• Proceedings of the Korean Vacuum Society Conference
• /
• 2016.02a
• /
• pp.239.2-239.2
• /
• 2016

Numerous studies and approaches have been performed for solar cells to improve their photoelectric conversion efficiencies. Among them, the study for electrode containing transparent conducting oxide (TCO) layers is one of issues as well as for the cell structure based on band theory. In this study, we focused on an interfacial layer between p-type silicon and indium tin oxide (ITO) well-known as TCO materials. According to current-voltage characteristics for the sample with the interfacial layers, the improvement of band alignment between p-type silicon and ITO was observed, and their ohmic properties were enhanced in the proper condition of deposition. To investigate cause of this improvement, spectroscopic ellipsometry and ultraviolet photoelectron spectroscopy were utilized. Using these techniques, band alignment and defect in the band gap were examined. The major materials of the interfacial layer are vanadium oxide and tungsten oxide, which are notable as a hole transfer layer in the organic solar cells. Finally, the interfacial layer was applied to silicon solar cells to see the actual behavior of carriers in the solar cells. In the case of vanadium oxide, we found 10% of improvement of photoelectric conversion efficiencies, compared to solar cells without interfacial layers.

• Journal of the Microelectronics and Packaging Society
• /
• v.27 no.1
• /
• pp.1-7
• /
• 2020

The backside metallization process is typically used to attach a chip to a lead frame for semiconductor packaging because it has excellent bond-line and good electrical and thermal conduction. In particular, the backside metal with the Ag/Sn/Ag sandwich structure has a low-temperature bonding process and high remelting temperature because the interfacial structure composed of intermetallic compounds with higher melting temperatures than pure metal layers after die attach process. Here, we introduce a die attach process with the Ag/Sn/Ag sandwich structure to apply commercial semiconductor packages. After the die attachment, we investigated the evolution of the interfacial structures and evaluated the shear strength of the Ag/Sn/Ag sandwich structure and compared to those of a commercial backside metal (Au-12Ge).

• Journal of the Semiconductor & Display Technology
• /
• v.20 no.1
• /
• pp.113-117
• /
• 2021

A composite active layer was designed based on graphene quantum dots, which is a low-dimensional structure, and a heterogeneous active layer of graphene quantum dots was applied to the interfacial defect structure to overcome the limitations. Increasing to 1.5~3.5 wt % PVP GQD, Vf changed from 2.16 ~ 2.72 V. When negative deflection is applied to the lower electrode, electrons travel through the HfOx/ITO interface. The Al + ions are reduced and the device dominates at low resistance. In addition, as the PVP GQD concentration increased, the depth of the interfacial defect decreased, and the repetition of appropriate electrical properties was confirmed through Al and HfOx/ITO. The low interfacial defects help electrophoresis of Al+ ions to the PVP GQD layer and the HfOx thin film. A local electric field increase occurred, resulting in the breakage of the conductive filament in the defect.

• Structural Engineering and Mechanics
• /
• v.74 no.5
• /
• pp.589-600
• /
• 2020

The bonding interface of the concrete slab track and cement-asphalt mortar layer plays an important role in transferring load and restraining the track slab's deformation for slab track structures without concrete bollards in high-speed railway. However, the interfacial bond-slip behavior is seldom considered in the structural analysis; no credible constitutive model has been presented until now. Elaborating the field tests of concrete to cement-asphalt mortar interface subjected to longitudinal and transverse shear loads, this paper revealed its bond capacity and failure characteristics. Interfacial fractures all happen on the contact surface of the concrete track slab and mortar-layer in the experiments. Aiming at this failure mechanism, an interfacial mechanical model that employed the bilinear local bond-slip law was established. Then, the interfacial shear stresses of different loading stages and the load-displacement response were derived. By ensuring that the theoretical load-displacement curve is consistent with the experiment result, an interfacial bond-slip constitutive model including its the corresponding parameters was proposed in this paper. Additionally, a finite element model was used to validate this constitutive model further. The constitutive model presented in this paper can be used to describe the real interfacial bonding effect of slab track structures with similar materials under shear loads.

• Proceedings of the Korean Vacuum Society Conference
• /
• 2014.02a
• /
• pp.169-169
• /
• 2014

Interfacial electronic structure of bathocuproine and Al was investigated using in-situ photoemission spectroscopy and density functional theory (DFT) calculations. Bathocuproine is used for exciton blocking and electron transport material in organic photovoltaics and Al is typical cathode material. When thin thickness of Al was thermally evaporated on BCP, gap states were observed by ultraviolet photoemission spectroscopy. The closest gap state yielded below 0.3 eV from Fermi level. By x-ray photoemission spectroscopy, interaction of Al with nitrogen of BCP was observed. To understand the origin of gap states, DFT calculation was carried out and gap states was verified with successive calculation of interaction of Al and nitrogen of BCP. Furthermore, emergency of another state above Fermi level was observed. Remarkable reduction of electron injection barrier between Al and BCP, therefore, is possible.

