam damage problem is minimized due to its improved collection efficiency by orders of magnitude and the ion beam neutralization problem is removed completely for quantitative analysis. Newly developed TOF-MEIS has been applied for gate oxides, ultra shallow junctions, nanoparticles, FINFET structures to provide compositional and structural profiles. Further development for submicron spot analysis and applications for functional nano thin films and nanostructured materials are expected for various nanotechnology and biotehnology.