• Title/Summary/Keyword: Interface singularity

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Analysis of Stress Singularity for the Excess Adhesive of Interface in Adhesively Bonded Joint (접착이음의 계면덧살에 대한 응력특이성 해석)

  • Chung, Nam-Yong;Park, Cheol-Hee
    • Journal of the Korean Society of Manufacturing Technology Engineers
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    • v.21 no.3
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    • pp.439-445
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    • 2012
  • The stress singularity for the excess adhesive on interface of adhesively bonded joint was investigated by using the 2-dimensional elastic boundary element method (BEM). To establish a reasonable strength evaluation method and a fracture criterion for the excess adhesive of interface in adhesively bonded joint, it is necessary to evaluate fracture parameters with various bonding conditions. Under the variations of adhesively bonded thickness (h) and diameter (d) for the excess adhesive, a stress analysis was performed, and from the results, the stress singularity index (${\lambda}$) and the stress singularity factor (${\Gamma}$) were calculated. The variations have a great influences on the stress singularity for the excess adhesive of interface in adhesively bonded joint, and the ${\Gamma}$ is reduced as the "h" and "d" increase.

Analysis of Stress Singularities on Interfaces of Friction Welded Dissimilar Materials (마찰용접에 의한 이종재 접합계면에 대한 응력특이성의 해석)

  • Chung, Nam-Yong;Park, Chul-Hee
    • Transactions of the Korean Society of Automotive Engineers
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    • v.13 no.2
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    • pp.142-148
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    • 2005
  • In this paper, the stress singularity on interface of friction welded dissimilar materials was investigated by using 2-dimensional elastic boundary element method. It is required that stress distributions and stress singularities on an interface for friction welded dissimilar materials analize to establish strength evaluation. The stress singularity index ($\lambda$) and stress singularity factor ($\Gamma$) were calculated from the results of stress analysis. The stress singularities on variations for shapes and thickness of friction welded flashes were analized and discussed. This paper suggested that the strength evalution by using the stress singularity factors as fracture parameters, considering the stress singularity on an interface edge of friction welded dissimilar materials were very useful.

Prediction Fracture Strength on Adhesively Bonded scarf Joints in Dissimilar Materials (이종재료의 경사접착이음에 대한 파괴강도의 예측)

  • 정남용
    • Journal of the Korean Society of Manufacturing Technology Engineers
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    • v.4 no.4
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    • pp.50-60
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    • 1995
  • Recently advantages joining dissimiliar materials and light weight material techniques have led to increasing use of structural adhesives in the various industries. Stress singulartiy occurs at the interface edges of adhesively bonded dissimilar materials. So it is required to analyze its stress singularity at the interface edges of adhesively bonded joints indissimilar materials. In this paper, the analysis method of stress singularity is studied in detail. Also, effects of the stress singularity at the interface edge of adhesively bonded scarf joints in combinations of dissimilar materials are investigated by using 2-dimensional elastic program of boundary element method. As the results, the strength evaluation method of adhesively bonded dissimilar materials using the stress singularity factor, $\Gamma$,is very useful. The fracture criterion, method of strength evaluation and prediction of fracture strength by the stress singularity factor on the adhesively bonded dissimilar materials are proposed.

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Strength Evaluation of Bonded Dissimilar Materials by Using Stress Singularity Factor (응력특이성계수에 의한 이종 접합재료의 강도평가)

  • Jeong, Nam-Yong;O, Bong-Taek
    • Transactions of the Korean Society of Mechanical Engineers A
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    • v.20 no.7
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    • pp.2087-2096
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    • 1996
  • Recentrly advantages in composite and light weight material techniques have led to the increased use of bonded dissimilar materials such as ceramics/metal bonded joints, IC package, brazing, coating and soldering in the various industries. It is required to analyze the evaluation method of fracture strength and design methodology of bonded joints in dissimilar materials. Stress singularity according to changes of scarf angles for bonded scarf joints in dissimilar materials was investigated by the boundary element method and static experiments. In this paper, effect of the stress singularity factors at the interface edges of scarf joints on various dissmilar materials combinations were investigated by analysis of its stress and stress singularity index using 2-dimensional elastic program of boundary element method. And the variations of stress singularity index by changes for Young's modulus ratios of materials and scarf angles were investigated. Also, it is found that stress singularities at bonded interface edges are disappeared for certain combination of scarf angle in a pair of bonded dissimilar materials. As the results, it is proposed that the strength evaluation by using stress singularity factors, $\Gamma$, considering stress singularity at the interface edges of bonded dissimilar materials, is very useful.