• Structural Engineering and Mechanics
• /
• v.39 no.1
• /
• pp.47-75
• /
• 2011

An accurate substructural synthesis method including random responses synthesis, frequency-response functions synthesis and mid-order modes synthesis is developed based on rigorous substructure description, dynamic condensation and coupling. An entire structure can firstly be divided into several substructures according to different functions, geometric and dynamic characteristics. Substructural displacements are expressed exactly by retained mid-order fixed-interfacial normal modes and residual constraint modes. Substructural interfacial degree-of-freedoms are eliminated by interfacial displacements compatibility and forces equilibrium between adjacent substructures. Then substructural mode vibration equations are coupled to form an exact-condensed synthesized structure equation, from which structural mid-order modes are calculated accurately. Furthermore, substructural frequency-response function equations are coupled to yield an exact-condensed synthesized structure vibration equation in frequency domain, from which the generalized structural frequency-response functions are obtained. Substructural frequency-response functions are calculated separately by using the generalized frequency-response functions, which can be assembled into an entire-structural frequency-response function matrix. Substructural power spectral density functions are expressed by the exact-synthesized substructural frequency-response functions, and substructural random responses such as correlation functions and mean-square responses can be calculated separately. The accuracy and capacity of the proposed substructure synthesis method is verified by numerical examples.

• Advances in materials Research
• /
• v.6 no.3
• /
• pp.245-255
• /
• 2017

High energy ball milling is employed to produce iron matrix- multiwall carbon nanotube (MWCNT) reinforced composite. The damage caused to MWCNT due to harsh ball milling condition and its influence on interfacial bonding is studied. Different amount of MWCNT is used to find the optimal percentage of MWCNT for avoidance of the formation of chemical reaction product at the matrix - reinforcement interface. Effect of process control agent is assessed by the use of different materials for the purpose. It is observed that ethanol as a process control agent (PCA) causes degradation of MWCNT reinforcements after milling for two hours whereas solid stearic acid used as process control agent, allows satisfactory conservation of MWCNT structure. It is further noted that at a high MWCNT content (~ 2wt.%), high energy ball milling leads to reaction of iron and carbon and forms iron carbide (cementite) at the iron-MWCNT interface. At low percentage of MWCNT, dissolution of carbon in iron takes place and the amount of reinforcement in iron matrix composite becomes negligibly small. However, under the present ball milling condition (ball to metal ratio~ 6:1 and 200 rpm vial speed) iron-1wt.% MWCNT composite of good interfacial bonding can retain the tubular structure of reinforcing MWCNT.

• Structural Engineering and Mechanics
• /
• v.58 no.3
• /
• pp.577-596
• /
• 2016

FRP-concrete interfacial mechanical properties determine the strengthening effect of RC beams strengthened with FRP. In this paper, the model experiments were carried out with eight specimens to study the failure modes and the strengthening effect of RC beams strengthened with FRP. Then a theoretical model based on interfacial performances was proposed and interfacial mechanical behaviors were studied. Finite element analysis confirmed the theoretical results. The results showed that RC beams strengthened with FRP had three loading stages and that the FRP strengthening effects were mainly exerted in the Stage III after the yielding of steel bars, including the improvement of the bearing capacity, the decreased ultimate deformation due to the sudden failure of FRP and the improvement of stiffness in this stage. The mechanical formulae of the interfacial shear stress and FRP stress were established and the key influence factors included FRP length, interfacial bond-slip parameter, FRP thickness, etc. According to the theoretical analysis and experimental data, the calculation methods of interfacial shear stress at FRP end and FRP strain at midspan were proposed. When FRP bonding length was shorter, interfacial shear stress at FRP end was larger that led to concrete cover peeling failure. When FRP was longer, FRP reached the ultimate strain and the fracture failure of FRP occurred. The theoretical results were well consistent with the experimental data.

• Structural Engineering and Mechanics
• /
• v.15 no.3
• /
• pp.315-329
• /
• 2003

As shear occurs along a soil-structure interface, a localized zone with a thickness of several grain diameters will develop in soil along the interface, forming an interfacial layer. In this paper, the behaviour of a soil-structure interface is studied numerically by modelling the plane shear of a granular layer bounded by rigid plates. The mechanical behaviour of the granular material is described with a micro-polar hypoplastic continuum model. Numerical results are presented to show the development of shear localization along the interface for shearing under conditions of constant normal pressure and constant volume, respectively. Evolution of the resistance on the surface of the bounding plate is considered with respect to the influences of grain rotation.

• Proceedings of the Korea Concrete Institute Conference
• /
• 1999.10a
• /
• pp.471-474
• /
• 1999

An interface always appears when a repair is applied to an aged infrastructure system for repair. These repaired structures have the high chance to fail along the interface because of the stress concentration/discontinuity along the interface. So, mechanical properties of the interface have much influence on the behavior of repaired structure systems. In this paper, numerical tool that can predict effectively the interfacial fracture behavior is developed using axial deformation link elements, and this numerical technique is applied to the interfacial failure behavior. The results coincide with the ultimate strength and failure profile on the interfacial behavior of carbon fiber sheets for strengthening with epoxy adhesion. Thus, the mechanical behavior of the interface up to failure can be predicted using numerical technique with the proposed axial deformation link elements.