• Journal of Welding and Joining
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• v.30 no.2
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• pp.65-69
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• 2012

Environmental and health concerns over the lead have led to investigation of the alternative Pb-free solders to replace commonly used Pb-Sn solders in microelectronic packaging application. The leading candidates for lead-free solder alloys are presently the near eutectic Sn-Ag-Cu alloys. Therefore, extensive studies on reliability related with the composition have been reported. However, the insufficient drop property of the near eutectic Sn-Ag-Cu alloys has demanded solder compositions of low Ag content. In addition, the solder interconnections in automobile applications like a smart box require significantly improved vibration resistance. Therefore, this study investigated the effect of alloying elements (Ag, Bi, In) on the vibration fatigue strength. The vibration fatigue was conducted in 10~1000Hz frequency and 20Grms. The interface of the as-soldered cross section close to the Cu pad indicated the intermetallic compound ($Cu_6Sn_5$) regardless of solder composition. The type and thickness of IMC was not significantly changed after the vibration test. It indicates that no thermal activities occurred significantly during vibration. Furthermore, as a function of alloying composition, the vibration crack path was investigated with a focus on the IMCs. Vibration crack was initiated from the fillet surface of the heel for QFP parts and from the plating layer of chip parts. Regardless of the solder composition, the crack during a vibration test was propagated as same as that during a thermal fatigue test.

• Journal of the Korean BIBLIA Society for library and Information Science
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• v.22 no.1
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• pp.117-133
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• 2011

This research looks into the theory and practice of interconnections that exist between information literacy instruction(ILI) and writing instruction to gain further insights related to the development and forming of Korean ILI program. First of all, as evidenced by the ambiguity and various concepts that are possessed by the information literacy, this paper clearly indicates that the ILI cannot be achieved with a standardized set of guidelines across the board. And then, after investigating into the theories which deal mainly with the relativity to writing amongst the various ILI programs, this paper introduces precedents of Utah University, USA and Windsor University, Canada which have carried out writing instruction by actually connecting it with the ILI. Finally, this paper sounds out the possibility of connections or cooperation between writing and ILI within the scope of the Korean situation and suggests alternatives.

• Journal of the Korea Institute of Information and Communication Engineering
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• v.19 no.6
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• pp.1499-1505
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• 2015

This study is about the patent information analysis of relevant companies and technologies based on International Patent Classification (IPC) code. 902 patent applications in the field of electronic commerce(G06Q) by NAVER, the biggest internet company in Korea, are the subjects of this study. First, we investigated the number of applications and registrations per IPC code so that we could analyze the core technology areas and the status of patent application. In addition, we examined the convergence of technologies by investigating interconnections between main and sub categories of IPC codes. Lastly, we looked into the changes in patent technologies by investigating the status of application per IPC code in accordance with year. By analyzing the IPC code based patent information used in this study, we could further expect the trends of companies and technologies.

• The Journal of the Korea Contents Association
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• v.9 no.1
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• pp.89-97
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• 2009

The use of database system in application increases day by day. This brought out the DBMS interconnection access problem with rapid increase of the user. To solve these database connection problem, database connection pool has been presented. However, there is much to be desired on user's interconnection access. To improve previous connection pool architecture, we have designed the sub connection pool besides main connection pool in this paper. We defined connection pool broker to manage both main and sub connection pool connection. When main connection pool reached its limitation, connection pool broker transfers a connection from a main connection pool to a sub connection pool. When the interconnection access user increased rapidly, we have proved that the suggested sub pool architecture is more effective on response time by comparing it with other existing DBMS connection pool architectures using simulation.

• Proceedings of the Korean Institute of Information and Commucation Sciences Conference
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• 2000.10a
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• pp.499-503
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• 2000

The use of Multiple-Valued FFT(Fast fourier Transform) is extended from binary to multiple-valued logic(MVL) circuits. A multiple-valued FFT circuit can be implemented using current-mode CMOS techniques, reducing the transitor, wires count between devices to half compared to that of a binary implementation. For adder processing in FFT, We give the number representation using such redundant digit sets are called redundant positive-digit number representation and a Redundant set uses the carry-propagation-free addition method. As the designed Multiple-valued FFT internally using PD(positive digit) adder with the digit set 0,1,2,3 has attractive features on speed, regularity of the structure and reduced complexities of active elements and interconnections. for the mutiplier processing, we give Multiple-valued LUT(Look up table)to facilitate simple mathmatical operations on the stored digits. Finally, Multiple-valued 8point FFT operation is used as an example in this paper to illuatrates how a multiple-valued FFT can be beneficial.

• Polymer(Korea)
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• v.25 no.3
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• pp.318-326
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• 2001

PLLA scaffold loaded with gentamicin sulfate (GS) was prepared by emulsion freeze-drying method for the prevention of infection and the improvement of wettability. i.e., the cell- and tissue-compatibility. GS-loaded PLLA scaffolds were characterized by scanning electron microscopy (SEM), mercury porosimetry and blue dye intrusion, and the GS release pattern was analyzed by high performance liquid chromatography (HPLC). GS-loaded PLLA scaffolds with porosity above 50%, medium pore size ranging from 30 to 57 ${\mu}{\textrm}{m}$ (with larger pore diameters greater than 150 ${\mu}{\textrm}{m}$), and specific pore area in the range of 35 to 75($m^2$ /g )were manufactured by varying processing parameter as GS concentration. It was observed that GS-loaded PLLA scaffolds were highly porous with good interconnections between pores for allowing cell adhesion and growth. These scaffolds may be applicable for scaffold as structures that facilitate either tissue regeneration or repair during reconstructive operations.

