• Journal of the Korea institute for structural maintenance and inspection
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• v.12 no.2
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• pp.67-74
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• 2008

This paper provides the test results of bonding behavior of the interface between concrete substrate and carbon fiber in the rehabilitation method applying carbon fiber with epoxy based resin adhesive. The difference in each components was gradually increased subjected to the repetition of temperature variation, regardless of the strength of the substrate concrete, while the ultrasonic interface between each component occurred. An increase in difference of the temperature resulted in a decrease in bond strength of each component. Associated failure mode was shown to be interfacial failure and substrate concrete failure. No remarkable changes were found in the deformation and ultrasonic velocity of each component until the four cycles of the dry and moisture test. Hence, the moisture condition may not affect the bonding behavior of each component. After the repetition of dry and moisture test, corresponding bond strength was reduced to 40% of that before test. For the effect of freeze and thaw test, the cycle of freeze and thaw within 4 cycles resulted in debonding of each component.

• Journal of the Korean Electrochemical Society
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• v.18 no.2
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• pp.58-67
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• 2015

The effects of electrolyte additives, lithium bis(oxalate)borate (LiBOB), fluoroethylene carbonate (FEC), vinylene carbonate (VC), 2-(triphenylphosphoranylidene) succinic anhydride (TPSA), on high-temperature storage properties of $Li(Ni_{1/3}Co_{1/3}Mn_{1/3})O_2$/graphite are investigated with coin-type full cells. The 1 wt.% LiBOB-containing electrolyte showed the highest capacity retention after high temperature ($60^{\circ}C$) storage for 20 days, 86.7%, which is about 5% higher than the reference electrolyte, 1.15M lithium hexafluorophosphate ($LiPF_6$) in ethylene carbonate/ethyl methyl carbonate (EC/EMC, 3/7 by volume). This enhancement is closely related to the formation of semi-carbonate compounds originated from $BOB^-$ anions, thereby resulting in lower SEI thickness and interfacial resistance after storage. In addition, the 1 wt.% LiBOB-containing electrolyte also exhibited better cycle performance at 25 and $60^{\circ}C$ than the reference electrolyte, which indicates that LiBOB is an effective additive for high-temperature performance of $Li(Ni_{1/3}Co_{1/3}Mn_{1/3})O_2$/graphite chemistry.

• Proceedings of the Korea Committee for Ocean Resources and Engineering Conference
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• 2002.05a
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• pp.23-28
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• 2002

This paper describes the machining characteristics of the $MoSi_2$ based composites by electric discharge drilling with various tubular electrodes, besides, Hardness characteristics and microstructures of $Nb/MoSi_2$ laminate composites were evaluated from the variation of fabricating conditions such as preparation temperature, applied pressure and pressure holding time. $MoSi_2$ -based composites has been developed in new materials for jet engine of supersonic-speed airplanes and gas turbine for high- temperature generator. Achieving this objective may require new hard materials with high strength and high temperature-resistance. However, With the exception of grinding, traditional machining methods are not applicable to these new materials. Electric discharge machining (EDM) is a thermal process that utilizes a spark discharge to melt a conductive material, the tool electrode being almost non-unloaded, because there is no direct contact between the tool electrode and the workpiece. By combining a nonconducting ceramics with more conducting ceramic it was possible to raise the electrical conductivity. From experimental results, it was found that the lamination from Nb sheet and $MoSi_2$ powder was an excellent strategy to improve hardness characteristics of monolithic $MoSi_2$. However, interfacial reaction products like (Nb, Mo)$SiO_2$ and $Nb_2Si_3$ formed at the interface of $Nb/MoSi_2$ and increased with fabricating temperature. $MoSi_2$ composites which a hole drilling was not possible by the conventional machining process, enhanced the capacity of ED-drilling by adding $NbSi_2$ relative to that of SiC or $ZrO_2$ reinforcements.

