• Title/Summary/Keyword: Ion beam method

Search Result 411, Processing Time 0.035 seconds

Alignment and lattice quality of hexagonal rings of hexagonal BN films synthesized by ion beam assisted deposition (이온빔보조증착법으로 합성한 hexagonal BN막의 hexagonal ring의 배열과 결정성)

  • 박영준;한준희;이정용;백영준
    • Journal of the Korean Vacuum Society
    • /
    • v.8 no.1
    • /
    • pp.43-50
    • /
    • 1999
  • We have studied the alignment and the lattice quality of hexagonal rings of h-BN films synthesized by ion beam assisted deposition (IBAD) method. Boron was e-beam evaporated at 1.5 $\AA$/sec and nitrogen gas was ionized using end-hall type ion gun at 60, 80, and 100 eV, respectively. Substrate was either not heated or heated at 200, 400, 500, and $800^{\circ}C$, respectively. As nitrogen ion energy increases, c-axes of hexagonal rings tend to align parallel to the substrate, which is explained by larger compressive stress at higher ion energies. Alignment of c-axis increases with temperature and shows maximum around $400^{\circ}C$. The lattice quality of hexagonal rings improves with temperature. Such behaviors can be understood from two counter trends of increasing the atomic mobility and decreasing compressive stress with temperature. Hardness of h-BN films shows the same trend with the alignment of c-axis. Ion beam assisted deposition method seems to be effective for aligning hexagonal rings and optimizing h-BN properties.

  • PDF

Properties of liquid crystal alignment layers exposued to ion-beam irradiation enemies (이온빔 에너지에 따른 액정배향막의 전기광학적 특성연구)

  • Oh, Byeong-Yun;Lee, Kang-Min;Park, Hong-Gyu;Kim, Byoung-Yong;Kang, Dong-Hun;Han, Jin-Woo;Kim, Young-Hwan;Han, Jeong-Min;Lee, Sang-Keuk;Seo, Dae-Shik
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
    • /
    • 2007.11a
    • /
    • pp.430-430
    • /
    • 2007
  • In general, polyimides (PIs) are used in liquid crystal displays (LCDs) as alignment layer of liquid crystals (LCs). Up to date, the rubbing alignment technique has been widely used to align liquid crystals on the PI surface, which is suitable for mass-production of LCDs because of its simple process and high productivity. However, this method has some disadvantages. Rubbed PI surfaces include the debris left by the cloth and the generation of electrostatic charges during rubbing process. Therefore, rubbing-free techniques for LC alignment are strongly required in LCD technology. In this experiment, PI was uniformly coated on indium-tin-oxide electrode substrates to form LC alignment layers using a spin-coating method and the PI layers were subsequently imidized at 433 K for 1 h. The thickness of the PI layer was set at 50 nm. The LC alignment layer surfaces were exposed to an $Ar^+$ ion-beam under various ion-beam energies. The antiparallel cells and twisted-nematic (TN) cells for the measurement of pretile angle and electro-optical characteristics were fabricated with the cell gap of 60 and $5\;{\mu}m$, respectively. The LC cells were filled with nematic LC (NLC, MJ001929, Merck) and were assembled. The NLC alignment capability on ion-beam-treated PI was observed using photomicroscope and the pretilt angle of the NLC was measured by the crystal-rotation method at room temperature. Voltage-transmittance (V-T) and response time characteristics of the ion-beam irradiated TN cell were measured by a LCD evaluation system.

  • PDF

A New Approach to Reduce Geometric Error in FIB Fabrication of Micro Structures (집속이온빔을 이용한 미세구조물 가공의 형상정밀도 향상)

  • Kim K.S.;Jung J.W.;Min B.K.;Lee S.J.;Park C.W.;Lee J.H.
    • Proceedings of the Korean Society of Precision Engineering Conference
    • /
    • 2005.06a
    • /
    • pp.1186-1189
    • /
    • 2005
  • Focused Ion Beam machining is an attractive approach to produce nano-scale 3D structures. However, like other beam-based manufacturing processes, the redeposition of the sputtered material during the machining deteriorates the geometric accuracy of ion beam machining. In this research a new approach to reduce the geometric error in FIB machining is introduced. The observed redeposition phenomena have been compared with existing theoretical model. Although the redeposition effect has good repeatability the prediction of exact amount of geometric error in ion beam machining is difficult. Therefore, proposed method utilizes process control approach. Developed algorithm measures the redeposition amount after every production cycle and modifies next process plan. The method has been implemented to a real FIB machine and the experimental results demonstrated considerable improvement of five micrometer-sized pocket machining.

