• Bulletin of the Korean Chemical Society
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• v.23 no.2
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• pp.225-228
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• 2002

Amorphous $Ga_2O_3$ films have been grown on Si(100) substrates by metal organic chemical vapor deposition (MOCVD) using gallium isopropoxide, $Ga(O^iPr)_3$, as single precursor. Deposition was carried out in the substrate temperature range 400-800 $^{\circ}C$. X-ray photoelectron spectroscopy (XPS) analysis revealed deposition of stoichiometric $Ga_2O_3$ thin films at 500-600 $^{\circ}C$. XPS depth profiling by $Ar^+$ ion sputtering indicated that carbon contamination exists mostly in the surface region with less than 3.5% content in the film. Microscopic images of the films by scanning electron microscopy (SEM) and atomic force microscopy (AFM) showed formation of grains of approximately 20-40 nm in size on the film surfaces. The root-mean-square surface roughness from an AFM image was ${\sim}10{\AA}$. The interfacial layer of the $Ga_2O_3$/Si was measured to be ${\sim}35{\AA}$ thick by cross-sectional transmission electron microscopy (TEM). From the analysis of gaseous products of the CVD reaction by gas chromatography-mass spectrometry (GC-MS), an effort was made to explain the CVD mechanism.

• Transactions of the Korean Society of Mechanical Engineers B
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• v.36 no.10
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• pp.1019-1023
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• 2012

In this research, a novel direct-aluminum-heating-induced crystallization method was developed for the purpose of application to solar cells. By applying a constant current of 3 A to an aluminum thin film, a 200-nm-thick amorphous silicon (a-Si) thin film with a size of $1cm{\times}1cm$ can be crystallized into a polycrystalline silicon (poly-Si) thin film within a few tens of seconds. The Raman spectrum analysis shows a peak of 520 $cm^{-1}$, which verifies the presence of poly-Si. After removing the aluminum layer, the poly-Si thin film was found to be porous. SIMS analysis showed that the porous poly-Si thin film was heavily p-doped with a doping concentration of $10^{21}cm^{-3}$. Thermal imaging shows that the crystallization from a-Si to poly-Si occurred at a temperature of around 820 K.

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2016.11a
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• pp.128-128
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• 2016

Cu 배선폭 미세화 기술은 반도체 디바이스의 성능 향상을 위한 핵심 기술이다. 현재 배선 기술은 lithography, deposition, planarization등 종합적인 공정 기술의 발전에 따라 10x nm scale까지 감소하였다. 하지만 지속적인 feature size 감소를 위하여 요구되는 높은 공정 기술 및 비용과 배선폭 미세화로 인한 재료의 물리적 한계로 인하여 배선폭 미세화를 통한 성능의 향상에는 한계가 있다. 배선폭 미세화를 통한 2차원적인 집적도 향상과는 별개로 chip들의 3차원 적층을 통하여 반도체 디바이스의 성능 향상이 가능하다. 칩들의 3차원 적층을 위해서는 별도의 3차원 배선 기술이 요구되는데, TSV(through-Si-via)방식은 Si기판을 관통하는 via를 통하여 chip간의 전기신호 교환이 최단거리에서 이루어지는 가장 진보된 형태의 3차원 배선 기술이다. Si 기판에 $50{\mu}m$이상 깊이의 via 및 seed layer를 형성 한 후 습식전해증착법을 이용하여 Cu 배선이 이루어지는데, via 내부 Cu ion 공급 한계로 인하여 일반적인 공정으로는 void와 같은 defect가 형성되어 배선 신뢰성에 문제를 발생시킨다. 이를 해결하기 위해 각종 유기 첨가제가 사용되는데, suppressor를 사용하여 Si 기판 상층부와 via 측면벽의 Cu 증착을 억제하고, accelerator를 사용하여 via 바닥면의 Cu 성장속도를 증가시켜 bottom-up TSV filling을 유도하는 방식이 일반적이다. 이론적으로, Bottom-up TSV filling은 sample 전체에서 Cu 성장을 억제하는 suppressor가 via bottom의 강한 potential로 인하여 국부적 탈착되고 via bottom에서만 Cu가 증착되어 되어 이루어지므로, accelerator가 없이도 void-free TSV filling이 가능하다. Accelerator가 Suppressor를 치환하여 오히려 bottom-up TSV filling을 방해한다는 보고도 있었다. 본 연구에서는 유기 첨가제의 치환으로 인한 TSV filling performance 저하를 방지하고, 유기 첨가제 조성을 단순화하여 용액 관리가 용이하도록 하기 위하여 suppressor만을 이용한 TSV filling 연구를 진행하였다. 먼저, suppressor의 흡착, 탈착 특성을 이해하기 위한 연구가 진행되었고, 이를 바탕으로 suppressor만을 이용한 bottom-up Cu TSV filling이 진행되었다. 최종적으로 $60{\mu}m$ 깊이의 TSV를 1000초 내에 void-free filling하였다.