• Journal of Conservation Science
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• v.33 no.6
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• pp.467-483
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• 2017

In this study, the degradation properties by temperature stress of $Araldite^{(R)}$ rapid-curing epoxy resin used for inorganic cultural heritages, was identified. The tensile and tensile shear strength of durability decreased for 12,624 hours at temperatures of $40{\sim}60^{\circ}C$. In terms of stability of external stress and temperature, the slow-curing epoxy was superior to the rapid-curing epoxy, and cultural heritage conservation plans should therefore consider the strength and stress properties of restoration materials. Color differences increased for 12,624 hours at temperatures of $40{\sim}60^{\circ}C$, and glossiness decreased. Both color and gloss stability were weak, which necessitates the improvement of optical properties. Thermal properties (weight loss, decomposition temperature, and glass transition temperature) of adhesives are linked to mechanical properties. Interfacial properties of the adherend and water vapor transmission rates of adhesives are linked to performance variation. For porous media (ceramics, brick, and stone), isothermal and isohumid environments are important. For outdoor artifacts on display in museums, changes in physical properties by exposure to varying environmental conditions need to be minimized. These results can be used as baseline data in the study of the degradation velocity and lifetime prediction of rapid-curing epoxy resin for the restoration of cultural heritages.

• Applied Chemistry for Engineering
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• v.9 no.3
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• pp.377-382
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• 1998

This study was carried out to investigate the relation between surface acidity and interfacial electrical characteristics of surface-treated ${\gamma}-alumina$ whose surface activity was increased. The points of zero charge (P. Z. C.) of ${\gamma}-alumina$ whose surface is treated with the sulfuric, nitric and hydro-chloric acid of various concentration were measured from the site-binding theory and mass transport method. The surface active sites were measured by amine titration method and Hammett indicator method. The interfacial properties at alumina/KCl(aq) interface were measured by potentiometric titration. From the experimental results, the following results were obtained. Pure ${\gamma}-alumina$ surface acidity decreases with the increase of calcination temperature at strength $H_o{\leq}+9.3$ Surface-treated alumina acidic properties increase with the anion loading on alumina surface. The surface ionization constants decrease with anion loading on alumina surface, then P. Z. C. decreases with acid amount on alumina surface. Acid amount of surface treated alumina can be correlated with surface charge density at strength $H_o{\leq}+4.8$ as follows. $SO_4^2-/Al_2O_3:Q_A=-0.172ln(0.0418{\sigma}+1.448)$ $NO_3^-/Al_2O_3:Q_A=-0.024{\sigma}-0.0189$ $Cl^-/Al_2O_3:Q_A=-0.01{\sigma}-0.2006$.

• Korean Journal of Materials Research
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• v.27 no.11
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• pp.603-608
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• 2017

$Si_3N_4$ is a ceramic material attracting attention in many fields because of its excellent abrasion resistance. In addition, Ti and TiAl alloys are metals used in a variety of high temperature environments, and have attracted much attention because of their high strength and high melting points. Therefore, study of the interface reaction between $Si_3N_4/Ti$ and $Si_3N_4/TiAl$ can be a useful practice to identify phase selection and diffusion control. In this study, $Si_3N_4/Ti_5Si_3+TiN/TiN/Ti$ diffusing pairs were formed in the $Si_3N_4/Ti$ interfacial reaction and $Si_3N_4/TiN(Al)/Ti_3Al/TiAl$ diffusion pathway was identified in the $Si_3N_4/TiAl$ interfacial reaction. The diffusion layers of the interface reactions were identified and, to investigate the kinetics of the diffusion layer, the integrated diffusion coefficients were estimated.

• Journal of Welding and Joining
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• v.30 no.5
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• pp.64-69
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• 2012

Sn-Bi eutectic alloy has been widely used as one of the key solder materials for step soldering at low temperature. The Sn-58Bi solder paste containing chloride flux was adopted to compare with that using the chloride-free flux. The paste was applied on the electroless nickel-immersion gold (ENIG) surface finish by stencil printing, and the reflow process was then performed at $170^{\circ}C$ for 10 min. After reflow, the solder joints were aged at $125^{\circ}C$ for 100, 200, 300, 500 and 1000 h in an oven. The interfacial microstructures were obtained by using scanning electron microscopy (SEM), and the composition of intermetallic compounds (IMCs) was analyzed using energy dispersive spectrometer (EDS). Two different IMC layers, consisting of $Ni_3Sn_4$ and relatively very thin Sn-Bi-Ni-Au were formed at the solder/surface finish interface, and their thickness increased with increasing aging time. The wettability of solder joints was investigated by wetting balance test. The mechanical property of each aging solder joint was evaluated by the ball shear test in accordance with JEDEC standard (JESD22-B117A). The results show that the highest shear force was measured when the aging time was 100 h, and the fracture mode changed from ductile fracture to brittle fracture with increasing aging time. On the other hand, the chloride flux in the solder paste did not affect the shear force and fracture mode of the solder joints.

