• 제목/요약/키워드: Interface Edge Crack

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Stress intensity factors for an interface crack between an epoxy and aluminium composite plate

  • Itou, S.
    • Structural Engineering and Mechanics
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    • 제26권1호
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    • pp.99-109
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    • 2007
  • A cracked composite specimen, comprised of an epoxy and an aluminium plate, was fractured under a tensile load. In this paper, two crack configurations were investigated. The first was an artificial center crack positioned in the epoxy plate parallel to the material interface. The other was for two edge cracks in the epoxy plate, again, parallel to the interface. A tensile test was carried out by gradually increasing the applied load and it was verified that the cracks always moved suddenly in an outward direction from the interface. The d/a ratio was gradually reduced to zero, and it was confirmed that the maximum stress intensity factor value for the artificial center crack, $K_{{\theta}{\theta}}^{max}$, approached that of an artificial interface crack,$K_{{\theta}{\theta}}^{ifc\;max}$ (where: 2a is the crack length and d is the offset between the crack and interface). The same phenomenon was also verified for the edge cracks. Specifically, when the offset, d, was reduced to zero, the maximum stress intensity factor value, $K_{{\theta}{\theta}}^{max}$, approached that of an artificial interface edge crack.

에지계면균열을 갖는 단순겹치기 접착이음의 강도평가 (Analysis on the Bonded Single Lap-Joint Containing the Interface Edge Crack)

  • 유영철;박정환;이원
    • 한국정밀공학회지
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    • 제15권6호
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    • pp.159-166
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    • 1998
  • The problem of interface crack in the bonded structures has received a great deal of attention in recent years. In this paper the aluminum bonded single lap-joint containing the interface edge crack is investigated. The tensile load and the average shear stress of the adhesive joints which have different crack length are obtained from the static tensile tests. The critical value of crack length to provoke the interface fracture is determined to a/L=0.4, where a is the interface crack length and L is the adhesive lap-length. The fracture mechanical parameters are introduced to confirm the existence of the critical crack length. The compliance and the stress intensity factors are calculated using the displacement and the stress near the interface crack tip by the boundary element method. These numerical results support the experimental results that the critical value of a/L is 0.4. It is known that the compliance and the stress intensity factors are the efficient parameters to estimate the bonded single lap-joint containing the interface edge crack.

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이종 접합체의 원공에서 파생하는 균열에 대한 혼합모드 파괴기준의 설정 (Establishment of Fracture Criteria for Mixed Mode in Bonded Dissimilar Materials with an Crack Emanating from an Edge Semicircular Hole)

  • 정남용;송춘호
    • 대한기계학회논문집A
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    • 제25권6호
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    • pp.907-915
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    • 2001
  • Application of bonded dissimilar materials in many industries are increasing. When these materials are to be used in structures, it needs to evaluate the failure strength applying fracture mechanics. Al/Epoxy bonded dissimilar materials with an interface crack and an interface crack emanating from an edge semicircular hole were prepared, experiment of fracture toughness were carried out. Stress intensity factors of interface cracks in bonded dissimilar materials were computed with boundary element method(BEM) and the fracture criteria of mixed mode crack were analyzed. From the results, the fracture criteria and the method of strength evaluation by the fracture toughness in Al/Epoxy bonded dissimilar materials were proposed.

알루미늄 단순겹치기 접착이음의 에지계면균열에 대한 연구 (Analysis on the Interface Edge Crack in Aluminum Bonded Single Lap-joint)

  • 유영철;박정환;정의섭;이원
    • 한국정밀공학회:학술대회논문집
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    • 한국정밀공학회 1997년도 춘계학술대회 논문집
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    • pp.655-659
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    • 1997
  • The analysis of cracks at the interface between dissimilar materilar has received a great deal of attention in recent years. In this paper we conducted the static tensile test for the aluminum bonded single lap-joint with the interface edge crack. Comparing this results, that is ultimate load and strain value of aluminum adherend by strain gauge with the fracture mechanics parameters, compliance and stress intensity factors acquied from the boundary element analysis, we concluded that there are critical value of crack length to provoke the interface fracture.

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이종접합 계면균열의 파괴기준에 대한 원공의 영향 (Influence of Circular Hole for Fracture Criteria of Interface Crack in Bonded Dissimilar Materials)

  • 정남용
    • 한국공작기계학회:학술대회논문집
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    • 한국공작기계학회 1999년도 추계학술대회 논문집 - 한국공작기계학회
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    • pp.301-306
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    • 1999
  • Application of bonded dissimilar materials in various industries are increasing. When these materials are used in structures, it needs to investigate strength evaluation applying fracture mechanics. Al/Epoxy bonded dissimilar materials with an interface crack and an interface crack emanating from an edge semicircular hole were prepared for the static tests so that experiment of fracture toughness were carried out. Stress intensity factors of interface cracks in bonded dissimilar materials were computed with boundary element method(BEM) and the fracture criteria of mixed mode crack were analyzed. From the results, the fracture criteria and the method of strength evaluation by the fracture toughness in Al/ Epoxy bonded dissimilar materials were proposed.