• Journal of environmental and Sanitary engineering
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• v.15 no.1
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• pp.77-87
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• 2000

Several new ion exchange resins have been synthesized from chloromethyl styrene-l,4-divinylbenzine with 1%, 2%, 10% and 20%-crosslink and macrocyclic ligands of cryptand type by interpolymerization method. The adsorption characteristics and the pH, time, solvents and concentration dependence of the adsorption of metal ions by this resin were studied. The correlation between the separation characteristics of uranium and transition metal on the resins and the stability constants of complexes with macrocyclic ligands have been examined. The resins were very stable in both acidic and basic media and have good resistance to heat. The $UO_2^{2+}$ was not adsorbed on the resins below pH 3.0, but the power of adsorption of $UO_2^{2+}$ increased rapidly above pH 4.0. The optimum equilibrium time for adsorption of metallic ions was two hours and adsorptive power decreased in proportion to crosslink size of the resins and order of dielectric constants of solvents used and the selective sequence for metal cations was in the order of $UO_2^{2+}$, $Ni{2+}$ and $Nd{3+}$.

• The Korean Journal of Mycology
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• v.27 no.2 s.89
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• pp.100-106
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• 1999

The polysaccharides, intracellular and extracellular, extracted from the liquid culture of the Agrocybe cylindracea were purified and characterized. The mycellial cellular productivity of Agrocybe cylindracea was proved to be almost 2 folds in the shaking culture compared to the standing culture. These polysaccharides were purified by the DEAE-cellulose ion exchange chromatography and the Sepharose 2B size exclusive gel filteration. The two purified fractions of extracellular polysaccharides, ACEPDG and ACEPAG, contained 75.8% and 65.4% total sugar respectively. The total sugar content of ACIPDG and ACIPAG, the two purified fractions of intracellular polysaccharides, were 89.2% and 54.2% respectively. The molecular weights range of all the substances were estimated to be above 100,000, from 300KDa of ACEPDG to 600 KDa of ACIPAG. The results of sugar analysis by HPLC showed that the sugar part of ACEPDG was consisted of glucose and inositol. The ACIPDG, ACEPAG and ACIPAG contained three kinds of monosaccharides, glucose, fructose and inositol.

• Korean Journal of Materials Research
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• v.26 no.5
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• pp.258-265
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• 2016

Fluorine-doped tin oxide (FTO) nanoparticles have been successfully synthesized using ultrasonic spray pyrolysis. The morphologies, crystal structures, chemical bonding states, and electrochemical properties of the nanoparticles are investigated. The FTO nanoparticles show uniform morphology and size distribution in the range of 6-10 nm. The FTO nanoparticles exhibit excellent electrochemical performance with high discharge specific capacity and good cycling stability ($620mAhg^{-1}$ capacity retention up to 50 cycles), as well as excellent high-rate performance ($250mAhg^{-1}$ at $700mAg^{-1}$) compared to that of commercial $SnO_2$. The improved electrochemical performance can be explained by two main effects. First, the excellent cycling stability with high discharge capacity is attributed to the nano-sized FTO particles, which are related to the increased electrochemical active area between the electrode and electrolyte. Second, the superb high-rate performance and the excellent cycling stability are ascribed to the increased electrical conductivity, which results from the introduction of fluorine doping in $SnO_2$. This noble electrode structure can provide powerful potential anode materials for high-performance lithiumion batteries.

