• Journal of Welding and Joining
• /
• v.30 no.6
• /
• pp.106-112
• /
• 2012

This study was carried out to investigate the effect of bonding temperature and holding time on microstructure and mechanical properties in brazing joints of Ni-base superalloy using MBF-30 (Ni-4.5Si-3.2B [wt.%]). The heating rate was $20^{\circ}C$/min to the bonding temperatures $1050^{\circ}C$, $1070^{\circ}C$, $1090^{\circ}C$ under high vacuum condition. The holding times were 100s, 400s, 900s and 1600s. $Ni_3B$ phases and proeutectic Ni were observed in the interlayer of Ni-201. Then, Ni3B and Ni3Si were found in the middle region of brazing joint. Cr-boride phase appeared in the interlayer of Inconel-625. Tensile strength and elongation were decreased at $1050^{\circ}C$-1600s, $1070^{\circ}C$-900s and $1090^{\circ}C$-400s. After observation the fracture specimens, There was Ni3B which is very brittle phase in the grain boundary of Ni201.

• The Journal of Engineering Geology
• /
• v.20 no.3
• /
• pp.271-279
• /
• 2010

Time-dependent behavior similar to secondary deformation related to mineral dissolution is easily observed when performing a laboratory pressure experiment. In this research, to observe the dissolution of quartz found in bentonite used as buffer material for the geological disposal of high-level waste (HLW) under conditions of high pH, we calculated the diffusion of $OH^-$ ions and the behavior of quartz dissolution using the homogenization analysis method. The results reveal that the rate of quartz dissolution is proportional to the temperature and interlayer water thickness. In particular, in a high-pH environment, the reacted area (and therefore the dissolution rate) increases with decreasing interlayer water thickness.

• Transactions on Electrical and Electronic Materials
• /
• v.10 no.5
• /
• pp.165-168
• /
• 2009

Transparent and conducting ITO/Cu/ITO multilayered films were deposited by magnetron sputtering on unheated polycarbonate (PC) substrates. The thickness of the Cu intermediate film was varied from 5 to 20 nm. Changes in the microstructure and optoelectrical properties of ITO/Cu/ITO films were investigated with respect to the thickness of the Cu intermediated layer. The optoelectrical properties of the films were significantly influenced by the thickness of the Cu interlayer. The sandwich structure of ITO 50 nm/Cu 5 nm/ITO 45 nm films had a sheet resistance of $36{\Omega}$/Sq. and an optical transmittance of 67% (contain substrate) at a wavelength of 550 nm, while the ITO 50 nm/Cu 20 nm/ITO 30 nm films had a sheet resistance of $70{\Omega}$/Sq. and an optical transmittance of 36%. The electrical and optical properties of ITO/Cu/ITO films were determined mainly by the Cu film properties. From the figure of merit, it is concluded that the ITO/Cu/ITO films with a 5 nm Cu interlayer showed the better performance in transparent conducting electrode applications than the conventional ITO films.

• Proceedings of the Korean Society of Precision Engineering Conference
• /
• 2003.06a
• /
• pp.86-89
• /
• 2003

Chemical Mechanical Planarization(CMP) has been accepted as the most effective processes for ultra large scale integrated (ULSI) chip manufacturing. However, as the polishing process continues, pad pores get to be glazed by polishing residues, which hinder the supply of new slurry. And pad surface is ununiformly deformed as real contact distance. These defects make material removal rate(MRR) decrease with a number of polishied wafer. Also the desired within-chip planarity, within wafer non-uniformity(WIWNU) and wafer to wafer non-uniformity(WTWNU) arc unable to be achieved. So, pad conditioning in CMP Process is essential to overcome these defects. The eletroplated or brazed diamond conditioner is used as the conventional conditioning. And. allumina long fiber, the jet power of high pressure deionized water, vacuum compression. ultrasonic conditioner aided by cavitation effect and ceramic plate conditioner are once used or under investigation. But. these methods arc not sufficient for ununiformly deformed pad surface and the limits of conditioning effect. So this paper focuses on the characteristics of diamond conditioner which reopens glazed pores and removes ununiformly deformed pad away.

• Steel and Composite Structures
• /
• v.44 no.4
• /
• pp.473-488
• /
• 2022

A high-speed railway (HSR) bridge may undergo long-term deformation due to the degradation of material stiffness, or foundation settlement during its service cycle. In this study, an analytical model is set up to evaluate the influence of this long-term vertical bridge deformation on the track geometry. By analyzing the structural characteristics of the HSR track-bridge system, the energy variational principle is applied to build the energy functionals for major components of the track-bridge system. By further taking into account the interlayer's force balancing requirements, the mapping relationship between the deformation of the track and the one of the bridge is established. In order to consider the different behaviors of the interlayers in compression and tension, an iterative method is introduced to update the mapping relationship. As for the validation of the proposed mapping model, a finite element model is created to compare the numerical results with the analytical results, which show a good agreement. Thereafter, the effects of the interlayer's different properties of tension and compression on the mapping deformations are further evaluated and discussed.

