• Proceedings of the Korean Vacuum Society Conference
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• 2016.02a
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• pp.171.2-171.2
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• 2016

The 2-dimensiona electron gas (2DEG) layers have opened tremendous interests in the heterooxide interfaces formed between two insulating materials, especially between LaAlO3 and $SrTiO_3$. The 2DEG layers exhibit extremely high mobility and carrier concentrations along with metallic transport phenomena unlike the constituent oxide materials, i.e., $LaAlO_3$ and $SrTiO_3$. The current work inserted artificially the interfacial layer, $Sr_xCa_{1-x}TiO_3$ between $LaAlO_3$ and $SrTiO_3$, with the aim to controlling the 2-dimensional transports. The insertion of the additional materials affect significantly their corresponding electrical transports. Such features have been probed using DC and AC-based characterizations. In particular, impedance spectroscopy was employed as an AC-based characterization tool. Frequency-dependent impedance spectroscopy have been widely applied to a number of electroceramic materials, such as varistors, MLCCs, solid electrolytes, etc. Impedance spectroscopy provides powerful information on the materials system: i) the simultaneous measurement of conductivity and dielectric constants, ii) systematic identification of electrical origins among bulk-, grain boundary-, and electrode-based responses, and iii) the numerical estimation on the uniformity of the electrical origins. Impedance spectroscopy was applied to the $LaAlO_3/Sr_xCa_{1-x}TiO_3/SrTiO_3$ system, in order to understand the 2-dimensional transports in terms of the interfacial design concepts. The 2-dimensional conduction behavior system is analyzed with special emphasis on the underlying mechanisms. Such approach is discussed towards rational optimization of the 2-dimensional nanoelectronic devices.

• Korean Journal of Materials Research
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• v.27 no.11
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• pp.603-608
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• 2017

$Si_3N_4$ is a ceramic material attracting attention in many fields because of its excellent abrasion resistance. In addition, Ti and TiAl alloys are metals used in a variety of high temperature environments, and have attracted much attention because of their high strength and high melting points. Therefore, study of the interface reaction between $Si_3N_4/Ti$ and $Si_3N_4/TiAl$ can be a useful practice to identify phase selection and diffusion control. In this study, $Si_3N_4/Ti_5Si_3+TiN/TiN/Ti$ diffusing pairs were formed in the $Si_3N_4/Ti$ interfacial reaction and $Si_3N_4/TiN(Al)/Ti_3Al/TiAl$ diffusion pathway was identified in the $Si_3N_4/TiAl$ interfacial reaction. The diffusion layers of the interface reactions were identified and, to investigate the kinetics of the diffusion layer, the integrated diffusion coefficients were estimated.

• Composites Research
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• v.24 no.1
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• pp.45-50
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• 2011

Transparent and conductive carbon nanotube on polyethylene terephthalate (PET) were prepared by dip-coating method for self-sensing multi-functional nanocomposites. The changes in the electrical and optical properties of CNT coating mainly depended on the number of dip-coating, concentration of CNT solution. Consequently, the surface resistance and transmittance of CNT coating were sensitively controlled by the processing parameters. Surface resistance of CNT coating was measured using four-point method, and surface resistance of coated CNT could be better calculated by using the dual configuration method. Optical transmittance of PET film with CNT coating was evaluated using UV spectrum. Surface properties of coated CNT investigated by wettability test via static and dynamic contact angle measurement were consistent with each other. As dip-coating number increased, surface resistance of coated CNT decreased seriously, whereas the transmittance exhibited little lower due to the thicker CNT networks layer. Interfacial microfailure properties were investigated for CNT and indium tin oxide (ITO) coatings on PET substrates by electrical resistance measurement under cyclic loading fatigue test. CNT with high aspect ratio exhibited no change in surface resistance up to 2000 cyclic loading, whereas ITO with brittle nature showed a linear increase of surface resistance up to 1000 cyclic loading and then exhibited the level-off due to reduced electrical contact points based on occurrence of many micro-cracks.

