• Journal of the Korean Crystal Growth and Crystal Technology
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• v.24 no.3
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• pp.106-110
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• 2014

The passivation property of $Al_2O_3$ thin film formed using atomic layer deposition (ALD) for the application of crystalline Si solar cells was investigated using microwave photoconductance decay (${\mu}$-PCD). After post-annealing at $400^{\circ}C$ for 5 min, $Al_2O_3$ thin film exhibited the structural stability having amorphous nature without the interfacial reaction between $Al_2O_3$ and Si. The post-annealing at $400^{\circ}C$ for 5 min led to an increase in the relative effective lifetime of $Al_2O_3$ thin film. This could be associated with the field effective passivation combined with surface passivation of textured Si. The capacitance-voltage (C-V) characteristics of the metal-oxide-semiconductor (MOS) with $Al_2O_3$ thin film post-annealed at $400^{\circ}C$ for 5 min was carried out to evaluate the negative fixed charge of $Al_2O_3$ thin film. From the relationship between flatband voltage ($V_{FB}$) and equivalent oxide thickness (EOT), which were extracted from C-V characteristics, the negative fixed charge of $Al_2O_3$ thin film was calculated to be $2.5{\times}10^{12}cm^{-2}$, of which value was applicable to the passivation layer of n-type crystalline Si solar cells.

• Journal of the Microelectronics and Packaging Society
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• v.12 no.1 s.34
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• pp.41-46
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• 2005

A systematic investigation of shear testing was conducted to find a relationship between Ni-Sn intermetallic spatting and the brittle fracture observed in electroless Ni(P)/solder interconnection. Brittle fracture was found in the solder joints made of Sn-3.5Ag, while only ductile fracture was observed in a Cu-containing solder (Sn-3.0Ag-0.5Cu). For Sn-3.0Ag-0.5Cu joints, $(Ni,Cu)_3Sn_4$ and/or $(Cu,Ni)_6Sn_5$ compound were formed at the interface without spatting from the Ni(P) film. For Sn-3.5Ag, $Ni_3Sn_4$ compound was formed and brittle fracture occurred in solder pads where $Ni_3Sn_4$ had spalled. From the analysis of fractured surfaces, it was found that the brittle fracture occurs through the $Ni_3SnP$ layer formed between $Ni_3Sn_4$ intermetallic layer and the Ni(P) film. Since the $Ni_3SnP$ layer is getting thicker during/ after $Ni_3Sn_4$ spatting, suppression of $Ni_3Sn_4$ spatting is crucial to ensure the reliability of Ni(P)/solder system.

• Composites Research
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• v.31 no.5
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• pp.177-185
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• 2018

Fiber metal laminate (FML) is a type of hybrid composites which consist of metallic and fiber-reinforced plastic sheets. As the FML has a drawback of the delamination that is a failure of the interfacial adhesive layer, the nominal stresses and the energy release rates should be determined to identify the delamination behavior. However, it is difficult to derive the nominal stresses and the energy release rates since the operating temperature of the equipment is restricted. For this reason, the objective of this paper is to predict the mode-I nominal stress and the mode-I energy release rate of the adhesive layer using the inverse analysis based on the Levenberg-Marquardt method. First, the mode-I nominal stress was assumed as the tensile strength of the adhesive layer, and the mode-I energy release rate was obtained from the double cantilever beam test. Next, the finite element method was applied to predict the mode-I delamination behavior. Finally, the mode-I nominal stress and the mode-I energy release rate were predicted by the inverse analysis. In addition, the convergence of the parameters was validated by trying to input two cases of the initial parameters. Consequently, it is noted that the inverse analysis can predict the mode-I delamination behavior, and the two input parameters were converged to similar values.

• Restorative Dentistry and Endodontics
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• v.28 no.1
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• pp.23-33
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• 2003

The purpose of this study was to compare in vitro interfacial relationship of restorations bonded with three self-etching primer adhesives and one self-etching adhesive. Class I cavity preparations were prepared on twenty extracted human molars. Prepared teeth were divided into four groups and restored with four adhesives and composites Clearfil SE $Bond/Clearfil^{TM}$ AP-X (SE), UniFil $Bond/UniFil^{\circledR}$ F (UF), FL $Bond/Filtek^{TM}$ Z 250 (FL) and Prompt $L-Pop/Filtek^{TM}$ Z 250 (LP) After storing in distilled water of room temperature for 24 hours, the specimens were vertically sectioned and decalcified. Morphological patterns between the enamel/dentin and adhesives were observed under SEM. The results of this study were as follows : 1. They showed close adaptation between enamel and SE, UF and FL except for LP. 2. The hybrid layer in dentin was $2{\;}\mu\textrm{m}$ thick in SE, $1.5{\;}\mu\textrm{m}$ thick in UF, and $0.4{\;}\mu\textrm{m}$ in both FL and LP. So, the hybrid layers of SE and UF were slightly thicker than that of FL and LP. 3. The lengths and diameters of resin tags in UF and FL were similar, but those of LP were slightly shorter and slenderer than those of SE. 4. The resin tags were long rod shape in SE, and funnel shape in other groups Within the limitations of this study, it was concluded that self-etching primer adhesives showed close adaptation on enamel. In addition, the thickness of hybrid layer ranged from $0.4-1.5{\;}\mu\textrm{m}$ between adhesives and dentin. The resin tags were long rod or funnel shape, and dimension of them was similar or different among adhesives.

