• 반도체디스플레이기술학회지
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• 제17권1호
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• pp.35-39
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• 2018

This paper deals with the relaxation of singular stresses developed in an epoxy adhesive at high temperature. The interface stresses are analyzed using BEM. The adhesive employed in this study is an epoxy which can be cured at room temperature. The adhesive is assumed to be linearly viscoelastic. First, the distribution of the interface stresses developed in the adhesive layer under the uniform tensile stress has been calculated. The singular stress has been observed near the interface corner. Such singular stresses near the interface corner may cause epoxy layer separated from adherent. Second, the interfacial thermal stress has been investigated. The uniform temperature rise can relieve the stress level developed in the adhesive layer under the external loading, which can be viewed as an advantage of thermal loading. It is also obvious that temperature rise reduces the bonding strength of the adhesive layer. Experimental evaluation is required to assess a trade-off between the advantageous and deleterious effects of temperature.

• 대한기계학회논문집A
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• 제27권7호
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• pp.1159-1169
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• 2003

This paper investigates the effects of T-stress and plastic hardening mismatch on the interfacial crack-tip stress field via finite element analyses. Plane strain elastic-plastic crack-tip fields are modeled with both MBL formulation and a full SEC specimen under pure bending. Modified Prandtl slip line fields illustrate the effects of T-stress on crack-tip constraint in homogeneous material. Compressive T-stress substantially reduces the interfacial crack-tip constraint, but increases the J-contribution by lower hardening material, J$\_$L/. For bimaterials with two elastic-plastic materials, increasing plastic hardening mismatch increases both crack-tip stress constraint in the lower hardening material and J$\_$L/. The fracture toughness for bimaterial joints would consequently be much lower than that of lower hardening homogeneous material. The implication of unbalanced J-integral in bimaterials is also discussed.

• 대한기계학회논문집A
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• 제22권4호
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• pp.779-789
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• 1998

In this paper, the thermal shock responses of collinear cracks in a layered medium are investigated based on the uncoupled, quasi-static plane thermoelasticity. The medium is modeled as a bonded structure composed of a surface layer and a semi-infinite substrate. Between these two dissimilar homogeneous constituents, a functionally graded interfacial zone exists with the nonhomogeneous features of continuously varying thermoelastic properties. Three cracks are assumed to be present in the layered medium, one in each one of the constituent materials, aligned collinearly normal to the nominal interfaces. A system of singular integral equations is solved, subjected to the forcing terms of equivalent transient thermal tractions acting on the locations of cracks via superposition. Main results presented are the transient thermal stress intensity factors to illustrate the parametric effects of various geometric and amterial combinations of the medium with the thermoelastically graded interfacial zone and the collinear cracks.

• Journal of Electrochemical Science and Technology
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• 제11권4호
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• pp.411-420
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• 2020

Undesirable interfacial reactions between the cathode and sulfide electrolyte deteriorate the electrochemical performance of all-solid-state cells based on sulfides, presenting a major challenge. Surface modification of cathodes using stable materials has been used as a method for reducing interfacial reactions. In this work, a precursor-based surface modification method using Zr and Mo was applied to a LiNi_0.6Co_0.2Mn_0.2O₂ cathode to enhance the interfacial stability between the cathode and sulfide electrolyte. The source ions (Zr and Mo) coated on the precursor-surface diffused into the structure during the heating process, and influenced the structural parameters. This indicated that the coating ions acted as dopants. They also formed a homogenous coating layer, which are expected to be layers of Li-Zr-O or Li-Mo-O, on the surface of the cathode. The composite electrodes containing the surface-modified LiNi_0.6Co_0.2Mn_0.2O₂ powders exhibited enhanced electrochemical properties. The impedance value of the cells and the formation of undesirable reaction products on the electrodes were also decreased due to surface modification. These results indicate that the precursor-based surface modification using Zr and Mo is an effective method for suppressing side reactions at the cathode/sulfide electrolyte interface.

• 대한기계학회논문집A
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• 제20권4호
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• pp.1275-1289
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• 1996

The plane elasticity problem of collinear cracks in a layered medium is investigated. The medium is modeled as bonded structure constituted from a surface layer and a semi-infinite substrate. Along the bond line between the two dissimilar homegeneous constituents, it is assumed that as interfacial zone having the functionally graded, nonhomogeneous elastic modulus exists. The layered medium contains three collinear cracks, one in each constituent material oriented perpendicular to the nominal interfaces. The stiffness matrix formulation is utilized and a set of homogeneous conditions relevant to the given problem is readily satisfied. The proposed mixed boundary value problem is then represented in the form of a system of integral equations with Cauchy-type singular kernels. The stress intensity factors are defined from the crack-tip stress fields possessing the standard square-root singular behavior. The resulting values of stress intensity factors mainly address the interactions among the cracks for various crack sizes and material combinations.

• 한국주조공학회지
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• 제20권2호
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• pp.116-121
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• 2000

Interfacial reaction and mechanical properties between Sn-Zn-X ternary alloys(X : 3wt.%In, 4wt.%Bi) and Cu-substrate were studied. Cu/solder joints were subjected to aging treatments for up to 50days to see interfacial reaction at $100^{\circ}C$ and then were examined changes of microstructure and interfacial compound by optical microscopy, SEM and EDS. Cu/solder joints were aged to 30days and then loaded to failure at cross head speed of 0.3 mm $min^{-1}$ to measure tensile strength. According to the results of the solderability test, additions of In and Bi in the Sn-9wt.%Zn solder improve the wetting characteristics of the alloy and lower the melting temperature. Through the EDS and XRD analysis of Cu/Sn-9wt.%Zn solder joint, it was concluded that the intermetallic compound was the ${\gamma}-Cu_5Zn_8$ phase. Cu-Zn intermetallics at Cu/solder interfaces played an important role in both the microstructure evolution and failure of solder joints. Cu/solder joint strength was decreased by aging treatment, and those phenomenon was closely related to the thickening of intermetallic layer at Cu/solder joints.