• Journal of Environmental Science International
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• v.22 no.1
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• pp.73-81
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• 2013

The present work has been devoted to the catalytic reduction of $N_2O$ by $H_2$ with $Pt/SiO_2$ catalysts at very low temperatures, such as $110^{\circ}C$, and their nanoparticle sizes have been determined by using $H_2-N_2O$ titration, X-ray diffraction(XRD) and high-resolution transmission electron microscopy(HRTEM) measurements. A sample of 1.72% $Pt/SiO_2$, which had been prepared by an ion exchange method, consisted of almost atomic levels of Pt nanoparticles with 1.16 nm that are very consistent with the HRTEM measurements, while a $Pt/SiO_2$ catalyst possessing the same Pt amount via an incipient wetness technique did 13.5 nm particles as determined by the XRD measurements. These two catalysts showed a noticeable difference in the on-stream $deN_2O$ activity maintenance profiles at $110^{\circ}C$. This discrepancy was associated with the nanoparticle sizes, i.e., the $Pt/SiO_2$ catalyst with the smaller particle size was much more active for the $N_2O$ reduction. When repeated measurements of the $N_2O$ reduction with the 1.16 nm Pt catalyst at $110^{\circ}C$ were allowed, the catalyst deactivation occurred, depending somewhat on regeneration excursions.

• Resources Recycling
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• v.20 no.5
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• pp.64-68
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• 2011

The typical properties of manganese nodules are its high porosity and high specific surface area and manganese in nodules is existed as ${\delta}$-MnO$_2$. These properties suggest that manganese nodules ran be used as an adsorbent for heavy metal ions. This study investigated the practical applicability for the removal of copper ions in the waste water by manganese nodules as an adsorbent using fixed column and fix bed systems. Manganese nodules of 1kg (size 1-3 cm) can absorb 4.0g Cu in fixed column system and 2.3g Cu in fixed bed system from waste water for 3 hours respectively.

• Journal of Chest Surgery
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• v.29 no.4
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• pp.440-443
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• 1996

Some tricuspid valve endocarditis can be controlled effectively with specific antibiotic treatment. However, surgical intervention Is necessary when there are continuing sepsis, moderate or severe heart failure, multiple pulmonary emboli, and echocardiographycally demonstrated vegitations. We are repoting a 19 year-old male patient who was admitted for the treatment of infective endocarditis. He previously had an operation for ventriculer septal defect (perimembranous type) about 9 years ago . An echocardiogram showed a large vegetation on the anterior cusp area and a left to right shunt through VSD, which was previously closed with dacron patch. A valve replacement in addition to antibiotic therapy was recommended for the patient. The patient underwent on operation : tricuspid valve replacement was done with 51. Jude medical valve prosthesis (33 mm), and in addition to above procedure, removal of vegetation and direct closure of VSD were done Postoperative echocardiogram showed that replaced tricuspid valve functioned well and vegeta ion and shunt flow were not observed. The patient recovered without complication and discharged at Postoperative day 25. Early aggressive surgical intervention is indicated to optimize surgical results, and this case seems to be a typical right sided bacterial endocarditis, which is caused by residual VSD. We are reporting a case of tricuspid valve endocarditis with a review of the literature. (Korean J Thorax Cardiovasc Surg 1996 ; 29: 440-3)

• Journal of the Korean Vacuum Society
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• v.20 no.5
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• pp.322-326
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• 2011

Etch process of silicon dioxide layer by using capacitively coupled plasma (CCP) is currently being used to manufacture semiconductor devices with nano-scale feature size below 50 nm. In typical CCP plasma etcher system, plasmas are generated by applying the RF power on upper electrode and ion bombardment energy is controlled by applying RF power to the bottom electrode with the Si wafer. In this case, however, etch results often drift due to heating of the electrode during etching process. Therefore, controlling the temperature of the upper electrode is required to obtain improvement of etch repeatability. In this work, we report repeatability improvement during the silicon dioxide etching under extreme process conditions with very high RF power and close gap between upper and bottom electrodes. Under this severe etch condition, it is difficult to obtain reproducible oxide etch results due to drifts in etch rate, critical dimension, profile, and selectivity caused by unexpected problems in the upper electrode. It was found that reproducible etch results of silicon dioxide layer could be obtained by controlling temperature of the upper electrode. Methods of controlling the upper electrode and the correlation with etch repeatability will be discussed in detail.