• Korean Chemical Engineering Research
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• v.48 no.2
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• pp.172-177
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• 2010

This study reports the high-temperature oxidation kinetics, ASR(area specific resistance), and interfacial microstructure of metallic interconnects coated with conductive oxides in oxidation atmosphere at $800^{\circ}C$, The conductive material LSC($La_{0.8}Sr_{0.2}CoO_3$, prepared by Solid State Reaction) was coated on the Crofer22APU. The contact behavior of coating layer/metal substrate was increased by sandblast. The electrical conductivity of the LSC coated Crpfer22APU was measured by a DC two probe four wire method for 4000hr, in air at $800^{\circ}C$. Microstructure and composition of the coated layer interface were investigated by SEM/EDS. These results show that a coated LSC layer prevents the formation and growth of oxide scale such as $Cr_2O_3$ and enhances the long-term stability and electrical performance of metallic interconnects for SOFCs.

• Journal of the Microelectronics and Packaging Society
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• v.16 no.3
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• pp.19-24
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• 2009

Formation of an adhesion/barrier layer and a seed layer by sputtering techniques followed by electroplating has been one of the most widely used methods for the filling of through-Si via (TSV) with high aspect ratio for 3-D packaging. In this research, the adhesion and diffusion-barrier properties of the $TaN_x$ film deposited by reactive sputtering were investigated. The adhesion strength between Cu film and $SiO_2$/Si substrate was quantitatively measured by $180^{\circ}$ peel test and topple test as a function of the composition of the adhesive $TaN_x$ film. As the nitrogen content increased in the adhesive $TaN_x$ film, the adhesion strength between Cu and $SiO_2$/Si substrate increased, which was attributed to the increased formation of interfacial compound layer with the nitrogen flow rate. We also examined the diffusion-barrier properties of the $TaN_x$ films against Cu diffusion and found that it was improved with increasing nitrogen content in the $TaN_x$ film up to N/Ta ratio of 1.4.

• Journal of the Korean Vacuum Society
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• v.18 no.4
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• pp.245-253
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• 2009

For the growth optimization of InAs/GaSb (8/8-ML) strained-layer superlattice (SLS), the structure has been grown under various conditions and modes and characterized by the high-resolution x-ray diffraction (XRD) analysis. In this study, the strain modulation is induced by changing parameters and modes, such as the growth temperature, the ratio of V/III beam-equivalent-pressure (BEP), and the growth interruption (GI), and the strain variation is analyzed by measuring the angle separation of 0th-order satellite peak in XRD patterns. The XRD results reveal that the growth temperature and the V/III(Sb/Ga) ratio are major parameters to change the crystallineity and the strain modulation in SLS structures, respectively. We have observed that the SLS samples with compressive strain prepared in this study are show a transition to tensile strain with decreasing V/III(Sb/Ga) ratio, and the GI process is a sensitive factor giving rise to strain modulation. These results obtained in this study suggest that optimized growth temperature and V/III(Sb/Ga) ratio are $350^{\circ}C$ and 20, respectively, and the appropriate GI time is approximately 3 seconds just before InAs growth that the crystallineity is maximized and the strain relaxation is minimized.

• Korean Journal of Materials Research
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• v.3 no.3
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• pp.282-291
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• 1993

Joining ${Al}_{2}{O}_{3}$ and STS 304 stainless steel by active metal brazing method with using CuI Owt % Ti and Cu -7 .5wt % Zr insert metal, their interfaces were analyzed and strength of the joint brazed with Cu-7.5wt % Zr insert metal also investigated with shear strength testing method. In brazing with Cu-lOwt% Ti insert metal, the single reaction layer was formed by the reaction with Ti and ${Al}_{2}{O}_{3}$ at the interface between ${Al}_{2}{O}_{3}$ and insert metal, but the double reaction layer was found in brazing with Cu-7.5wt % Zr insert metal because of the difference of their wettability on the surface of ${Al}_{2}{O}_{3}$. Fracture shear strength about 86MPa was obtained from ${Al}_{2}{O}_{3}$/Cu-7.5wt% Zr/STS 304 stainless steel joint and reasonable strength of the joints is attributed to the formation of double reaction layer at the interface.

• Korean Chemical Engineering Research
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• v.57 no.4
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• pp.512-518
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• 2019

To develop a membrane electrode assembly (MEA) with lower Pt loading and higher performance in proton exchange membrane fuel cells (PEMFCs), it is an important research issue to understand interfacial structure of Pt/C catalyst and ionomer and design the catalyst layer structure. In this study, we prepared short-side-chain Nafion-based ionomer dispersion using propylene glycol (PG) as a solvent instead of water which is commonly used as a solvent for commercially available ionomers. Cathode catalyst layers with different ionomer content from 20 to 35 wt% were prepared using the ionomer dispersion for the fabrication of four different MEAs, and their fuel cell performance was evaluated. As the ionomer content increased to 35 wt%, the performance of the prepared MEAs increased proportionally, unlike the commercially available water-based ionomer, which exhibited an optimum at about 25 wt%. Small size micelles and slow evaporation of PG in the ionomer dispersion were effective in proton transfer by inducing the formation of a uniformly structured catalyst layer, but the low oxygen permeability problem of the PG-based ionomer film should be resolved to improve the MEA performance.

• Applied Chemistry for Engineering
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• v.21 no.1
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• pp.11-17
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• 2010

Modifying surface of activated carbon for the electrode of EDLC with an organic electrolyte was investigated to improve the electrochemical performance of EDLC by the microwave radiation. Three kinds of activated carbons, prepared activated carbon from petroleum cokes and pitch cokes and commercial activated carbon BP-25, were used for this study. For all investigated activated carbons, hydrophilic functional groups-containing oxygen disappeared from the surface of activated carbon as microwave radiation. And as microwave radiation time was increased, the specific surface area and total pore volume of activated carbons were reduced and average pore diameter were increased. From theses effects, interfacial resistance of EDLC with the modified activated carbon electrode was drastically decreased, and discharge capacitance was increased although the specific surface area of activated carbon was reduced by this microwave radiation.