• 제목/요약/키워드: Internal Die Design

검색결과 60건 처리시간 0.023초

관재의 하이드로 포밍 기술개발 (Development of tube hydroforming technology)

  • 이택근
    • 한국소성가공학회:학술대회논문집
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    • 한국소성가공학회 1999년도 춘계학술대회논문집
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    • pp.30.2-34
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    • 1999
  • The hydroforming technology has gained in importance over the last few years, because of its potential for substantial weight avings costs reduction and quality improvement such as collision property, shape fixability and rigidity of white body. However, in comparison with the traditional sheet forming process, the hydroforming is much younger and the main development efforts were made in the last 15 years. The new technology, high pressure tublar hydroforming in particular, involves many process parameters to be optimized. This paper covers a brief overview of the hydroforming simulator as well as design of die and tools. The effects of typical parameters such as internal pressure and axial compression stroke are presented. Moreover, the conditions of forming failure occurrences such as fracture and wrinkle are examinated.

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How adjustment could affect internal and marginal adaptation of CAD/CAM crowns made with different materials

  • Hasanzade, Mahya;Moharrami, Mohammad;Alikhasi, Marzieh
    • The Journal of Advanced Prosthodontics
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    • 제12권6호
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    • pp.344-350
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    • 2020
  • PURPOSE. Recently introduced hybrid and reinforced glass ceramic computer-aided design/computer-aided manufacturing (CAD/CAM) materials have been used for full-coverage restorations. However; the effect of adjustment and type of materials on internal and marginal adaptation are unknown. This study aimed to evaluate and compare the marginal and internal adaptations of crowns made of three different CAD/CAM materials before and after adjustment. MATERIALS AND METHODS. One acrylic resin maxillary first molar was prepared and served as the master die. Thirty-six restorations were fabricated using CAD/CAM system (CEREC Omnicam, MCXL) with three materials including lithium disilicate (IPS e.max CAD), zirconia-reinforced lithium silicate (Suprinity), and hybrid ceramic (Enamic). Internal and marginal adaptations were evaluated with the reference point matching technique before and after adjustment. The data were analyzed using mixed ANOVA considering α=.05 as the significance level. RESULTS. The effect of adjustment and its interaction with the restoration material were significant for marginal, absolute marginal, and occlusal discrepancies (P<.05). Before adjustment, Suprinity had lower marginal discrepancies than IPS e.max CAD (P=.18) and Enamic (P=.021); though no significant differences existed after adjustment. CONCLUSION. Within the limitations of this study, crowns fabricated from IPS e.max CAD and Suprinity resulted in slightly better adaptation compared with Enamic crowns before adjustment. However, marginal, axial, and occlusal discrepancies were similar among all materials after the adjustment.

자유단조공법을 통한 중공형 메인샤프트 제조공정에 관한 연구 (Study on Manufacturing Process of Hollow Main Shaft by Open Die Forging)

  • 권용철;강종훈;김상식
    • 대한기계학회논문집A
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    • 제40권2호
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    • pp.221-227
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    • 2016
  • 풍력발전기에서 메인 샤프트는 로터허브와 증속기를 연결하는 중요 부품 중 하나이며 주로 자유단조공법을 통하여 제조된다. 하지만 고 MW급 이상의 메인샤프트는 중량을 감소시키기 위하여 중공형 설계가 이루어지며 주조공법을 이용하여 제조되고 있다. 본 연구의 목적은 중공형 메인샤프트를 단조공법을 이용하여 생산할 수 있는 제조공정을 개발하는 것이다. 자유단조 공법의 공정설계 방법에 따라 중실형과 중공형 메인샤프트를 제조하기 위한 단조공정을 각각 설계하였다. 설계된 공정의 성형가능성을 확인하기 위하여 온도, 변형률 속도에 따른 유동응력을 열간압축실험을 통하여 구한 후 유한요소해석을 수행하였다. 유한요소해석을 통하여 단조업계에서 통상 행해지는 중실형 단조공법의 온도 및 변형률 등의 관리인자와 제안된 중공형단조공법의 인자를 비교하여 성형가능성을 예측하였다. 시제품 제작을 통하여 중공형 형상을 원소재회수율, 내부품질, 형상 및 치수 등에서 높은 생산성으로 제조가 가능함을 확인하였다.

