• Title/Summary/Keyword: Interface-type

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Effect of Transverse Reinforcement on the Shear Friction Capacity of Concrete Interfaces with Construction Joint (시공줄눈이 있는 콘크리트 경계면의 전단마찰 내력에 대한 보강철근의 영향)

  • Hwnag, Yong-Ha;Yang, Keun-Hyeok
    • Journal of the Korea Concrete Institute
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    • v.28 no.5
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    • pp.555-562
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    • 2016
  • The objective of the present study is to evaluate the shear transfer capacity of transverse reinforcement at the concrete interfaces with smooth construction joint. The transverse reinforcing bars were classified into two groups: V-type for the arrangement perpendicular to the interface and X-type for inclined-crossing arrangement. The transverse reinforcement ratio at the interface varied from 0.0045 to 0.0135 for V-type and 0.0064 to 0.0045 for X-type. The mechanism analysis proposed for monolithic concrete interface, derived based on the upper-bound theorem of concrete plasticity, was modified to evaluate the shear friction capacity of concrete interfaces with smooth construction joint. Test results showed that the specimens with X-type reinforcement had lower amount of relative slippage at the interface and higher shear friction capacity than the companion specimens with V-type reinforcement. This observation was independent of the unit weight of concrete. The mean and standard deviation of the ratios between the experimental shear friction strength of smooth construction joints and predictions obtained from the proposed model are 1.07 and 0.14, respectively.

THREE DIMENSIONAL FINITE ELEMENT ANALYSIS ON THE MINIMUM CONTACT FRACTION OF BONE-IMPLANT INTERFACE (골조직과 임플랜트 계면의 최소접촉분율에 관한 삼차원 유한요소분석적 연구)

  • Jang, Kyoung-Soo;Kim, Yung-Soo;Kim, Chang-Whe
    • The Journal of Korean Academy of Prosthodontics
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    • v.35 no.4
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    • pp.627-646
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    • 1997
  • In order to find the degree of osseointegration at bone-implant interface of clinically successful implants, models including the 3.75mm wide, 10mm long screw type $Br{\aa}nemark$ implant as a standard and cylinder, 15mm long, 5.0mm wide, two splinted implants, and implants installed in various cancellous bone density were designed. Also, the amount of load and material of prostheses were changed. The stress and minimum contact fraction were analyzed on each model using three-dimensional finite element method(I-DEAS and ABAQUS version 5.5). The results of this study were as follows. 1. 10mm long, 3.75mm diameter-screw type implant had $36.5{\sim}43.7%$ of minimum contact fraction. 2. Cylinder type implant showed inferior stress distribution and higher minimum contact fraction than screw type. 3. As implant length was increased, minimum contact fraction was increased a little, however, maximum principal stress was decreased. 4. Implants with a large diameter had lower stress value with slightly higher minimum contact fraction than standard screw type. 5. Two splinted implants showed no change of minimum contact fraction. 6. The higher bone density, the lower stress value. 7. The material of occlusal surface had no effect on the stress of the bone-implant interface.

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An Analysis of Tree Growth in the XLPE Interface (가교폴리에틸렌 계면에서의 트리성장 분석)

  • Kim, Cheol-Woon;Park, Hyun-Bin;Kim, Tae-Sung;Lee, Joon-Ung
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.11 no.2
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    • pp.90-94
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    • 1998
  • This study aims at analyzing to treeing in the solid-solid interface which is insulation type of cable junction parts, the proceeding of tree-growth and electrical breakdown were research in the study. Interface was made artificially to detect how it influenced the insulating ability of the whole system, the specimen were XLPE generally used in cable. The interface conditions were divided into two parts. First condition being the one focused on the surface of interface, it was treated with sand paper (#80, #600, #1200). For the second condition, the pressure of interface was varied as the value of 1, 5, 10 [$kg/cm^2$]. Using above conditions, treeing and breakdown properties on tree-growth were respectively compared in details. As a result, breakdown time was shorter for the full range of supplied voltage in the case of interface existed in the joint than non-existed interface. In the case of existed interface, the interface which had high-interface pressure and painted with silicon insulating oil was the best in the aspect of breakdown characteristics.

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피지컬 인터페이스의 구현에 관한 연구

  • 오병근
    • Archives of design research
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    • v.16 no.2
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    • pp.131-140
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    • 2003
  • The input for computer interaction design is very limited for the users to control the interface by only using keyboard and mouse. However, using the basic electrical engineering, the input design can be different from the existing method. Interactive art using computer technology is recently emersed, which is completed by people's participation. The electric signal transmitted in digital and analogue type from the interface controled by people to the computer can be used in multimedia interaction design. The electric circuit design will be necessary to transmit very safe electric signal from the interface. Electric switch, sensor, and camera technologies can be applied to input interface design, which would be alternative physical interaction without computer keyboard and mouse. This type of interaction design using human's body language and gesture would convey the richness of humanity.

