• International Journal of Highway Engineering
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• v.17 no.3
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• pp.77-83
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• 2015

PURPOSES : In this study, a fracture-based finite element (FE) model is proposed to evaluate the fracture behavior of fiber-reinforced asphalt (FRA) concrete under various interface conditions. METHODS : A fracture-based FE model was developed to simulate a double-edge notched tension (DENT) test. A cohesive zone model (CZM) and linear viscoelastic model were implemented to model the fracture behavior and viscous behavior of the FRA concrete, respectively. Three models were developed to characterize the behavior of interfacial bonding between the fiber reinforcement and surrounding materials. In the first model, the fracture property of the asphalt concrete was modified to study the effect of fiber reinforcement. In the second model, spring elements were used to simulated the fiber reinforcement. In the third method, bar and spring elements, based on a nonlinear bond-slip model, were used to simulate the fiber reinforcement and interfacial bonding conditions. The performance of the FRA in resisting crack development under various interfacial conditions was evaluated. RESULTS : The elastic modulus of the fibers was not sensitive to the behavior of the FRA in the DENT test before crack initiation. After crack development, the fracture resistance of the FRA was found to have enhanced considerably as the elastic modulus of the fibers increased from 450 MPa to 900 MPa. When the adhesion between the fibers and asphalt concrete was sufficiently high, the fiber reinforcement was effective. It means that the interfacial bonding conditions affect the fracture resistance of the FRA significantly. CONCLUSIONS : The bar/spring element models were more effective in representing the local behavior of the fibers and interfacial bonding than the fracture energy approach. The reinforcement effect is more significant after crack initiation, as the fibers can be pulled out sufficiently. Both the elastic modulus of the fiber reinforcement and the interfacial bonding were significant in controlling crack development in the FRA.

• Composites Research
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• v.16 no.5
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• pp.45-53
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• 2003

The experimental and numerical investigations on the failure characteristics of the secondary bonded composite single-lap joints were performed. The initiations and growths of cracks were observed using CCD camera and acoustic emission sensor during the tension tests of the joint specimens. The structural behaviors of the specimens were predicted by the geometric nonlinear two-dimensional finite element analysis. The three types of observed initial cracks were included in each finite element models and the strain energy release rates of each specimen models were calculated by VCCT(Virtual Crack Closure Technique) technique. The tension tests showed that the initial cracks occurred in the 60∼90% of final failure loads and the major failure modes of the specimens were adhesive failure and the delamination between the 1st and 2nd ply of laminate. The specimens with the thicker bondline had earlier crack initiation loads but higher crack propagation resistance and eventually better loading capability. The delaminations were mostly observed in the thicker bondline specimens. The mode I values of calculated strain energy release rates were higher than the mode II values in the all specimen models considering the three types of initial cracks. The mode I and total strain energy release rates were calculated as higher values in the order of initial crack in the edge interface, comer interface and delamination between the plies of laminate.

• Journal of Welding and Joining
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• v.17 no.1
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• pp.124-132
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• 1999

Thermal fatigue strength of the solder joints is the most critical issue for TSOP(Thin Small Outline Package) because the leads of this package are extremely short and thermal deformation cannot be absorbed by the deflection of the lead. And the TSOP body can be subject to early fatigue failures in thermal cycle environments. This paper was discussed distribution of thermal stresses at near the joint between silicon chip and die pad and investigated their reliability of solder joints of TSOP with 42 alloy clad lead frame on printed circuit board through FEM and 3 different thermal cycling tests. It has been found that the stress concentration around the encapsulated edge structure for internal crack between the silicon chip and Cu alloy die pad. And using 42 alloy clad, The reliability of TSOP body was improved. In case of using 42 alloy clad die pad(t=0.03mm). $$\sigma$_{VMmax}$ is 69Mpa. It is showed that 15% improvement of the strength in the TSOP body in comparison with using Cu alloy die pad $($\sigma$_{VMmax}$=81MPa). In solder joint of TSOP, the maximum equivalent plastic strain and Von Mises stress concentrate on the heel of solder fillet and crack was initiated in it's region and propagated through the interface between lead and solder. Finally, the modified Manson-Coffin equation and relationship of the ratio of $N_{f}$ to nest(η) and cumulative fracture probability(f) with respect to the deviations of the 50% fracture probability life $(N_{f 50%})$ were achieved.