Full CMOS Single Supply PLC SoC ASIC with Integrated Analog Front-End

  • Nam, Chul;Pu, Young-Gun;Kim, Sang-Woo;Lee, Kang-Yoon
    • JSTS:Journal of Semiconductor Technology and Science
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    • 제9권2호
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    • pp.85-90
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    • 2009
  • This paper presents a single supply PLC SoC ASIC with a built-in analog Front-end circuit. To achieve the low power consumption along with low cost, this PLC SoC employs fully CMOS Analog Front End (AFE) and several LDO regulators (LDOs) to provide the internal power for Logic Core, DAC and Input/output Pad driver. The receiver part of the AFE consists of Pre-amplifier, Gain Amplifier and 1 bit Comparator. The transmitter part of the AFE consists of 10 bit Digital Analog Converter and Line Driver. This SoC is implemented with 0.18 ${\mu}m$ 1 Poly 5 Metal CMOS Process. The single supply voltage is 3.3 V and the internal powers are provided using LDOs. The total power consumption is below 30 mA at stand-by mode to meet the Eco-Design requirement. The die size is 3.2 $\times$ 2.8 $mm^{2}$.

유한요소법에 의한 자동차 로어암의 하이드로포밍 성형 해석 및 제작 (Manufacture and Analysis of Hydroforming Process for an Automobile Lower Arm by FEM)

  • 김정;강성종;강범수
    • 대한기계학회:학술대회논문집
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    • 대한기계학회 2001년도 춘계학술대회논문집C
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    • pp.592-597
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    • 2001
  • An automobile lower arm has been fabricated in a prototype form by hydroforming with the aids of numerical analysis and experiments. For the numerical process design, a program called HydroFORM-3D developed here on the basis of a rigid-plastic model, has been applied to the lower arm hydroforming. The friction calculation between die and workpiece has been dealt carefully by introducing a new scheme in three-dimensional surface integration. To accomplish successful hydroforming process design, thorough investigation on proper combination of process parameters such as internal hydraulic pressure, axial feeding, and tool geometry has been performed. Results obtained from numerical simulation for a lower arm in hydroforming process are compared with a series of experiments. The comparison shows that the numerical analysis successfully provides the manufacturing information on the lower arm hydroforming, and it predicts the geometrical deformation and the thinning.

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내구성을 고려한 후륜현가 장치의 하이드로포밍 공정 설계 (Durability Based Design for Hydroforming process of Rear Suspension)

  • 김헌영;오인석;고정민;이동재;조우강
    • 한국소성가공학회:학술대회논문집
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    • 한국소성가공학회 2006년도 춘계학술대회 논문집
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    • pp.269-272
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    • 2006
  • The hydroforming processing is a relatively new technology in comparison with conventional stamping process. The hydroforming processing makes torsion beam in rear suspension of automobile. The durability of torsion beam is very important characteristic that operate in an automobile. In order to optimize the hydroforming process and satisfy the durability, the hydroforming simulation which could control an axial compression and high internal pressure with computer simulation has to be operated. This paper is about an optimum design to improve the kinematic and compliance characteristics of a torsion-beam of suspension system. The result from finite element analysis shows that the forming and the durability are optimized. If there is effect of First pressure in hydroforming processing that gap is in the die tool, the prototype of tube is not satisfied on the durability test.

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SLM 방식으로 제작한 도재관 금속하부구조물의 변연 및 내면 적합도 평가 (Evaluation of marginal and internal fit of metal copings fabricated by selective laser melting)