• Composites Research
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• v.30 no.6
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• pp.365-370
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• 2017

Mechanical properties of carbon fiber reinforced thermoplastic composites (CFRTPs) are affected by various factors. One of the them are poor compatibility of the epoxy sizing layer on the carbon fiber surface with thermoplastic matrix, which causes the inferior interfacial strength between fibers and matrix. In addition, the high molten-viscosity of thermoplastics attributes to the poor impregnation state. Consequently, many voids in the composite materials were generated, which leads to poor mechanical properties of the thermoplastic composites. In this study, the epoxy sizing on the carbon fiber surface was removed and the polyamide 6,6 solution was coated on the de-sized carbon fiber surface to improve the impregnation state and mechanical properties. Interlaminar shear strength (ILSS) of CFRPTs was estimated by implementing short beam shear tests. In addition, flexural strength was measured and the impregnation state of the composites was evaluated by calculating void content.

• Korean Journal of Materials Research
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• v.1 no.4
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• pp.229-235
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• 1991

A new electrode material for $Ta_2O_5$ capacitor was developed to obtain both high dielectric constant and improved electrical properties for use in DRAM. High leakage current and low breakdown field of as-deposited $Ta_2O_5$ film on Si is due to the reduction of $Ta_2O_5$ by silicon at $Ta_2O_5$/electrode interface. $Dry-O_2$ anneal improves the electrical properties of $Ta_2O_5$ capacitor with Si electrode, but it thickens the interfacial oxide and lowers the dielectric constant, subsequently. $Ta_2O_5$ capacitor with TiN exectrode shows better electrical properties and higher dielectric constant than post heat treated $Ta_2O_5$ film on Si. No interfacial oxide layer at $Ta_2O_5$/TiN interface suggests that there\`s no Interaction between $Ta_2O_5$ and electrode. TiN is a adequate electrode material for $Ta_2O_5$ capacitor.

• Korean Journal of Materials Research
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• v.10 no.2
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• pp.160-165
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• 2000

We have investigated the electrical and diffusion barrier properties of MgO produced on the surface of Cu (Mg) alloy. Also the diffusion barrier property of the interfacial MgO between Cu alloy and $SiO_2$ has been examined. The results show that the $150\;{\AA}$-MgO layer on the surface remains stable up to $700^{\circ}C$, preventing the interdiffusion of C Cu and Si in Si/MgO/Cu(Mg) structure. It also has the breakdown voltage of 4.5V and leakage current density of $10^{-7}A/\textrm{cm}^2/$. In addition, the combined structure of $Si_3N4(100{\AA})/MgO(100{\AA})$ increases the breakdown voltage up to lOV and reduces the leakage current density to $8{\tiems}10^{-7}A/\textrm{cm}^2$. Furthermore, the interfacial MgO formed by the chemical reac­t tion of Mg and $SiO_2$ reduces the diffusion of copper into $SiO_2$ substrate. Consequently, Cu(Mg) alloy can be applied as a g gate electrode in TFT /LCDs, reducing the process steps.

• Korean Chemical Engineering Research
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• v.58 no.1
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• pp.64-68
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• 2020

In this study, metal copper clad laminate can be prepared using epoxy composite filled with thermally conductive fillers. In order to improve the thermal conductivity of epoxy composites, it is important factor to form conductive networks through appropriate packing of conductive fillers in epoxy composite matrix and to decrease the amount of thermally resistant junctions involving a epoxy composite matrix layer between adjacent filler units. This is because epoxy has a thermal conductivity of only 0.2-0.3W, so in order to maintain high thermal conductivity, thermally conductive fillers are connected to each other, so that the gap between particles can be reduced to reduce thermal resistance. The purpose of this study is to find way to achieve highly thermally conductive in the epoxy composite matrix filled with Al₂O₃ and Boron Nitride(BN) filler by filler loading and uniform dispersion. As a results, the use of Al₂O₃/BN hybrid filler in epoxy matrix was found to be effective in increasing thermal conductivity of epoxy composite matrix due to the enhanced connectivity offered by more continuous thermally conductive pathways and uniform dispersion without interfacial voids in epoxy composite matrix. In addition, surface treatmented s-BN improves the filler dispersion and adhesion between the filler and the epoxy matrix, which can significantly decrease the interfacial thermal resistance and increase the thermal conductivity of epoxy composite matrix.