• Structural Engineering and Mechanics
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• v.63 no.3
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• pp.361-370
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• 2017

Through the use of finite element analysis and acoustic emission techniques we have evaluated the interfacial failure of a carbon fiber reinforced polymer (CFRP) repair patch on a notched aluminum substrate. The repair of cracks is a very common and widely used practice in the aeronautics field to extend the life of cracked sheet metal panels. The process consists of adhesively bonding a patch that encompasses the notched site to provide additional strength, thereby increasing life and avoiding costly replacements. The mechanical strength of the bonded joint relies mainly on the bonding of the adhesive to the plate and patch stiffness. Stress concentrations at crack tips promote disbonding of the composite patch from the substrate, consequently reducing the bonded area, which makes this a critical aspect of repair effectiveness. In this paper we examine patch disbonding by calculating the influence of notch tip stress on disbond area and verify computational results with acoustic emission (AE) measurements obtained from specimens subjected to uniaxial tension. The FE results showed that disbonding first occurs between the patch and the substrate close to free edge of the patch followed by failure around the tip of the notch, both highest stress regions. Experimental results revealed that cement adhesion at the aluminum interface was the limiting factor in patch performance. The patch did not appear to strengthen the aluminum substrate when measured by stress-strain due to early stage disbonding. Analysis of the AE signals provided insight to the disbond locations and progression at the metal-adhesive interface. Crack growth from the notch in the aluminum was not observed until the stress reached a critical level, an instant before final fracture, which was unaffected by the patch due to early stage disbonding. The FE model was further utilized to study the effects of patch fiber orientation and increased adhesive strength. The model revealed that the effectiveness of patch repairs is strongly dependent upon the combined interactions of adhesive bond strength and fiber orientation.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.26 no.5
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• pp.835-842
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• 2002

In this paper, static and fatigue bending strengths and failure mechanisms of CFRP (carbon fiber reinforced plastics) laminates having impact damages have been evaluated. Composite laminates used for this experiment are CF/EPOXY orthotropy laminated plates, which have two-interfaces $[0^0_ 4/90^0_4]_{ sym}$. A steel ball launched by the air gun collides against CFRP laminates to generate impact damages. The damage growth during bending fatigue test is observed by the scanning acoustic microscope (SAM) and also, the fracture surfaces were observed by using the SEM (scanning electron microscope). In the case of impacted-side compression, fracture is propagated from the transverse crack generated near impact point. On the other hand, fracture is developed toward the impact point from the edge of interface-B delamination in the case of impacted-side tension. Eventually, failure mechanisms have been confirmed based on the observed delamination areas and fracture surfaces.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.20 no.6
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• pp.1836-1842
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• 1996

In this paper, static and fatigue bending strengths of CFRP(carbon fiber reinforced plastic laminates having impact damage(FOD) are evaluated. Composite laminates used for this experiment are CF/EPOXY and CF/PEEK orthotropy laminated plates, which have two-interfaces[${0^0}_4{90^0}_4}$]$_sym$. A steel ball launched by the air gun colides against CFRP laminates to generate impact damages. The damage growth during bending fatigue test is observed by the scanning acoustic microscope(SAM). When the impacted side is compressed, the residual fatigue bending strength of CF/PEEK specimen P is greater that that of CF/EPOXY SPECIMEN B. On the other hand, when the impacted side is in tension, the residual fatigue bending strength of CF/PEEK speicemen P is smaller than that of CF/EPOXY specimen B. In the case of impacted-side compression, fracture is proposed from the transverse crack generated near impact point. On the other hand, fracture is developed toward the impact point from the edge of interface-b delamination in the case of impacted-side tension.