Analysis of Moisture Stresses Induced in Polymeric Thin Film (고분자 박막에서 발생하는 수분응력 해석)

  • 이상순
    • Proceedings of the International Microelectronics And Packaging Society Conference
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    • 2002.11a
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    • pp.137-142
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    • 2002
  • This paper deals with the stress singularity induced at the interface corner between the elastic substrate and the viscoelastic thin film as the polymeric film absorbs moisture from the ambient environment. The boundary element method is employed to investigate the behavior of Interface stresses. The order of the singularity is obtained numerically for a given viscoelastic model. It is shown that the stress singularity factor is relaxed with time, while the order of the singularity increases with time for the viscoelastic model considered.

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Evaluation Method of Bonded Strength Considering Stress Singularity in Adhesively Bonded Joints (응력특이성을 고려한 접착이음의 강도평가 방법)

  • 정남용
    • Journal of the Korean Society of Manufacturing Technology Engineers
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    • v.7 no.1
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    • pp.58-68
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    • 1998
  • Advantages of adhesively bonded joints and techniques of weight reduction have led to increasing use of structural adhesives such as LSI(large scale integration) package, automobile, aircraft in the various industries. In spite of such wide applications of adhesively bonded joints, the evaluation method of bonding strength has not been established. Stress singularity occurs at the interface edges of adhesively bonded joints and it is required to analyze it. In this paper, the stress singularity using 2-dimensional elastic boundary element method (BEM) with the changes of the lap length and adhesive for single lap joint was analyzed, and experiments of strength evaluation were carried out. As the results, the evaluating method of bonding strength considering stress singularity at interface edges of adhesively bonded joints and stress intensity factor of interface crack have been proposed in static and fatigue test.

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Analysis of Stresses Induced in a Polymer Coating Layer due to Temperature Change (온도변화에 대한 고분자 코팅 층에 발생하는 응력 해석)

  • 박명규;이상순;서창민
    • Journal of Ocean Engineering and Technology
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    • v.17 no.6
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    • pp.72-76
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    • 2003
  • This paper deals with the stress singularity developed in a polymer layer that is coated to a concrete surface, due to temperature change. The boundary element method is employed to investigate the behavior of interface stresses. The polymeric layer is assumed to be a linear viscoelastic material, and is thermorheologically simple. The order of the singularity is obtained, numerically, for a given viscoelastic model. Numerical results exhibit the relaxation of interface stresses, and large gradients are observed in the vicinity of the free surface. Results show that the stress singularity factor is relaxed with time, while the order of the singularity increases with time for the viscoelastic model.

Boundary Element Analysis of Interface Stresses in a Thin Film Due to Moisture Absorption (수분 흡수로 인해 얇은 필름에 발생하는 계면 응력의 경계요소해석)

  • 이상순
    • Proceedings of the Computational Structural Engineering Institute Conference
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    • 1999.04a
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    • pp.19-26
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    • 1999
  • This paper deals with the stress singularity induced at the interface corner between the viscoelastic thin film and the rigid substrate as the film absorbs moisture from the ambient environment. The rime-domain boundary element method is employed to investigate the behavior of interface stresses. The order of the free-edge singularity is obtained numerically for a given viscoelastic model. It is shown that the free-edge stress intensity factor is relaxed with time,'while the order of the singularity increases with time for the viscoelastic model considered.

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Analysis of Thermal Stresses Developed in Bonding Interface of Semiconductor Chip (반도체 칩의 접착계면에 발생하는 열응력 해석)

  • 이상순
    • Proceedings of the Computational Structural Engineering Institute Conference
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    • 1999.10a
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    • pp.437-443
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    • 1999
  • This paper deals with the stress singularity induced at the interface corner between the viscoelastic thin film and the rigid substrate subjected to uniform temperature change. The viscoelastic film has been assumed to be thermorheologically simple. The time-domain boundary element method(BEM) has been employed to investigate the behavior of interface stresses. The order of the free-edge singularity has been obtained numerically for a given viscoelastic model. It is shown that the free-edge stress intensity factor is relaxed with time, while the order of the singularity increases with time for the viscoelastic model considered.

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Viscoelastic Stress Analysis of Polymeric Thin Layer Under Moisture Absorption (수분 흡수로 인해 고분자 박막에서 발생하는 점탄성 응력 해석)

  • 이상순;장영철
    • Journal of the Microelectronics and Packaging Society
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    • v.10 no.1
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    • pp.25-29
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    • 2003
  • This paper deals with the stress singularity induced at the interface corner between the elastic substrate and the viscoelastic thin film as the polymeric film absorbs moisture from the ambient environment. The boundary element method is employed to investigate the behavior of interface stresses. The order of the singularity is obtained numerically for a given viscoelastic model. It is shown that the stress singularity factor is relaxed with time, while the order of the singularity increases with time for the viscoelastic model considered.

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