  • PDF

Synthesis of TiO2 nanoparticles induced by electron beam irradiation and their electrochemical performance as anode materials for Li-ion batteries

  • Ahn, Ja-Hwa;Eom, Ji-Yong;Kim, Jong-Huy;Kim, Hye Won;Lee, Byung Cheol;Kim, Sung-Soo
    • Journal of Electrochemical Science and Technology
    • /
    • v.6 no.3
    • /
    • pp.75-80
    • /
    • 2015
  • We introduce a new synthesis method to prepare small TiO2 nanoparticles with a narrow particle size distribution, which is achieved by electron beam (E-beam) irradiation. The effects of E-beam irradiation on the synthesis of TiO2 nanoparticles and the electrochemical performance of TiO2 nanoparticles as alternative anode materials for Li-ion batteries are investigated. The TiO2 nanoparticles induced by E-beam irradiation present better cycling performance and rate capability than the TiO2 nanoparticles synthesized by normal hydrolysis reaction. The better electrochemical performance is attributed to small particle size and narrow particle size distribution, resulting in the large surface area that provides innumerable reaction sites and short diffusion length for Li+ through TiO2 nanoparticles.

Analysis on FIB-Sputtering Process using Taguchi Method (다구찌 기법을 이용한 FIB-Sputtering 가공 특성 분석)

  • Lee, Seok-Woo;Choi, Byoung-Yeol;Kang, Eun-Goo;Hong, Won-Pyo;Choi, Hon-Zong
    • Transactions of the Korean Society of Machine Tool Engineers
    • /
    • v.15 no.6
    • /
    • pp.71-75
    • /
    • 2006
  • The application of focused ion beam (FIB) technology in micro/nano machining has become increasingly popular. Its usage in micro/nano machining has advantages over contemporary photolithography or other micro/nano machining technologies such as small feature resolution, the ability to process without masks and being accommodating for a variety of materials and geometries. The target of this paper is the analysis of FIB sputtering process according to tilt angle, dwell time and overlap for application of 3D micro and pattern fabrication and to find the effective beam scanning conditions using Taguchi method. Therefore we make the conclusions that tilt angle is dominant parameter for sputtering yield. Burr size is reduced as tilt angle is higher.

Study of the Structure Change on Ion-Beam-Mixed CoPt Alloys.

  • Son, J.H.;Lee, Y.S.;Lim, K.Y.;Kim, T.G.;Chang, G.S.;Woo, J.J.;Whang, C.N.
    • Proceedings of the Korean Vacuum Society Conference
    • /
    • 1998.02a
    • /
    • pp.135-136
    • /
    • 1998
  • By the ion bombardment the original discrete layered structure is damaged and a uniformly mixed layer is formed by the intermixing of the films. Immediately after this dynamic cascade mixing a structure of this mixed layer is likely to be a mixture of randomly distributed atoms. Subsequently the mixed layered structure becomes a non-equilibrium structure such as the metastable pphase because the kinetic energies of the incident ions rappidly dissippate and host atoms within the collision cascade region are quenched from a highly energetic state. The formation of the metastable transition metal alloys using ion-beam-mixing has been extensively studied for many years because of their sppecific ppropperties that differ from those of bulk materials. in ion-beam-mixing the alloy or comppound is formed due to the atomic interaction between different sppecies during ion bombardment. in this study the metastable pphase formed by ion-beam-mixing pprocess is comppared with equilibrium one by arc-melting method by GXRD and XAS. Therfore we studied the fundamental characteristics of charge redistribution uppon alloying and formation of intermetallic comppounds. The multi-layer films were depposited on a wet-oxidized Si(100) substrate by sequential electron beam evapporation at a ppressure of less than 5$\times$10-7 Torr during depposition. These compprise 4 ppairs of Co and ppt layers where thicknesses of each layer were varied in order to change the alloy compposition.