• Smart Structures and Systems
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• v.19 no.2
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• pp.163-179
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• 2017

The axisymmetric buckling delamination of the Piezoelectric/Metal/Piezoelectric (PZT/Metal/PZT) sandwich circular plate with interface penny-shaped cracks is investigated. The case is considered where open-circuit conditions with respect to the electrical displacement on the upper and lower surfaces, and short-circuit conditions with respect to the electrical potential on the lateral surface of the face layers are satisfied. It is assumed that the edge surfaces of the cracks have an infinitesimal rotationally symmetric initial imperfection and the development of this imperfection with rotationally symmetric compressive forces acting on the lateral surface of the plate is studied by employing the exact geometrically non-linear field equations and relations of electro-elasticity for piezoelectric materials. The sought values are presented in the power series form with respect to the small parameter which characterizes the degree of the initial imperfection. The zeroth and first approximations are used for investigation of stability loss and buckling delamination problems. It is established that the equations and relations related to the first approximation coincide with the corresponding ones of the three-dimensional linearized theory of stability of electro-elasticity for piezoelectric materials. The quantities related to the zeroth approximation are determined analytically, however the quantities related to the first approximation are determined numerically by employing Finite Element Method (FEM). Numerical results on the critical radial stresses acting in the layers of the plate are presented and discussed. In particular, it is established that the piezoelectricity of the face layer material causes an increase (a decrease) in the values of the critical compressive stress acting in the face (core) layer.

• Transactions of the Korean Society of Mechanical Engineers
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• v.17 no.11
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• pp.2752-2761
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• 1993

The purpose of this study is to confirm the decreasing problems of residual bending strength, and the fracture machanism experimentally when CFRP composite laminates are subjected to Foreign Object Damage. Composite laminates used for this experiment are CFRP orthotropy laminated plates, which have two-interfaces [O/sub 6//sup o//90/sub 6//sup o/]sub sym/ and four-interfaces [O/sub 3//sup o//90/sub 6//sup o//O/sub 3//sup o]/sub sym/. When the specimen is subjected to transverse impact by a steel ball, the delamination area generated by impact damage is observed by using SAM(Scanning Acoustic Microscope). also, Thefracture surfaces obtained by three-point bending test were observed by using SEM (Scanning Electron Microscope). Then, fracture mechanism was investigated based on the observed delamination area and fracture surface. The results were summarized as follows; (1) It is found that for the specimen with more interface, the critical delamination energy is increased while delamination-development energy is decreased. (2) Residual bending strength of specimen A is greater than that of Specimen B within the impact range of impact energy 1. 65J (impacted-side compression) and 1. 45J (impacted-side tension). On the other hand, when the impact energy is beyond the above ranges, residual bending strength of specimen A is smaller than that of specimen B. (3) In specimen A and B, residual strength of CFRP plates subjected to impact damage is lower in the impacted-side compression than in the impacted-side tension. (4) In the case of impacted-side compression, fracture is propagated from the transverse crack generat-ed near impact point. On the other hand, fracture is developed toward the impact point from the edge of interface-B delamination in the case of impacted-side tension.

• Journal of the Microelectronics and Packaging Society
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• v.17 no.1
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• pp.69-73
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• 2010

Finite-element analyses were conducted to investigate the thermal stress in 3-dimensional stacked wafers package containing through-silicon-via (TSV), which is being widely used for 3-Dimensional integration. With finite element method (FEM), thermal stress was analyzed with the variation of TSV diameter, bonding diameter, pitch and TSV height. It was revealed that the maximum von Mises stresses occurred at the edge of top interface between Cu TSV and Si and the Si to Si bonding site. As TSV diameter increased, the von Mises stress at the edge of TSV increased. As bonding diameter increased, the von Mises stress at Si to Si bonding site increased. As pitch increased, the von Mises stress at Si to Si bonding site increased. The TSV height did not affect the von Mises stress. Therefore, it is expected that smaller Cu TSV diameter and pitch will ensure mechanical reliability because of the smaller chance of plastic deformation and crack initiation.