• Korean Journal of Materials Research
• /
• v.34 no.3
• /
• pp.125-137
• /
• 2024

Composite laminates are used in a wide range of applications including defense, automotive, aviation and aerospace, marine, wind energy, and recreational sporting goods. These composite beams still exhibit problems such as buckling, local deformations, and interlaminar delamination. To overcome these drawbacks, a novel viscoelastic autoclave bonding with tapered epoxy reinforcement polyurethane films is proposed. In existing laminates, compression face wrinkling and interlaminar delamination is caused in the sandwich beam. The unique viscoelastic autoclave spunbond interlayer bonding is designed to prevent face wrinkling and absorb and distribute stresses induced by external loads, thereby eliminating interlaminar delamination in the sandwich beam. Also, the existing special reinforcement causes stress concentrations, and the core is not effectively connected, which directly affects the stiffness of the beam. To address this, a novel tapered epoxy polyurethane reinforcement adhesive film is proposed, whose reinforcement thickness gradually tapers as it enters the core material. This minimizes stress concentrations at the interface, preventing excessive adhesive squeeze-out during the bonding process, and improves the stiffness of the beam. Results indicate the proposed model avoids the formation of micro cracks, interlaminar delamination, buckling, and local deformations, and effectively improves the stiffness of the beam.

• Journal of the Korean Society for Precision Engineering
• /
• v.19 no.5
• /
• pp.149-158
• /
• 2002

Recently, the minimum line width shows a tendency to decrease and the multi-level increases in semiconductor. Therefore, a planarization technique is needed and chemical mechanical polishing(CMP) is considered as one of the most suitable process. CMP accomplishes a high polishing performance and a global planarization of high quality. However there are several defects in CMF, such as micro-scratches, abrasive contaminations and non-uniformity of polished wafer edges. Wet etching process including spin-etching can eliminate the defects of CMP. It uses abrasive-free chemical solution instead of slurry. On this study, ILD(Interlayer-Dielectric) was removed by CMP and wet etching process using DHF(Diluted HF) in order to investigate the possibility of planrization by wet etching mechanism. In the thin film wafer, the results were evaluated from the viewpoint of material removal rate(MRR) and within wafer non-uniformity(WIWNU). And the pattern step heights were also compared for the purpose of planarity characterization of the patterned wafer. Moreover, Chemical polishing process which is the wet etching process with mechanical energy was introduced and evaluated for examining the characteristics of planarization.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
• /
• 1998.11a
• /
• pp.29-32
• /
• 1998

A new treatment of LiV$_3$O$_{8}$ has beer proposed for improving its electrochemical behavior as a cathode material secondary lithium batteries. Early in its development, the preparation method of LiV$_3$O$_{8}$ strongly influenced its electrochemical properties, such as discharge capacity, rate capability and cycling efficiency. In the present experiment, a new synthesis route has been applied to obtain LiV$_3$O$_{8}$ . Instead of the conventional high temperature technique leading to the crystalline form, a solution technique producing the amorphous form has been used. This material, after dehydration, shows an electrochemical performance exceeding that of the crystalline one. These measurements showed that the ultrasonic treatment process of crystalline LiV$_3$O$_{8}$ causes a decrease in crystallinity and considerable increases in specific surface area and interlayer spacing. So the ultrasonic method provides a convenient means for improving the electrochemical behavior of LiV$_3$O$_{8}$ as a cathode material for secondary lithium batteries.batteries.

• Elastomers and Composites
• /
• v.57 no.4
• /
• pp.197-204
• /
• 2022

Recently, the demand has increased for protective clothing materials capable of shielding the wearer from bullets, fragment bullets, knives, and swords. It is therefore necessary to develop light and soft protective clothing materials with excellent wearability and mobility. To this end, research is being conducted on hybrid design methods for various highly functional materials, such as carbon nanotube (CNT) sheets, which are well known for their low weight and excellent strength. In this study, a hybrid protective material using CNT sheets was developed and its performance was evaluated. The material design incorporated a bonding method that used a binder for interlayer combination between the CNT sheets. Four types of binders were selected according to their characteristics and impregnated within CNT sheets, followed by further combination with aramid fabric to produce the hybrid protective material. After applying the binder, the tensile strength increased significantly, especially with the phenoxy binder, which has rigid characteristics. However, as the molecular weight of the phenoxy binder increased, the adhesive force and strength decreased. On the other hand, when a 25% lightweight-design and high-molecular-weight phenoxy binder were applied, the backface signature (BFS) decreased by 6.2 mm. When the CNT sheet was placed in the middle of the aramid fabric, the BFS was the lowest. In a stab resistance test, the penetration depth was the largest when the CNT sheet was in the middle layer. As the binder was applied, the stab resistance improvement against the P1 blade was most effective.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
• /
• 2001.07a
• /
• pp.447-450
• /
• 2001

Abstract-Si direct bonding(SDB) technology is very attractive for both Si-on-insulator(SOI) electric devices and MEMS applications because of its stress free structure and stability. This paper presents on pre-bonding according to HF pre-treatment conditions in Si wafer direct bonding. The characteristics of bonded sample were measured under different bonding conditions of HF concentration, and applied pressure. The bonding strength was evaluated by tensile strength method. The bonded interface and the void were analyzed by using SEM and IR camera, respectively. Components existed in the interlayer were analysed by using FT-lR. The bond strength depends on the HF pre-treatment condition before pre-bonding (Min : 2.4kgf/cm$^2$∼Max : 14.9kgf/cm$^2$).