• Current Photovoltaic Research
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• v.5 no.3
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• pp.83-88
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• 2017

The growth of intermetallic compounds is an important factor in the reliability of solar cells. Especially, the temperature change in the soldering process greatly affects the thickness of the intermetallic compound layer. In this study, we investigated the intermetallic compound growth by Sn-diffusion in solder joints of solar cells. The thickness of the intermetallic compound layer was analyzed by IR lamp power and hot plate temperature control, and the correlation between the intermetallic compound layer and the adhesive strength was confirmed by a $90^{\circ}$ peel test. In order to investigate the growth of the intermetallic compound layer during isothermal aging, the growth of the intermetallic compound layer was analyzed at $85^{\circ}C$ and 85% for 500 h. In addition, the activation energy of Sn was calculated. The diffusion coefficient of the intermetallic compound layer was simulated and compared with experimental results to predict the long-term reliability.

• Proceedings of the Korean Society For Composite Materials Conference
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• 2004.04a
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• pp.237-240
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• 2004

High strain-rate deformation behavior of NiAl/Ni micro-laminated composites was characterized by split hopkins on pressure bar(SHPB). When the strain rate increased, the compressive stress of micro-laminated composites were increased a little. When the intermetallic volume fraction increased, the compressive stress of micro-laminated composites increased linearly irrespective of strain rate. Absorbed energy during the quasi-static and SHPB tests was calculated from the integrated area of stress-strain curve. Absorbed energy of micro-laminated composites deviated from the linearity in terms of the intermetallic volume fraction but merged to the value of intermetallic as the strain rate increased. This was due to high tendency of intermetallic layer for the localization of shear deformation at high strain rate. Microstructure showing adibatic shear band(ASB) confirmed that the shear strain calculated from the misalignment angle of each layer increased and ASB width decreased when the intermetallic volume fraction. Simulation test impacted by tungsten heavy alloy cylinder resulted that the absorbed energies multiplied by damaged volume of micro-laminated composites were decreased as the intermetallic volume fraction increased. Fracture mode were changed from delamination to single fracture when the intermetallic volume fraction and this results were good matched with previous results[l] obtained from the fracture tests.

• Journal of Welding and Joining
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• v.20 no.1
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• pp.97-102
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• 2002

The growth kinetics of intermetallic compound layers formed between the eutectic Sn-3.5Ag solder and the Cu and Ni/Cu pad by solid stateisothermal aging were examined. The interfacial reaction between the eutectic Sn-3.5Ag solder and the Cu and Ni/Cu pad was investigated at 70, 120, 150, $170^{\circ}C$ for various times. The intermetallic compound layer was composed of two phase: $Cu_6Sn_5$(${\varepsilon}-phase$) adjacent to the solder and $Cu_6Sn_5$(${\varepsilon}-phase$) adjacent to the copper and on solder/Ni pad the intermetallic compound layer was $Ni_3Sn_4$. Because the values of time exponent(n) have approximately 0.5, the layer growth of the intermetallic compound was mainly controlled by volume diffusion over the temperature range studied. The apparent activation energy for layer growth of total Cu-Sn($Cu_6Sn_5 + Cu_6Sn$), $Cu_6Sn_5$, $Cu_3Sn$ and $Ni_3Sn_4$ intermetallic compound were 64.82kJ/mol, 48.53kJ/mol, 89.06kJ/mol and 71.08kJ/mol, respectively.

• Journal of the Microelectronics and Packaging Society
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• v.7 no.2
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• pp.13-19
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• 2000

Shear strengths of BGA solder joints on Cu pads were studied for Cu-containing Sn (0, 1.5, and 2.5 wt.% Cu) and Sn-40Pb (0 and 0.5wt.% Cu) solders, with emphasis on the roles of the Cu-Sn intermetallic layer thickness and the roughness of the interface between the intermetalic layer and solder. The shear strength test was performed for as-soldered solder joints with various soldering reaction times up to 4 min. The addition of Cu to the pure Sn solder results in an enhanced growth of the intermetallic layer whereas the effect of Cu addition to the Sn-40Pb solder is primarily on the reduction of the roughness of the intermetallic/solder interface. The critical thickness of the intermetallic layer for a maximum shear strength depends on the solder materials, which was measured to be ~ 2.3 $\mu\textrm{m}$ for Sn-Cu solders and ~ 1.2 $\mu\textrm{m}$ for Sn-Pb-Cu solders. The shear strength at the critical intermetallic layer thickness seems to increase as the intermetallic/solder interface becomes rougher. This is in accordance with the observation that the sheared fracture occurred initially within the solder tends to shift towards the intermetallic/solder interface as the intermetallic layer grows above the critical thickness.

