• Macromolecular Research
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• v.14 no.1
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• pp.38-44
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• 2006

Vacuum deposited copper phthalocyanine (CuPc) was placed as a thin interlayer between indium tin oxide (ITO) electrode and a hole transporting layer (HTL) in a multi-layered, organic, light-emitting diode (OLEOs). The well-stacked CuPc layer increased the stability and efficiency of the devices. Thermal annealing after CuPc deposition and magnetic field treatment during CuPc deposition were performed to obtain a stacked-CuPc layer; the former increased the stacking density of the CuPc molecules and the alignment of the CuPc film. Thermal annealing at about 100$^{circ}C$ increased the current flow through the CuPc layer by over 25$\%$. Surface roughness decreased from 4.12 to 3.65 nm and spikes were lowered at the film surface as well. However, magnetic field treatment during deposition was less effective than thermal treatment. Eventually, a higher luminescence at a given voltage was obtained when a thermally-annealed CuPc layer was placed in the present, multi-layered, ITO/CuPc/NPD/Alq3/LiF/AI devices. Thermal annealing at about 100$^{circ}C$ for 3 h produced the most efficient, multi-layered EL devices in the present study.

• Proceedings of the Korea Crystallographic Association Conference
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• 2002.11a
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• pp.48-48
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• 2002

It is generally accepted that ultra low dielectric interlayer dielectric materials (k < 2.2) will be necessary for ULSI advanced microelectronic devices after 2003, according to the International Technology Roadmap for Semiconductors (ITRS) 2000. A continuous reduction of dielectric constant is believed to be possible only by incorporating nanopores filled with air (k = 1.0) into electrically insulating matrices such as poly(methyl silsesquioxane) (PMSSQ). The nanopo.ous low dielectric films should have excellent material properties to survive severe mechanical stress conditions imposed during the advanced semiconductor processes such as chemical mechanical planarization process and multilayer fabrication. When air is incorporated into the films for lowering k, their mechanical strength has inevitably to be sacrificed. To minimize this effect, the nanopores are controlled to exist in the film as closed cells. The micromechanical properties of the nanoporous thin films are considered more seriously than ever, particularly for ultra low dielectric applications. In this study, three approaches were made to design and develop nanoporous low dielectric films with improved micromechanical properties: 1) wall density increase of nanoporous organosilicate film by copolymerization of carbon bridged comonomers; 2) incorporation of sacrificial phases with good miscibility; 3) selective surface modification by plasma treatment. Nanoporous low-k films were prepared with copolymerized PMSSQ and star-shaped sacrificial organic molecules, both of which were synthesized to control molecular weight and functionality. The nanoporous structures of the films were observed using field emission scanning electron microscopy, cross-sectional transmission electron microscopy, atomic force microscopy, and positronium annihilation lifetime spectroscopy(PALS). Micromechanical characterization was performed using a nanoindentor to measure hardness and modulus of the films.

• Proceeding of EDISON Challenge
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• 2016.03a
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• pp.288-291
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• 2016

Recently, there has been a lot of researches related to two-dimensional (2D) materials due to their new properties and applications emerging upon 2D confinement. A new type of graphene like two-dimensional layer material, nitrogenated holey two-dimensional structure C2N-h2D, that is possession of evenly distributed holes and nitrogen atoms with proper bandgap has been synthesized. Previous calculation studies already have shown that the variance of the orbital interaction, band structure of few-layer C2N-h2D suggests that interlayer coupling does play an important role in its electronic properties. In this point, using first-principles density functional theory calculation, we here explore the effect of porous embedded iron atom and iron substrate on encapsulated few layer C2N-h2D. We show the atomic structures and the corresponding electronic structures of Fe@C2N to elucidate the effect of iron. Finally, this study demonstrates that embedded iron C2N has AA-stacking as most favorable stacked structure in contrast to pure C2N. In addition, iron substrate modifies its encapsulated C2N from semi-metallic states to metallic state.

• Applied Chemistry for Engineering
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• v.9 no.5
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• pp.781-785
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• 1998

Material and electrochemical characteristics of petroleum coke of the nongraphitic carbon prepated with attrition milling for 6~48 hours and heat-treatment at $700^{\circ}C$ for 1 hour was investigated. The milling condition affects the particle size distribution, BET specific surface area and interlayer distance of petroleum cokes. Carbon electrode with petroleum cokes prepared at the milling time of 12~24 hours and having average particle size of $6{\sim}8{\mu}m$ showed best electrochemical characteristics form the investigation of cyclic voltammogram and charge-discharge characteristics.

• Journal of Powder Materials
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• v.28 no.5
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• pp.417-422
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• 2021

In the present work, Inconel 718 alloy is additively manufactured on the Ti-6Al-4V alloy, and a functionally graded material is built between Inconel 718 and Ti-6Al-4V alloys. The vanadium interlayer is applied to prevent the formation of detrimental intermetallic compounds between Ti-6Al-4V and Inconel 718 by direct joining. The additive manufacturing of Inconel 718 alloy is performed by changing the laser power and scan speed. The microstructures of the joint interface are characterized by scanning electron microscopy, energy-dispersive X-ray spectroscopy, and micro X-ray diffraction. Additive manufacturing is successfully performed by changing the energy input. The micro Vickers hardness of the additive manufactured Inconel 718 dramatically increased owing to the presence of the Cr-oxide phase, which is formed by the difference in energy input.