• Journal of the Korean Electrochemical Society
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• v.21 no.2
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• pp.28-38
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• 2018

Although the adhesion properties of composite electrodes are important for securing long-term reliability and realizing high energy density of lithium secondary batteries, related research has not been carried out extensively due to the limitation of measurement technology. However, surface and interfacial cutting analysis system(SAICAS), which can measure the adhesion properties while cutting and peeling a coating layer of $1{\sim}1000{\mu}m$ thickness, has been developed and applied for analyzing the adhesion properties of composite electrodes for lithium secondary batteries. Thus, this review presents not only the principle and measurement method of SAICAS but also comparison results between SAICAS and conventional peel test. In addition, application examples of SAICAS are introduced in the study of electrode design optimization, new binder derivation study, and binder distribution in composite electrode. This suggests that SAICAS is an analytical method that can be easily applied to investigate the adhesion properties of composite electrodes for lithium secondary batteries.

• Journal of the Computational Structural Engineering Institute of Korea
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• v.17 no.4
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• pp.375-387
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• 2004

A new finite element model will be presented to analyze the nonlinear behavior of RC beams and slabs strengthened by a patch repair. The numerical approach is based on the p-version degenerate shell element including theory of anisotropic laminated composites, theory of materially and geometrically nonlinear plates. In the nonlinear formulation of this model, the total Lagrangian formulation is adopted with large deflections and moderate rotations being accounted for in the sense of von Karman hypothesis. The material model is based on hardening rule, crushing condition, plate-end debonding strength model and so on. The Gauss-Lobatto numerical quadrature is applied to calculate the stresses at the nodal points instead of Gauss points. The validity of the proposed p-version nonlinear finite element model is demonstrated through the load-deflection curves, the ultimate loads, and the failure modes of RC beams or slabs bonded with steel plates or FRP plates compared with available result of experiment and other numerical methods.

• Korean Journal of Materials Research
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• v.9 no.3
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• pp.288-294
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• 1999

In the flip chip interconnection using solder bump, the Under Bump Metallurgy (UBM) is required to perform multiple functions in its conversion of an aluminum bond pad to a solderable surface. In this study, various UBM systems such as $Al 1\mu\textrm{m} / Ti 0.2\mu\textrm{m} / Cu 5\mu\textrm{m}, Al 1\mu\textrm{m} / Ti 0.2\mu\textrm{m} / Cu 1\mu\textrm{m}, al 1\mu\textrm{m}/Ni 0.2\mu\textrm{m} / Cu 1\mu\textrm{m} and Al 1\mu\textrm{m}/Pd 0.2\mu\textrm{m} / Cu 1\mu\textrm{m}$ for flip chip interconnection using the low melting point eutectic 63Sn-37Pb solder were investigated and compared to their metallurgical properties. $100\mu\textrm{m}$ size bumps were prepared for using an electroplating process. The effects of the number of reflows and aging time on the growth of intermetallic compounds(IMC) were investigated. $Cu_6Sn_5$ and $Cu_3Sn$ IMC were abserved after aging treatment in the UBM system with thick coper $(Al 1\mu\textrm{m}/Ti 0.2\mu\textrm{m}/Cu 5\mu\textrm{m})$. However only the $Cu_6Sn_5$ was detected in the UBM system with $1\mu\textrm{m}$ thick copper even after 2 reflow and 7 day aging at $150^{\circ}C$. Complete Cu consumption by Cu-Sn IMC growth gives rise to a direct contact between solder inner layer such as Ti, Ni and Pd, and hence to possibly cause reactions between two of them. In this study, however, only for the Pd case, IMC of PdSn. was observed by Cu consumption. UBM interfacial reactions with s이der affected the adhesion strength ot s이der balls after s이der reflow and annealing treatment.