• Journal of the Korean Vacuum Society
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• v.4 no.2
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• pp.217-223
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• 1995

절연보호막에 따른 AI-1%Si 박막배선의 평균수명(MTF, Mean-Time-to-Failure) 및 electromigration에 대한 저항성, 즉 활성화에너지(Q)변화 등을 측정 비교하였다. 박막배선은 $5000\AA$두께로 열산화막 처리된 p-Si(100)기판위에 $7000\AA$의 AI-1%Si을 증착한 후 photolithography 공정으로 형성시켰다. Electromigration test를 위한 박막배선은 $3\mu$m의 폭과 $400\mu$m, $1600\mu$m의 두 가지 길이를 가지며 절연보호막 효과를 알아보기 위해 그 위에 $3000\AA$의 두께로 SiO2, PSG, Si3N4등 절연보호막을 APCVD 및 PECVD를 이용하여 각각 증착시켰다. 가속화 실험을 위해 인가된 전류밀도는 4.5X106A/cm2이었고 180, 210, $240^{\circ}C$온도에서 d.c. 인가 후의 저항변화를 측정하여 평균수명을 구한 후 Black 방정식을 이용하여 활성화에너지를 측정하였다. AI-1%Si 박막배선에서 electromigration에 대한 활성화에너지값은 $400\mu$m길이의 경우 0.44eV(nonpassivated), 0.45eV(Si3N4 passivated), 0.50 eV(PSG passivated), 그리고 0.66 eV(SiO2 passivated)로 각각 측정되었다. $1600\mu$m 길이의 AI-1%Si 박막배선 실험에서도 같은 절연보호막 효과가 관찰되었다. 따라서 SiO2, PSG, Si3N4등 절연보호막은 AI-1%Si 박막배선에서의 electromigration에 대한 저항력을 높여 결함방지효과를 보이며 수명을 향상시킨다. SiO2의 절연보호막의 경우가 AI-1%Si 박막배선의 electromigration에 대한 가장 강한 저항력을 보이며 평균수명도 높게 나타났다.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.37 no.2
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• pp.65-77
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• 2000

We propose a new formulation by quadratic boolean programming to partition circuits for FPGA based reconfigurable circuit boards, in which the routing topology among IC chips are predetermined. The formulation is to minimize the sum of the wire length by considering the nets passing through IC chips for the interconnections between chips which are not adjacent, in addition to the constraints considered by the previous partition methods. We also describe a heuristic method, which consist of module assignment method to efficiently solve the problem. Experimental results show that our method generates the partitions in which the given constraints are all satisfied for all the benchmark circuits tested. The pin utilization are reduced for the most of the circuits and the total wire length of the routed nets are improved up to 34.7% compared to the previous method.

• Journal of the Microelectronics and Packaging Society
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• v.22 no.1
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• pp.35-41
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• 2015

In this study, in order to improve the reliability of ACF interconnections, solder ACF joints were investigated interms of solder joint morphology and solder wetting areas, and evaluated the electrical properties of Flex-on-Board (FOB) interconncections. Solder ACF joints with the ultrasonic bonding method showed excellent solder wetting by broken solder oxide layers on solder surfaces compared with solder joints with remaining solder oxide layer bonded by the conventional thermo-compression (TC) bonding method. When higher target temperature was used, Sn58Bi solder joints showed concave shape due to lower degree of cure of resin at solder MP by higher heating rate. ACFs with epoxy resins and SAC305 solders showed lower degree of resin cure at solder MP due to the slow curing rate resulting in concave shaped solder joints. In terms of solder wetting area, solder ACFs with $25-32{\mu}m$ diameters and 30-40 wt% showed highest wetted solder areas. Solder ACF joints with the concave shape and the highest wetting area showed lower contact resistances and higher reliability in PCT results than conventional ACF joints. These results indicate that solder morphologies and wetting areas of solder ACF joints can be controlled by adjustment of bonding conditions and material properties of solder and polymer resin to improve reliability of ACF joints.

• International Journal of Highway Engineering
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• v.3 no.3 s.9
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• pp.135-146
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• 2001

This study focused on the investigation of compressive and flexural strengths development, and bond strength of latex modified concrete in order to validate the feasibility of application into concrete bridge deck overlay. Pull-out bond test was used for evaluating the bond strength of latex modified concrete to substrate. The main experimental variables were latex-cement ratio, surface preparation and moisture levels. The compressive strength of latex modified concrete decreased slightly and the flexural strength increased as the latex content increased from 5% to 20%. This might be due to the flexibility latex filled in voids and interconnections of hydrated cement and aggregates by a film of latex particles, respectively. In general, increasing the amount of latex will produce concrete with increased tensile and flexural strength and lower modulus of elasticity. Significant improvements in bond strength between new and existing concrete were achieved through the modification of the new concrete bridge deck overlay by latex polymers. The effect of surface preparation on bond of latex modified concrete to conventional concrete were significant at the conditions by sand paper and wire brush. A better bond could be achieved by rough surface rather than smooth. The saturated condition of surface is the most appropriate moisture level among the considered followed by dry condition and wet condition.