• Elastomers and Composites
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• v.46 no.3
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• pp.195-203
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• 2011

Eco-friendly materials or bio-composites were made with poly(lactic acid) (PLA) as matrix polymer and kenaf fibers as filler. Also, acetylated kenaf fibers and compatibilizer were adopted in order to improve the interfacial adhesion between fiber and polymer. In this study, the effect of chemical modification and compatibilizer on the mechanical-viscoelastic and morphology properties of the bio-composites was discussed. The hydrophobic fibers by acetylation were known to show better interfacial bonding with the matrix polymer and resulted in improved performance and morphology. Viscoelastic property and glass transition temperature, however, were not nearly enhanced.

• Korean Journal of Materials Research
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• v.12 no.9
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• pp.750-760
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• 2002

In this study, three solders, Sn-37Pb, Sn-3.5Ag, and Sn-3.8Ag-0.7Cu were screen printed on both electroless Ni/Au and OSP metal finished micro-via PCBs (Printed Circuit Boards). The interfacial reaction between PCB metal pad finish materials and solder materials, and its effects on the solder bump joint mechanical reliability were investigated. The lead free solders formed a large amount of intermetallic compounds (IMC) than Sn-37Pb on both electroless Ni/Au and OSP (Organic Solderabilty Preservatives) finished PCBs during solder reflows because of the higher Sn content and higher reflow temperature. For OSP finish, scallop-like $Cu_{6}$ /$Sn_{5}$ and planar $Cu_3$Sn intermetallic compounds (IMC) were formed, and fracture occurred 100% within the solder regardless of reflow numbers and solder materials. Bump shear strength of lead free solders showed higher value than that of Sn-37Pb solder, because lead free solders are usually harder than eutectic Sn-37Pb solder. For Ni/Au finish, polygonal shaped $Ni_3$$Sn_4$ IMC and P-rich Ni layer were formed, and a brittle fracture at the Ni-Sn IMC layer or the interface between Ni-Sn intermetallic and P-rich Ni layer was observed after several reflows. Therefore, bump shear strength values of the Ni/Au finish are relatively lower than those of OSP finish. Especially, spalled IMCs at Sn-3.5Ag interface was observed after several reflow times. And, for the Sn-3.8Ag-0.7Cu solder case, the ternary Sn-Ni-Cu IMCs were observed. As a result, it was found that OSP finished PCB was a better choice for solders on PCB in terms of flip chip mechanical reliability.

• Korean Journal of Metals and Materials
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• v.49 no.2
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• pp.167-173
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• 2011

Nickel cobalt ferrite($Ni_{0.5}Co_{0.5}Fe_2O_4$) powder was prepared through the ceramic route by the calcination of a stoichiometric mixture of NiO, CoO and $Fe_2O_3$ at $1100^{\circ}C$. The pressed pellets of $Ni_{0.5}Co_{0.5}Fe_2O_4$ were isothermally reduced in pure hydrogen at $800{\sim}1100^{\circ}C$. Based on the thermogravimetric analysis, the reduction behavior and the kinetic reaction mechanisms of the synthesized ferrite were studied. The initial ferrite powder and the various reduction products were characterized by X-ray diffraction, scanning electron microscopy, reflected light microscope and vibrating sample magnetometer to reveal the effect of hydrogen reduction on the composition, microstructure and magnetic properties of the produced Fe-Ni-Co alloy. The arrhenius equation with the approved mathematical formulations for the gas solid reaction was applied to calculate the activation energy($E_a$) and detect the controlling reaction mechanisms. In the initial stage of hydrogen reduction, the reduction rate was controlled by the gas diffusion and the interfacial chemical reaction. However, in later stages, the rate was controlled by the interfacial chemical reaction. The nature of the hydrogen reduction and the magnetic property changes for nickel cobalt ferrite were compared with the previous result for nickel ferrite. The microstructural development of the synthesized Fe-Ni-Co alloy with an increase in the reduction temperature improved its soft magnetic properties by increasing the saturation magnetization($M_s$) and by decreasing the coercivity($H_c$). The Fe-Ni-Co alloy showed higher saturation magnetization compared to Fe-Ni alloy.