• Corrosion Science and Technology
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• v.10 no.1
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• pp.30-36
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• 2011

The effect of dynamic flow or forced convection were investigated and compared on the formation of inhibition layer, galvanizing and galvannealing reactions through the hot-dip galvanizing simulator with the oscillation of specimen in zinc bath, continuous galvanizing pilot plant with zinc pumping system through the snout and continuous galvanizing operation with Dynamic $Galvanizing^{TR}$ system. The interfacial Al pick-up was not consistent between the results of simulator, pilot plant and line operation, but the morphology of inhibition layer became compact and refined by the forced convection. The growth of Fe-Zn intermetallics at the interface was inhibited by the forced convection, whereas the galvannealing rate would be a little promoted.

• Proceedings of the Korean Fiber Society Conference
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• 1997.04a
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• pp.26-31
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• 1997

유리섬유/nylon 6 복합재료의 계면결합강도를 증가시키기 위하여 r-APS(r-Aminopropyltriethoxysilane)로 유리섬유의 표면을 처리 하였다. 이때 표면처리의 최적 조건을 찾기위해서 처리후 기기분석과 계면결합강도 측정 등을 하였다. 농도, pH, 처리시간, 온도를 변화시키면서 표면처리를 한 후 흡착량을 살펴본 결과 처리 농도에 의해서는 흡착량이 단조증가하였으며 처리시간에 따라서는 5분정도에서, 처리온도에 의해서는 30C 부근에서 최대 흡착량을 보였다. 또한 pH에 따른 흡착량은 silane의 고유 pH인 10.5부근에서 최대치를 나타냈다. FR-IR 분석에 의하면 NH2의 NH3 bending mode가 1607cm-1, 1575cm-1에서 나타났으며 SiOH의 SiO band는 960cm-1에서 나타났다. XPS를 통해서는 N ls와 Si 2p의 존재를 확인할 수 있었다. 표면처리된 유리섬유와 matrix인 nylon 6를 이용해 단섬유내장시편을 만들어 fragmentation test를 한 결과 계면결합강도는 약 5분의 처리시간과 1%(wt%)의 농도에서 최대값을 보였다.

• Fibers and Polymers
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• v.2 no.2
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• pp.58-63
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• 2001

Silk fibroin (SF) was dissolved in calcium chloride/ethanol/water mixture(1/2/8 in mole ratio) at $70^{\circ}C$ for 4h. The dissolved silk fibroin was regenerated by casting the dialyzed solution into films. The films were treated with 50% aqueous solution of methanol for different times, and their antithrombogenicity was evaluated by in vivo tests. In vivo blood tests were made by a method of peripheral vein indwelling suture. It was found that the silk fibroin had a good antithrombogenicity and an absorbability even though the polymer showed foreign body reaction. Finally, the blood compatibilty of silk fibroin films which were subjected to structural change by the methoanl treatment, was examined in connection with their interfacial surface energy, and a correlation between these properties was found to be present.

• Proceedings of the KWS Conference
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• 2005.11a
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• pp.219-221
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• 2005

Sn-9Zn solder balls were bonded to Cu, ENIG (Electroless Nickel/Immersion Gold) and electrolytic Au/Ni pads, and the effect of aging on their joint reliability was investigated. The interfacial products were different from the general reaction layer formed in a Sn-base solder. The intermetallic compounds formed in the solder/Cu joint were $Cu_{5}Zn_{8}$ and $Cu_{6}Sn_{5}$. After aging treatment, voids formed irregularly at the bottom side of the solder because of Sn diffusion into the $Cu_{5}Zn_{8}$ IMC. In the case of the solder/ENIG joint, $AuZn_{3}$ IMCs were formed at the interface. In the case of the Au/Ni/Cu substrate, an $AuZn_{3}$ IMC layer formed at the interface due to the fast reaction between Au and Zn. In addition, the $AuZn_{3}$ IMC layer became detached from the interface after reflow. When the aging time was extended to 100 h, $Ni_{5}Zn_{21}$ IMC was observed on the Ni substrate.

• Journal of the Korean institute of surface engineering
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• v.32 no.4
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• pp.503-512
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• 1999

The crystal structure and the microstructure of the intermetallic compounds formed in the interface between In solder and Au/Ni/Ti thin films have been investigated by XRD, SEM, and TEM. Indium solder was deposited on the Au/Ni/Ti thin films/Si substrate by evaporation. The heat treatments simulated the flip chip solder joining were performed in RTA system or in furnace. $Auln_2$ phase is formed in all specimens.$ In_{27}$ $Ni_{10}$ and/or $In_{X}$ $Ni_{Y}$ phase are formed in the interface between $Auln_2$ and Ni depending the heat treatment conditions.