• Journal of the Semiconductor & Display Technology
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• v.23 no.2
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• pp.87-91
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• 2024

SiO₂, renowned for its excellent insulating properties, has been used in the semiconductor industry as a valuable dielectric material. High-quality SiO₂ films find applications in gate spacers and interlayer insulation gap-fill oxides, among other uses. One of the prevalent methods for depositing these SiO₂ films is plasma enhanced chemical vapor deposition (PECVD) favored for its relatively low processing costs and ability to operate at low temperatures. However, compared to the increasingly utilized atomic layer deposition (ALD) method, PECVD exhibits inferior film characteristics such as uniformity. This study aims to produce SiO₂ films with uniformity as close as possible to those achieved by ALD through the adjustment of PECVD process parameters. we conducted a total of nine PECVD processes, varying the process time and gas flow rates, which were identified as the most influential factors on the PECVD process. Furthermore, ellipsometry analysis was employed to examine the uniformity variations of each process. The experimental results enabled us to elucidate the relationship between uniformity and deposition rate, as well as the impact of gas flow rate and deposition time on the process outcomes. Additionally, thickness measurements obtained through ellipsometer facilitate the identification of optimal process parameters for PECVD.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2008.04a
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• pp.42-42
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• 2008

Considerable attention has been focused on the applications of flexible liquid crystal (LC)-based displays because of their many potential advantages, such as portability, durability, light weight, thin packaging, flexibility, and low power consumption. To develop flexible LCDs that are capable of delivering high-quality moving images, like conventional glass-substrate LCDs, the LC device structure must have a stable alignment layer of LC molecules, concurrently support uniform cell gaps, and tightly bind two flexible substrates under external tension. However, stable LC molecular alignment has not been achieved because of the layerless LC alignment, and consequently high-quality images cannot be guaranteed. To solve these critical problems, we have proposed a PDMS pixel-wall based bonding method via the IB irradiation was developed for fasten the two substrates together strongly and maintain uniform cell gaps. The effect of the IB irradiation on PDMS with PI surface was also evaluated by side structure configuration and a result of x-ray photoelectron spectroscopic analysis of PDMS interlayer as a function of binder with substrates. large number of PDMS pixel-walls are tightly fastened to the surface of each flexible substrate and could maintain a constant cell gap between the LC molecules without using any other epoxy or polymer. To enhance the electro-optical performance of the LC device, we applied an alignment method that creates pretilt angle on the PI surface via ion beam irradiation. Using this approach, our flexible LCDs have a contrast ratio of 132:1 and a response time of about 15 ms, resulting in highly reliable electro-optical performance in the bent state, comparable to that of glass-substrate LCDs.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2004.07b
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• pp.615-618
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• 2004

The piezoelectricity and polarization of multilayer ceramic actuators, being designed to stack ceramic layer and electrode layer alternately, were investigated under a consideration of geometry, the thickness ratio of the ceramic layer to electrode layer The actuators were fabricated by tape-casting of $0.42PbTiO_3-0.38PbZrO_3-0.2Pb(Mn_{1/3}Nb_{2/3})O_3$ followed by laminating, burn-out and co-firing process. The actuators of $5\times5mm^2$ in area were formed in a way that $60{\sim}200{\mu}m$ thick ceramics were stacked 10 times alternately with $5{\mu}m$ thick electrode. Increase in polarization and electric field-displacement with increasing thickness ratio of the ceramic/electrode layer and thickness/cross section ratio were attributed to the change of $non-180^{\circ}/180^{\circ}$ domain ratio which was affected by the interlayer internal stress and Poisson ratio of ceramic layer. The piezoelectricity and actuation behaviors were found to be dependent upon the volume ratio (or thickness ratio) of ceramic layer relative to ceramic layer. Concerning with the existence of internal stress, the field-induced polarization and deformation were described in the multilayer actuator.

• Journal of the Korean Electrochemical Society
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• v.2 no.2
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• pp.61-65
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• 1999

A new treatment of $LiV_3O_8$ has been proposed for improving its electrochemical behavior as a cathode material for secondary lithium batteries. Lithium trivanadate, $LiV_3O_8$, can be prepared in a finely dispersed form by dehydration of aqueous lithium trivanadate gels. The ultrasonic treatment method for Liv30s has been examined in comparison with $LiV_3O_8$ prepared by solutionmethod. The ultrasonically treated products in water were characterized by XRD (X-ray diffractometry), TGA (thermogravimetric analysis) and SEM (scanning electron microscopy). These measurements showed that the ultrasonic treatment process of aqueous $LiV_3O_8$ caused a decrease in crytallinity and considerable increased in specific surface area and interlayer spacing. The product, ultrasonically treated in water for 2 h, showed a high initial discharge capacity and was charge-discharge cycled without large capacity loss. The ultrasonic treated Liv30s can improve not only the specific capacity, but also the cycling behavior

• Journal of Welding and Joining
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• v.21 no.3
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• pp.78-84
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• 2003

The changes of microstructure and hardness of TLP bonds of directionally solidified Ni base superalloy, GTD-111, with variation of homogenizing and aging treatment were investigated. The specimens were bonded at 1403K for 7.2ks using different insert metals such as MBF-50, MBF-80 and MBF-90 and they were homogenized at 1393K with various holding time. At center of bonded interlayer homogenized for hold time 30h, the contents of aluminum and titanium were approximately 90% and 95% of base metal, respectively. In this study, aging was performed at three different kinds : one step aging ; 1113K $\times$ 16h, two step aging ; 1113K $\times$ 10h ⇒ 1103K $\times$ 10h, three step aging ; 1113K $\times$ 10h ⇒ 1103K $\times$ 8h ⇒ 922K $\times$ 24h. ${\gamma}$' volume fraction and hardness of joints were high in the sequence of one step, two step and three step aging, whereas ${\gamma}$' volume fraction and hardness of joints obtained by three step aging treatment were higher than those of raw material. Tensile properties of joints bonded with MBF-80 and MBF-90, homogenized at 1393K for 30h and then three step aged became excellent than those of raw material, however, joint bonded with MBF-50 was poor.