• Korean Journal of Chemical Engineering
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• 제35권12호
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• pp.2487-2495
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• 2018

Inspired by the specific amino acid sequence Asn-Pro-Ala (NPA) of water channel aquaporins (AQPs), we fabricated polyamide (PA) nanofiltration (NF) membranes by introducing reduced glutathione (GSH) in interfacial polymerization (IP) method. Fourier transform infrared spectroscopy (ATR-FTIR), X-ray photoelectron spectrometry (XPS), scanning electron microscope (SEM), atomic force microscopy (AFM), zeta potential and static water contact angle measurement were employed to characterize the chemical composition, morphology, electronegativity and hydrophilicity of the NF membranes. The water flux of GSH/PIP-TMC NF membrane reached $32.00L\;m^{-2}h^{-1}$ at 0.2 MPa, which was approximately twice than that of pristine PIP-TMC NF membrane when the ratio of GHS to piperazidine (PIP) was 40% during IP process. More water channels were built as GSH was embedded into PA layer. The fabricated NF membranes also took on potent rejection for dyes and $Na_2SO_4$. This study presents a simple and facile method to simulate water channels-based biological materials which may find potential application in water treatment.

• Advances in materials Research
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• 제11권3호
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• pp.171-190
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• 2022

In this paper, the problem of interfacial stresses in steel cantilever beams strengthened with bonded composite laminates is analyzed using linear elastic theory. The analysis is based on the deformation compatibility approach, where both the shear and normal stresses are assumed to be invariant across the adhesive layer thickness. The original study in this paper carried out an analytical solution to estimate shear and peel-off stresses, as, interfacial stress analysis concentration under the uniformly distributed load and shear lag deformation. The theoretical prediction is compared with authors solutions from numerous researches. This phenomenon of deformation of the members, which gives probably approach on the study of interface of the reinforced structures, is called "shear lag effect". The resolution in this paper shows that the shear stress and the normal stress are significant and, are concentrated at the end of the composite plate of reinforcement, called "edge effect". A parametric study is carried out to show the effects of the variables of design and the physical properties of materials. This research is helpful for the understanding on mechanical behaviour of the interface and design of such structures.

• 대한용접접합학회:학술대회논문집
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• 대한용접접합학회 2006년도 춘계 학술대회 개요집
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• pp.33-35
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• 2006

The interactions between Cu/Sn-Ag-(Cu) and Sn-Ag-(Cu)/Ni interfacial reactions were studied during isothermal aging at $150^{\circ}C$ for up to 1000h using Cu(ENIG)/Sn-3.5Ag-(0.7Cu)/Cu(ENIG) sandwich solder joints. A typical scallop-type Cu-Sn intermetallic compound (IMC) layer formed at the upper Sn-Ag/Cu interface after reflowing, whereas a $(Cu,Ni)_6Sn_5$ IMC layer was observed at the Sn-Ag/ENIG interface. The Cu in the $(Cu,Ni)_6Sn_5$ IMC layer formed on the Ni side was sourced from the dissolution of the opposite Cu metal pad or Cu-Sn IMC layer. When the dissolved Cu arrived at the interface of the Ni pad, the $(Cu,Ni)_6Sn_5$ IMC layer formed on the Ni interface, preventing the Ni pad from reacting with the solder. Although a long isothermal aging treatment was performed at $150^{\circ}C$, no Ni was detected in the Cu-Sn IMC layer formed on the Cu side. Compared to the single Sn-Ag/ENIG solder joint, the formation of the $(Cu,Ni)_6Sn_5$ IMC layer of the Cu/sn-Ag/ENIG sandwich joint effectively retarded the Ni consumption from the electroless Ni-P layer.

• 한국재료학회지
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• 제10권10호
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• pp.684-690
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• 2000

Metal-Ferroelectric-Metal(MFM) 구조의 개퍼시터에서 $Pb(Zr,Ti)O_3(PZT)$-전극 계면층이 PZT 박막 특성에 기여하는 영향을 알아보기 위하여 Pt/PZT/계면층/Pt/$TiO_2/SiO_2$/Si 구조의 캐퍼시터를 제작하였다. 계면층으로 사용될 물질들 중에서 $PbTiO_3(PT)$ 층을 sol-gel 방법으로 형성하였으며, PbO, $ZrO_2,\;TiO_2$ 층들을 reactive sputtering 방법으로 형성하였다. PZT박막을 구성하는 원소들로 이루어진 단순 산화물들의 특성을 평가하기 위하여 PbO, $ZrO_2,\;TiO_2$를 계면층으로 사용하여 $600^{\circ}C$에서 열처리를 실시하였고, 이 경우에는 $TiO_2$가 가장 우수하게 PZT의 결정립 크기를 미세하게 하는 효과를 보였으나, 두께가 증가함에 따라 표면 거칠기가 증가하고 anatase 상으로 남기 때문에 강유전특성이 열화되었다. 반면에 PT 박막을 계면층으로 사용한 경우에는 결정립 크기의 감소와 더불어 전기적인 특성도 향상되었다. 또한 PZT의 핵생성 위치를 판단하기 위하여 PT 삽입층의 위치를 변화하며, 실험한 결과, 하부전극과 PZT 박막의 계면에 PT 삽입층을 형성하였을 경우에 가장 효과적인 seed로서의 역할을 하였다.