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이종재료 접합재의 편측접합계면균열의 응력확대계수 해석 및 피로균열성장 해석 (Anaysis of the Interfacial Stress Intensity Factors and Fatigue Crack Growth Behaviour for the Edge Interface Crack in the Dissimilar Materials)

  • 이갑래;최용식
    • 한국안전학회지
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    • 제6권2호
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    • pp.5-13
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    • 1991
  • In this paper, the interfacial stress intensity factors( $K_{i}$$K_1$+i $K_2$) for the edge interface crack in the dissimilar materials(isotropic-isotropic materials, isotropic-composite materials) were analysed by BEM(Boundary Element Method). The fatigue crack growth behaviour was investigated by load constant fatigue test. From the experimental results, the relationship between da/dN and interfacial stress intensity facto, ( $K_{i}$ or $K_1$) can be expressed by Paris'law for homogeneous materials.s.s.

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단일방향 복합재료의 공유면에 존재하는 계면 모서리균열의 점탄성 해석 (Viscoelastic Analysis of Stress Intensity Factor for Interface Edge Crack in a Unidirectional Liminate)

  • 이상순;김범식
    • 전산구조공학
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    • 제10권1호
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    • pp.129-134
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    • 1997
  • 탄성 섬유와 점탄성 기지로 구성된 2차원의 단일방향 복합재료에서 발생하는 계면 응력 특이성을 시간영역 경계요소법을 사용하여 조사하였다. 먼저, 아무런 균열없이 섬유와 기지가 완전하게 결합되어 있는 단일방향 복합재료에 횡방향 인장변형이 작용할때 자유경계면 부근에 나타나는 계면 특이응력들을 조사하였다. 그러한 응력들은 섬유와 기지의 결합분리나 계면 모서리 균열을 야기 시킬수 있다. 다음에, 여러가지 크기의 모서리 균열들에 대한 응력확대계수가 계산되었다.

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이종 접합체에 대한 혼합모드 파기기준의 설정 (Establishment of fracture Criterion for Mixed Mode in Bonded Dissimilar Materials)

  • 정남용
    • 한국공작기계학회:학술대회논문집
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    • 한국공작기계학회 1998년도 추계학술대회 논문집
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    • pp.254-260
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    • 1998
  • Application of bonded dissimilar materials in various industries are increasing. When these materials are used in structures, it needs to investigate strength evolution applying fracture mechanics. Al/Epoxy bonded dissimilar materials with an interface crack and an interface crack emanating from an edge semicircular hole were prepared for the static tests so that experiment of fracture toughness were carried out. Stress intensity factors of interface cracks in bonded dissimilar materials were computed with boundary element method(BEM) and the fracture criterion of mixed mode crack were analyzed. From the results, the fracture criterion and the method of strength evolution by the fracture toughness in Al/Epoxy bonded dissimilar materials were proposed.

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반도체 칩 접착 계면에 존재하는 모서리 균열 거동에 대한 점탄성 해석 (Viscoelastic Analysis for Behavior of Edge Cracks at the Bonding Interface of Semiconductor Chip)

  • 이상순
    • 한국전산구조공학회논문집
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    • 제14권3호
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    • pp.309-315
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    • 2001
  • 탄성 반도체 칩과 점탄성 접착제층의 계면에 존재하는 모서리 균열에 대한 응력확대계수를 조사하였다. 이러한 균열들은 자유 경계면 부근에 존재하는 응력 특이성으로 인해 발생할 수 있다. 계면 응력상태를 해석하기 위해서 시간 영역 경계요소법이 사용되었다. 작은 크기의 모서리 균열에 대한 응력확대계수가 계산되었다. 점탄성 이완으로 인해 응력확대계수의 크기는 시간이 경과함에 따라 작아진다.

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반도체 칩 접착계면의 모서리 균열에 대한 경계요소 해석 (Boundary Element Analysis for Edge Cracks at the Bonding Interface of Semiconductor Chip)

  • 이상순
    • 마이크로전자및패키징학회지
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    • 제8권3호
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    • pp.25-30
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    • 2001
  • 반도체 칩과 얇은 접착제충의 계면에 존재하는 모서리 균열에 횡방향 인장변형률이 작용하는 경우에 대해 응력확대계수를 조사하고 있다. 이러한 균열들은 자유 경계면 부근에 존재하는 응력 특이성으로 인해 발생할 수 있다. 계면 응력상태를 해석하기 위해서 경계요소법이 사용되고 있다. 복합 응력확대계수의 크기는 균열의 크기에 의존하지만, 균열이 커지면 일정한 값에 수렴한다. 횡방향 인장변형률이 임계값에 도달하면, 계면 균열은 빠르게 전파되리라고 예상된다.

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