  • PDF

Inorganic Thin film for Horizontal Aligned Liquid Crystal with Non-rubbing Technologies (무기막에서의 수형배향된 액정의 특성에 대한 연구)

  • Choi, Daesub;Shin, Hochul
    • Journal of Satellite, Information and Communications
    • /
    • v.10 no.2
    • /
    • pp.75-79
    • /
    • 2015
  • In this study, we investigated the electro-optical (EO) characteristic of fringe-field switching (FFS) mode cell by the ion beam alignment method on the a-C:H thin film. The suitable inorganic thin films for FFS cell and the aligning capabilities of nematic liquid crystal (NLC) using the new alignment material of a-C:H thin film were studied. An excellent voltage-transmittance (V-T) and response time curve of the ion beam aligned FFS-LCD was observed with oblique ion beam exposure on the a-C:H thin films. Also, the V-T hysteresis characteristics of the ion beam-aligned FFS-LCD with IB exposure on the a-C:H thin films is almost the same as that of the rubbing-aligned FFS cell on a polyimide surface.

Influence of surface geometrical structures on the secondary electron emission coefficient $({\gamma})$ of MgO protective layer

  • Park, W.B.;Lim, J.Y.;Oh, J.S.;Jeong, H.S.;Jeong, J.C.;Kim, S.B.;Cho, I.R.;Cho, J.W.;Kang, S.O.;Choi, E.H.
    • 한국정보디스플레이학회:학술대회논문집
    • /
    • 2003.07a
    • /
    • pp.806-809
    • /
    • 2003
  • Ion-induced secondary electron emission coefficient $({\gamma})$. of the patterned MgO thin film with geometrical structures has been measured by ${\gamma}$ - FIB(focused ion beam) system. The patterned MgO thin film with geometrical structures has been formed by the mask (mesh of ${\sim}$ $10{\mu}m^{2})$ under electron beam evaporation method. It is found that the higher ${\gamma}$. has been achieved by the patterned MgO thin film than the normal ones without patterning.

  • PDF

Method of Ga removal from a specimen on a microelectromechanical system-based chip for in-situ transmission electron microscopy

  • Yena Kwon;Byeong-Seon An;Yeon-Ju Shin;Cheol-Woong Yang
    • Applied Microscopy
    • /
    • v.50
    • /
    • pp.22.1-22.6
    • /
    • 2020
  • In-situ transmission electron microscopy (TEM) holders that employ a chip-type specimen stage have been widely utilized in recent years. The specimen on the microelectromechanical system (MEMS)-based chip is commonly prepared by focused ion beam (FIB) milling and ex-situ lift-out (EXLO). However, the FIB-milled thin-foil specimens are inevitably contaminated with Ga+ ions. When these specimens are heated for real time observation, the Ga+ ions influence the reaction or aggregate in the protection layer. An effective method of removing the Ga residue by Ar+ ion milling within FIB system was explored in this study. However, the Ga residue remained in the thin-foil specimen that was extracted by EXLO from the trench after the conduct of Ar+ ion milling. To address this drawback, the thin-foil specimen was attached to an FIB lift-out grid, subjected to Ar+ ion milling, and subsequently transferred to an MEMS-based chip by EXLO. The removal of the Ga residue was confirmed by energy dispersive spectroscopy.

Characteristics of Co-deposition for Bi-superconductor Thin Film Using Ion Beam Sputtering Method (IBS 법으로 제작한 Bi 계 초전도 박막의 동시 증착 특성)

  • 박용필;이준웅
    • Electrical & Electronic Materials
    • /
    • v.10 no.5
    • /
    • pp.425-433
    • /
    • 1997
  • BSCCO thin films have been fabricated by co-deposition at an ultralow growth rate using ion beam sputtering(IBS) method. The growth rates of the films was set in the region from 0.17 to 0.27 nm/min. MgO(100) was used as a substrate. In order to appreciate stable existing region of Bi 2212 phase with temperature and ozone pressure, the substrate temperature was varied between 655 and 82$0^{\circ}C$ and the highly condensed ozone gas pressure(PO$_3$) in vacuum chamber was varied between 2.0$\times$10$^{-6}$ and 2.3$\times$10$^{-5}$ Torr. Bi 2212 phase appeared in the temperature range of 750 and 795$^{\circ}C$ and single phase of Bi 2201 existed in the lower region than 785$^{\circ}C$. Whereas, PO$_3$dependance on structural formation was scarcely observed regardless of the pressure variation. And high quality of c-axis oriented Bi 2212 thin film with T$_{c}$(onset) of about 90 K and T$_{c}$(zero) of about 45 K is obtained. Only a small amount of CuO in some films was observed as impurity, and no impurity phase such as CaCuO$_2$was observed in all of the obtained films.lms.

  • PDF