• Proceedings of the Korea Association of Crystal Growth Conference
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• 1996.06a
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• pp.258-292
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• 1996

In the last year great interest appears to YBCO thin films preparation on different substrate materials. Preparation of epitaxial film is a very difficult problem. There are many requirements to substrate materials that must be fullfilled. Main problems are lattice mismatch (misfit) and similarity of structure. From paper [1] or follows that difference in interatomic distances and angles of substrate and film is mire important problem than similarity of structure. In this work we present interatomic distances and angle relations between substrate materials belonging to ABCO4 group (where A-Sr or Ca, B-rare earth element, C-Al or Ga) of different orientations and YBCO thin films. There are many materials used as substrates for HTsC thin films. ABCO4 group of compounds is characterized by small dielectric constants (it is necessary for microwave applications of HTsC films), absence of twins and small misfit [2]. There most interesting compounds CaNdAlO4, SrLaAlO4 and SrLaGaO4 were investigated. All these compounds are of pseudo-perovskite structure with space group 14/mmm. This structure is very similar to structure of YBCO. SLG substrate has the lowest misfit (0.3%) and dielectric constant. For preparation of then films of substrates of this group of compound plane of <100> orientation are mainly used. Good quality films of <001> orientations are obtained [3]. In this case not only a-a misfit play role, but c-3b misfit is very important too. Sometimes, for preparation of thin films substrates of <001> and <110> orientations were manufactured [3]. Different misfits for different YBCO faces have been analyzed. It has been found that the mismatching factor for (100) face is very similar to that for (001) face so there is possibility of preparation of thin films on both orientations. SrLaAlO4(SLA) and SrLaGaO4(SLG) crystals of general formula ABCO4 have been grown by the Czochralski method. The quality of SLA and SLG crystals strongly depends on axial gradient of temperature and growth and rotation rates. High quality crystals were obtained at axial gradient of temperature near crystal-melt interface lower than 50℃/cm, growth rate 1-3 mm/h and the rotation rate changing from 10-20pm[4]. Strong anisotropy in morphology of SLA and SLG single crystals grown by the Czochralski method is clearly visible. On the basics of our considerations for ABCO4 type of the tetragonal crystals there can appear {001}, {101}, and {110} faces for ionic type model [5]. Morphology of these crystals depend on ionic-covalent character of bonding and crystal growth parameters. Point defects are observed in crystals and they are reflected in color changes (colorless, yellow, green). Point defects are detected in directions perpendicular to oxide planes and are connected with instability of oxygen position in lattice. To investigate facets formations crystals were doped with Cr3+, Er3+, Pr3+, Ba2+. Chromium greater size ion which is substituted for Al3+ clearly induces faceting. There appear easy {110} faces and SLA crystals crack even then the amount of Cr is below 0.3at.% SLG single crystals are not so sensitive to the content of chromium ions. It was also found that if {110} face appears at the beginning of growth process the crystal changes its color on the plane {110} but it happens only on the shoulder part. The projection of {110} face has a great amount of oxygen positions which can be easy defected. Pure and doped SLA and SLG crystals measured by EPR in the<110> direction show more intensive lines than in other directions which allows to suggest that the amount of oxygen defects on the {110} plane is higher. In order to find the origin of colors and their relation with the crystal stability, a set of SLA and SLG crystals were investigated using optical spectroscopy. The colored samples exhibit an absorption band stretching from the UV absorption edge of the crystal, from about 240 nm to about 550 m. In the case of colorless sample, the absorption spectrum consists of a relatively weak band in the UV region. The spectral position and intensities of absorption bands of SLA are typical for imperfection similar to color centers which may be created in most of oxide crystals by UV and X-radiation. It is pointed out that crystal growth process of polycomponent oxide crystals by Czochralski method depends on the preparation of melt and its stoichiometry, orientation of seed, gradient of temperature at crystal-melt interface, parameters of growth (rotation and pulling rate) and control of red-ox atmosphere during seeding and growth (rotation and pulling rate) and control of red-ox atmosphere during seeding and growth. Growth parameters have an influence on the morphology of crystal-melt interface, type and concentration of defects.