• Proceedings of the Korean Fiber Society Conference
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• 2003.10b
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• pp.189-190
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• 2003

섬유강화 복합재료의 사용이 점점 증가함에 따라 구조용 및 내장재 등으로 사용된 수명이 다한 섬유강화 복합재료의 사용후 폐기가 문제가 되고 있다. 특히, 자동차 부품, 건축자재 및 전기절연재 등으로 가장 많이 사용되는 유리섬유 복합재료의 폐기물이 급격히 증가하여 환경 오염문제가 심각해지고 있어서, 환경 친화적인 새로운 복합재료에 대한 필요성이 제기되어 왔다. 따라서 본 연구에서는 천연섬유를 이용한 천연섬유/생분해성 수지계 복합소재를 대상으로 환경적합성이 우수하고 자연환경에서 완전한 생분해성을 가지며, 유리 섬유복합재료를 대체할 물성이 우수한 새로운 Biocomposite를 개발하고자 하였다. (중략)

• 한국균학회소식:학술대회논문집
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• 2015.11a
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• pp.23-23
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• 2015

Rice blast disease caused by M. oryzae is the most devastating fungal disease in rice. During the infection process, M. oryzae secretes a large number of glycosyl hydrolase (GH) proteins into the apoplast to digest host cell wall and assist fungal ingress into host tissues. In this study, we identified a novel M. oryze arabinofuranosidase B (MoAbfB) which is secreted during fungal infection. Live-cell imaging exhibited that fluorescent labeled MoAbfB was highly accumulated in fungal invasive structures such as appressorium, tips of penetration peg, biotrophic interfacial complex (BIC), as well as invasive hyphal tip. Deletion of MoAbfB mutants extended biotrophic phase followed by enhanced disease severity, whereas, over-expression of OsMoAbfB mutant induced rapid defense responses and enhanced rice resistance to M. oryzae infection. Furthermore, exogenous treatment of MoAbfB protein showed inhibition of fungal infection via priming of defense gene expression. We later found that the extract of MoAbfB degraded rice cell wall fragments could also induce host defense activation, suggesting that not MoAbfB itself but oligosaccharides (OGs) derived from MoAbfB dissolved rice cell wall elicited rice innate immunity.

• Proceedings of the Korean Powder Metallurgy Institute Conference
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• 2006.09b
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• pp.1307-1308
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• 2006

The purpose of this study was to examine the interfacial reaction between diamond grits and Ni-based, Ag-based, brazing filler metal, respectively. The morphology of the interface between diamond grits and Ni-based, filler metal exhibited a very good condition after this heat treatment. Cr-carbide and Ni-rich compounds were detected by XRD analysis in the vicinity of the interface between diamond grits and Ni-based, filler metal after vacuum induction brazing. Chromium carbide is considered to play an important role in the high bonding strength achieved between diamonds grits and the brazing alloy.

• Journal of computational fluids engineering
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• v.12 no.4
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• pp.14-19
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• 2007

We present a direct numerical simulation technique and some preliminary results of the capillary spreading of a droplet containing particles on the solid substrate. We used the level-set method with the continuous surface stress for description of droplet spreading with interfacial tension and employed the discontinuous Galerkin method for the stabilization of the interface advection equation. The distributed Lagrangian-multipliers method has been combined for the implicit treatment of rigid particles. We investigated the droplet spreading by the capillary force and discussed effects of the presence of particles on the spreading behavior. It has been observed that a particulate drop spreads less than the pure liquid drop. The amount of spread of a particulate drop has been found smaller than that of the liquid with effectively the same viscosity as the particulate drop.

• Macromolecular Research
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• v.8 no.4
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• pp.153-164
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• 2000

By electrodeposition (ED) using a monomeric- and two polymeric coupling agents, the interfacial shear strength (IFSS) of carbon fiber/epoxy composites was investigated by fragmentation test. ED results were compared with the dipping and the untreated cases under dry and wet conditions. Multi-fiber composites (MFC) were used for the direct comparison for the untreated and the treated cases. Various treating conditions including time, concentration and temperature were evaluated, respectively. Under dry and wet conditions ED treatment exhibited much higher IFSS improvement compared to the dipping and the untreated cases. Monomeric- and polymeric coupling agents exhibited the comparative IFSS improvement. Adsorption mechanism between coupling agents and carbon fiber was analyzed in terms of the electrolyte molecular interactions during ED process based on to the chain mobility. The microfailure modes occurring from the fiber break, matrix and interlayer cracks were correlated to IFSS.