  • 배성령;이하빈;노미준;김지환
    • 대한치과기공학회지
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    • 제45권1호
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    • pp.1-7
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    • 2023
  • Purpose: To evaluate the marginal and internal fit of metal coping fabricated by a metal three-dimensional (3D) printer that uses selective laser melting (SLM). Methods: An extraoral scanner was used to scan a die of the prepared maxillary right first molar, and the coping was designed using computer-aided design software and saved as an stereo lithography (STL) file. Ten specimens were printed with an SLM-type metal 3D printer (SLM group), and 10 more specimens were fabricated by casting the castable patterns output generated by a digital light processing-type resin 3D printer (casting the 3D printed resin patterns [CRP] group). The fit was measured using the silicon replica technique, and 8 points (A to H) were set per specimen to measure the marginal (points A, H) and internal (points B~G) gaps. The differences among the groups were compared using the Mann-Whitney U-test (α=0.05). Results: The mean of marginal fit in the SLM group was 69.67±18.04 ㎛, while in the CRP group was 117.10±41.95 ㎛. The internal fit of the SLM group was 95.18±41.20 ㎛, and that of the CRP group was 86.35±32 ㎛. As a result of statistical analysis, there was a significant difference in marginal fit between the SLM and CRP groups (p<0.05); however, there was no significant difference in internal fit between the SLM group and the CRP group (p>0.05). Conclusion: The marginal and internal fit of SLM is within the clinically acceptable range, and it seems to be applicable in terms of fit.

유한요소법을 이용한 자동차 Subframe의 하이드로포밍 공정 해석 (Analysis of Hydroforming Process for Automobile Subframe by FEM)

  • 장유철;뇌여평;강범수
    • 한국소성가공학회:학술대회논문집
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    • 한국소성가공학회 2000년도 추계학술대회 논문집
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    • pp.149-152
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    • 2000
  • By using a three-dimensional finite element program HydroFORM-3D based on a rigid-plastic model, the hydroforming process for automobile subfrmae is analyzed in this study. The goal of this study is to accomplish preform design and determine the level of internal pressure for producing final hydroformed subframe component. Prior to hydroforming, the initial tube blank must be bent to the approximate centerline of the final part to enable the tube to be placed in the die cavity, After then, a preforming operation like stamping is carried out to the prebent tube. Finally, hydroforming process is performed to the preformed tube to get the final production. And through ductile fracture theory, the failure, bursting, is predicted during hydroforming process for tube blank with different diameter.

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CMOS IC-카드 인터페이스 칩셋 (A CMOS IC-Card Interface Chipset)

  • 오원석;이성철;이승은;최종찬
    • 대한전자공학회:학술대회논문집
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    • 대한전자공학회 2003년도 하계종합학술대회 논문집 II
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    • pp.1141-1144
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    • 2003
  • For proper communication with various types of IC-Card, multiple IC-Card interface complying with the IC-Card standard (ISO7816) is embedded and realized as a peripheral on the 32-bit RISC based system-on-a-chip. It provides the generation of either 3.3V or 5V power supply for the operation of the inserted IC-Card as well. IC-Card interface is divided into an analog front-end (AFE) and a digital back-end (DBE). The embedded DC-DC converters suitable for driving IC-Cards are incorporated in the AFE. The chip design for multiple IC-Card interface is implemented on a standard 0.35${\mu}{\textrm}{m}$ triple-metal double-poly CMOS process and is packaged in a 352-pin plastic ball grid array (PBGA). The total gate count is about 400,000, excluding the internal memory. Die area is 7890${\mu}{\textrm}{m}$ $\times$ 7890${\mu}{\textrm}{m}$.

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ROM 방식의 곱셈기를 이용한 8*8 2차원 DCT의 구현 (The implementation of an 8*8 2-D DCT using ROM-based multipliers)

  • 이철동;정순기
    • 전자공학회논문지A
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    • 제33A권11호
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    • pp.152-161
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    • 1996
  • This paper descrisbes the implementation of a 20D DCT that can be used for video conference, JPEG, and MPEG-related applications. The implemented DCT consists of two 1-D DCTs and a transposed memory between them, and uses ROM-based multipliers instead of conventional ones. As the system bit length, the minimum bit length that satisfies the accuracy specified by the ITU standard H.261 was chosen through the simulations using the C language. The proposed design uses a dual port RAM for the transposed memory, and processes two bits of input-pixel data simultaneously t ospeed up addition process using two sets of ROMs. The basic system architecture was designed using th Synopsys schematic editor, and internal modules were described in VHDL and synthesized to logic level after simulation. Then, the compass silicon compiler was used to create the final lyout with 0.8um CMOS libraries, using the standard cell approach. The final layout contains about 110, 000 transistors and has a die area of 4.68mm * 4.96mm, and the system has the processing speed of about 50M pixels/sec.

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