• Journal of the Korean institute of surface engineering
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• v.37 no.2
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• pp.128-136
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• 2004

Effects of alloying elements on the surface characteristics of Fe-38Al intermetallic compounds were investigated using potentiostat. The specimens were casted by the vacuum arc melting. The subsequent homogenization and the stabilization led to the homogeneous DO$_3$ structure of the specimen. After the corrosion tests, the surface of the tested specimen was observed by the optical microscopy and scanning electron microscopy(SEM). For Fe-38 at.% Al intermetallic compound, the addition of Cr and Mo proved to be beneficial in decreasing the grain boundary attack by decreasing the active current density. Addition of Band Nb resulted in a higher active current density and also a higher passive current density. These results indicated the role of Cr and Mo in improving the pitting corrosion resistance of Fe-38 at.%Al intermetallic compound. Band Nb addition to Fe-38 at.%Al accelerated the granular corrosion. Fe-38 at.%Al containing Cr and Mo showed remarkably improved pitting corrosion resistance in comparison with Band Nb addition to Fe-38 at. %Al.

• Proceedings of the KWS Conference
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• 2002.10a
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• pp.555-560
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• 2002

Brazing of Al to Cu using AI-Si-Mg-Bi brazing alloy has been carried out in the vacuum furnace. In the bonded interlayer, there were two kinds of intermetallic compounds. One of these intermetallic compounds was e phase and the other was b phase. The growth of b phase was controlled by diffusion Al into Cu. Deformation behavior of Al-Cu brazing joint was brittle without deformation of the base metal. Shear strength of the joint was only about 20MPa. The shear specimen broken in the intermetallic compound, which was mainly e phase. Shear strength did not depend on the bonding temperature.

• Journal of Korea Foundry Society
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• v.13 no.3
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• pp.276-284
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• 1993

The interfacial phenomena between intermetallic compounds and Al matrix have been studied at $680^{\circ}C$ for various holding time under argon atmosphere. Model experiments were performed using Fe, Ni and Ti wire to observe the interfacial phenomena. The interfacial phenomena between intermetallic compounds and Al matrix were analysed by optical microscope, SEM and EDX. The results of EDX and XRD showed that the interfacial zones of intermetallic compounds/Al matrix were composed of several intermetallic layers. The reaction layer was varied with holding time and heating temperature. The investigation of interfacial zones in the specimen as a function of heat treatment time at $680^{\circ}C$ indicated that the best heat treatment condition for squeeze casting was $680^{\circ}C$ for 5min.

• Proceedings of the KWS Conference
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• 2007.11a
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• pp.245-247
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• 2007

Sn-base solder bump is mainly used in micro-joining for flip chip package. The quantity of intermetallic compounds that was formed between Cu pad and solder interface importantly affects reliability. In this research, micro-bump was fabricated by two binary electroplating and the intermetallic compounds(IMCs) was estimated quantitatively. When the micro Sn-Ag solder bump was made by electroplating, SiC powder was added in the plating solution for protecting of intermetallic growth. Then, the intermetallic compounds growth was decrease with increase of amount of SiC power. However, if the mount of SiC particle exceeds 4 g/L, the effect of the growth restraint decrease rapidly.

• Journal of Korea Foundry Society
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• v.22 no.1
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• pp.35-41
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• 2002

To improve the reliability of solder joints, a composite solder which consists of solder matrix and intermetallic reinforcements was manufactured by a new method. The cast ingot of Sn-6.9Cu-2.9Ag alloy had primary Cu6Sn5 intermetallics in the form of dendrites. After rolling the ingot, the intermetallic dendrites were crushed into fine particles and distributed uniformly throughout the solder matrix. As the rolled strips became thinner, the average size of the crushed particles reached a critical size which did not decrease any more by further rolling. The critical size was nearly the same as the average width of intermetallic dendrite trunk. The crushed intermetallic particles did not melt and remained in solid state during reflow soldering due to their high meltingterm-perature. The coarsening and gravitational segregation of the particles were observed during reflow soldering.

• Journal of the Korean institute of surface engineering
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• v.35 no.1
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• pp.47-52
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• 2002

Intermetallic compound on the soldered interface plays important role on the bondability and mechanical properties of soldered joint. The formation of intermetallic compounds are influenced by many factors such as temperature, holding time, base metals and so on. On this study the effect of number of reflow times on the intermetallic growth was investigated. For the experimental materials, Sn-3.5Ag-0.7Cu solder ball of 0.3mm diameter and RMA-type flux were used. Thickness of intermetallic compound of solder ball by 2nd reflow showed nearly 60% higher than that of 1st reflow, and shear strength showed 10% higher value. Thickness and shear strength according to the position of interface such as upper side or lower side between two substrates were also investigated.