• Journal of information and communication convergence engineering
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• v.12 no.3
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• pp.186-192
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• 2014

Monolithic three-dimensional integrated chips (3D ICs) are an emerging technology that offers an integration density that is some orders of magnitude higher than the conventional through-silicon-via (TSV)-based 3D ICs. This is due to a sequential integration process that enables extremely small monolithic inter-tier vias (MIVs). For a monolithic 3D memory, we first explore the static random-access memory (SRAM) design. Next, for digital logic, we explore several design styles. The first is transistor-level, which is a design style unique to monolithic 3D ICs that are enabled by the ultra-high-density of MIVs. We also explore gate-level and block-level design styles, which are available for TSV-based 3D ICs. For each of these design styles, we present techniques to obtain the graphic database system (GDS) layouts, and perform a signoff-quality performance and power analysis. We also discuss various challenges facing monolithic 3D ICs, such as achieving 50% footprint reduction over two-dimensional (2D) ICs, routing congestion, power delivery network design, and thermal issues. Finally, we present design techniques to overcome these challenges.

• Journal of Advanced Navigation Technology
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• v.28 no.5
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• pp.632-639
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• 2024

In this paper, the analysis method and results of audio data through LVDS interface and data Acquisition of the intercom. Intercom uses LVDS interface to transmit/receive digital audio data between audio interface unit and intercom control panel and to data acquisition of audio signals. Data acquisition using LVDS interface is essential for downloading various audio signals interfaced to the intercom to a PC and performing data analysis on noise, audio qualitys, etc. To achieve this, hardware for audio data acquisition was configured in the intercom test equipment. As a result, individual analysis of intercom input/output audio signals before and after logic processing was possible, which was effective in deriving the cause of noise signals. In addition, by data acquisition on actual voice communication and audio signals in ac system integrated laboratory and an environment/ electromagnetic test, audio signal level measurements and frequency analysis were performed to debug noise signal removal and verify the audio quality of the intercom.