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A Study on the Effect of Topside and Interface on Hull in Whole Ship Analysis of Ship Type Offshore Structure (Ship Type 해양 구조물 전선 해석 시 Topside와 Interface가 Hull에 미치는 영향 연구)

  • Seo, Joon-Gyu;Kang, Ho-Yun;Park, Jung-Ki
    • Journal of the Society of Naval Architects of Korea
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    • v.58 no.5
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    • pp.314-321
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    • 2021
  • In the existing whole ship analysis, topside was modeled as mass element. However recently, the topside is modeled as beam element due to the owner's requirement to improve the maturity of the whole ship FE model. To follow the owner'srequirement, detailed information for topside drawing and modeling, which may delay analysis schedule, is needed. However, it is hard to respond effectively to this matter due to the lack of study on the topside from the hull perspective. Therefore in this study, the effect of the topside on the hull is investigated when the topside is modeled as a mass element or beam element respectively. In addition, the interface modeling method is analyzed to verify modeling method used in the existing whole ship analysis. The results indicate that the interface and topside modeling method used in existing whole ship analysis are appropriate. This conclusion will be the technical basis for responding to owner's requirement about the topside modeling method.

Dynamic Interface Crack Propagating Along a Line Between Two Holes

  • Lee, Ouk-Sub;Park, Jae-Chul;Yin, Hai-Long;Byun, Kwi-Hwan
    • Journal of Mechanical Science and Technology
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    • v.15 no.2
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    • pp.172-179
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    • 2001
  • The effects of the interface and two holes located near the crack path in the hybrid specimen on the dynamic crack propagation behavior have been investigated using dynamic photoelasticity with the aid of Cranz-Shardin type high speed camera system. The dynamic stress field around the dynamically propagating interface crack tip in the three point bending specimens under a dynamic load applied by a hammer dropped from 0.6m high without initial velocity are recorded. The complex stress intensity factors for the dynamically propagating interface crack are extracted by using a overdeterministic least square method. Theoretical dynamic interface isochromatic fringe loops generated by using the numerically determined complex stress intensity factors are compared with the experimental results. Furthermore, the influence of the hole to the dynamic interface crack velocities has been investigated experimentally.

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Magnetic Sensitivity Improvement of 2-Dimensional Silicon Vertical Hall Device (2 차원 Si 종형 Hall 소자의 자기감도 개선)

  • Ryu, Ji-Goo
    • Journal of Sensor Science and Technology
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    • v.23 no.6
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    • pp.392-396
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    • 2014
  • The 2-dimensional silicon vertical Hall devices, which are sensitive to X,Y components of the magnetic field parallel to the surface of the chip, are fabricated using a modified bipolar process. It consists of the thin p-layer at Si-$SiO_2$ interface and n-epi layer to improve the sensitivity and influence of interface effect. Experimental samples are a sensor type K with and type J without $p^+$ isolation dam adjacent to the center current electrode. The results for both type show a more high sensitivity than the former's 2-dimensional vertical Hall devices and a good linearity. The measured non-linearity is about 0.8%. The sensitivity of type J and type K are about 66 V/AT and 200 V/AT, respectively. This sensor's behavior can be explained by the similar J-FET model.

Magnetic Sensitivity Improvement of Silicon Vertical Hall Device (Si 종형 Hall 소자의 자기감도 개선)

  • Ryu, Ji-Goo;Kim, Nam-Ho;Chung, Su-Tae
    • Journal of Sensor Science and Technology
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    • v.20 no.4
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    • pp.260-265
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    • 2011
  • The silicon vertical hall devices are fabricated using a modified bipolar process. It consists of the thin p-layer at Si-$SiO_2$, interface and n-epi layer without $n^+$buried layer to improve the sensitivity and influence of interface effects. Experimental samples are a sensor type I with and type H without p+isolation dam adjacent to the center current electrode. The experimental results for both type show a more high current-related sensitivity than the former's vertical hall devices. The sensitivity of type H and type I are about 150 V/AT and 340 V/AT, respectively. This sensor's behavior can be explained by the similar J-FET model.

Effect of p-type a-SiO:H buffer layer at the interface of TCO and p-type layer in hydrogenated amorphous silicon solar cells

  • Kim, Youngkuk;Iftiquar, S.M.;Park, Jinjoo;Lee, Jeongchul;Yi, Junsin
    • Journal of Ceramic Processing Research
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    • v.13 no.spc2
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    • pp.336-340
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    • 2012
  • Wide band gap p-type hydrogenated amorphous silicon oxide (a-SiO:H) buffer layer has been used at the interface of transparent conductive oxide (TCO) and hydrogenated amorphous silicon (a-Si:H) p-type layer of a p-i-n type a-Si:H solar cell. Introduction of 5 nm thick buffer layer improves in blue response of the cell along with 0.5% enhancement of photovoltaic conversion efficiency (η). The cells with buffer layer show higher open circuit voltage (Voc), fill factor (FF), short circuit current density (Jsc) and improved blue response with respect to the cell without buffer layer.

Interface Study of the Intermediate Connectors in Tandem Organic Devices

  • Tang, Jian-Xin;Lee, Shuit-Tong
    • 한국정보디스플레이학회:학술대회논문집
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    • 2009.10a
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    • pp.225-228
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    • 2009
  • We have demonstrated several effective intermediate connectors in tandem organic light-emitting devices (OLEDs) using doped or nondoped organic p-n heterojunction. The influence of n-type or p-type organic layer in intermediate connectors on device performance has been investigated based on the understanding of interfacial electronic structures.

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